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公开(公告)号:US20230197848A1
公开(公告)日:2023-06-22
申请号:US18112063
申请日:2023-02-21
申请人: Daedalus Prime LLC
CPC分类号: H01L29/7848 , H01L29/66568 , H01L29/1054 , H01L29/0673 , H01L29/32 , H01L29/66636 , H01L29/66795 , H01L29/785 , H01L29/1033 , H01L29/165
摘要: Methods of forming a strained channel device utilizing dislocations disposed in source/drain structures are described. Those methods and structures may include forming a thin silicon germanium material in a source/drain opening of a device comprising silicon, wherein multiple dislocations are formed in the silicon germanium material. A source/drain material may be formed on the thin silicon germanium material, wherein the dislocations induce a tensile strain in a channel region of the device.
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公开(公告)号:US20230006063A1
公开(公告)日:2023-01-05
申请号:US17941814
申请日:2022-09-09
申请人: Daedalus Prime LLC
摘要: Methods of forming a strained channel device utilizing dislocations disposed in source/drain structures are described. Those methods and structures may include forming a thin silicon germanium material in a source/drain opening of a device comprising silicon, wherein multiple dislocations are formed in the silicon germanium material. A source/drain material may be formed on the thin silicon germanium material, wherein the dislocations induce a tensile strain in a channel region of the device.
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公开(公告)号:US11610995B2
公开(公告)日:2023-03-21
申请号:US17941814
申请日:2022-09-09
申请人: Daedalus Prime LLC
摘要: Methods of forming a strained channel device utilizing dislocations disposed in source/drain structures are described. Those methods and structures may include forming a thin silicon germanium material in a source/drain opening of a device comprising silicon, wherein multiple dislocations are formed in the silicon germanium material. A source/drain material may be formed on the thin silicon germanium material, wherein the dislocations induce a tensile strain in a channel region of the device.
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公开(公告)号:US11482618B2
公开(公告)日:2022-10-25
申请号:US17723582
申请日:2022-04-19
申请人: Daedalus Prime LLC
IPC分类号: H01L21/336 , H01L29/78 , H01L29/66 , H01L29/10 , H01L29/06 , H01L29/32 , H01L29/165
摘要: Methods of forming a strained channel device utilizing dislocations disposed in source/drain structures are described. Those methods and structures may include forming a thin silicon germanium material in a source/drain opening of a device comprising silicon, wherein multiple dislocations are formed in the silicon germanium material. A source/drain material may be formed on the thin silicon germanium material, wherein the dislocations induce a tensile strain in a channel region of the device.
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