公开(公告)号：US20120153280A1

公开(公告)日：2012-06-21

申请号：US13041003

申请日：2011-03-04

申请人： Dae-Suk KIM ,  Jong-Chern LEE ,  Chul KIM

发明人： Dae-Suk KIM ,  Jong-Chern LEE ,  Chul KIM

IPC分类号： H01L23/52

CPC分类号： H01L22/34 ,  G01R31/2853 ,  G01R31/2884 ,  H01L23/481 ,  H01L24/05 ,  H01L2225/06544 ,  H01L2225/06596 ,  H01L2924/12032 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/00

摘要： An integrated circuit that detects whether a through silicon via has defects or not, at a wafer level. The integrated circuit includes a semiconductor substrate, a through silicon via configured to be formed in the semiconductor substrate to extend to a certain depth from the surface of the semiconductor substrate, an output pad, and a current path providing unit configured to provide a current, flowing between the semiconductor substrate and the through silicon via, to the output pad during a test mode.

摘要翻译： 在晶圆级别检测贯通硅通孔是否具有缺陷的集成电路。 集成电路包括：半导体衬底;通孔构造成形成在半导体衬底中以从半导体衬底的表面延伸到一定深度的通硅通孔，输出焊盘和电流通路提供单元，其被配置为提供电流， 在测试模式期间，在半导体衬底和贯穿硅通孔之间流动到输出焊盘。