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    Metal nanoparticle dispersion usable for ejection in the form of fine droplets to be applied in the layered shape
    2.
    发明申请
    Metal nanoparticle dispersion usable for ejection in the form of fine droplets to be applied in the layered shape 有权
    金属纳米粒子分散体可用于以层状形式施加的微小液滴形式的喷射

    公开(公告)号：US20070098883A1

    公开(公告)日：2007-05-03

    申请号：US10571507

    申请日：2004-09-10

    申请人： Daisuke Itoh ,  Akihito Izumitani ,  Noriaki Hata ,  Yorishige Matsuba ,  Kazuhiro Murata ,  Hiroshi Yokoyama

    发明人： Daisuke Itoh ,  Akihito Izumitani ,  Noriaki Hata ,  Yorishige Matsuba ,  Kazuhiro Murata ,  Hiroshi Yokoyama

    IPC分类号： B05D1/12

    CPC分类号： H05K3/125 ,  C09D5/24 ,  C09D17/006 ,  H01B1/02 ,  H01B1/22 ,  H05K2201/0257 ,  H05K2203/013

    摘要： The present invention provides a dispersion usable for forming an electroconductive layer having an extremely fine pattern and a high thickness/minimum width ratio in the cross-section, and which has a high fluidity enabling application of inkjet to draw a fine pattern at high accuracy and contains only metal nanoparticles as a conductive medium. According to the present invention, a metal nanoparticle dispersion suitable to multiple layered coating by jetting in the form of fine droplets is prepared by dispersing metal nanoparticles having an average particle size of 1 to 100 nm in a dispersion solvent having a boiling point of 80° C. or higher in such a manner that the volume percentage of the dispersion solvent is selected in the range of 55 to 80% by volume and the fluid viscosity (20° C.) of the dispersion is chosen in the range of 2 mPa·s to 30 mPa·s, and then when the dispersion is discharged in the form of fine droplets by inkjet method or the like, the dispersion is concentrated by evaporation of the dispersion solvent in the droplets in the course of flight, coming to be a viscous dispersion which can be applicable to multi-layered coating.

    摘要翻译： 本发明提供了一种可用于形成横截面具有极细图案和高厚度/最小宽度比的导电层的分散体，并且具有高流动性，能够应用喷墨以高精度绘制精细图案， 仅含有金属纳米粒子作为导电介质。 根据本发明，通过将平均粒度为1〜100nm的金属纳米粒子分散在沸点为80℃的分散溶剂中，制备适用于多层涂层的金属纳米粒子分散体， C以上，分散溶剂的体积百分比在55〜80体积％的范围内选择，分散体的流体粘度（20℃）选择在2mPa的范围内。 s至30mPa.s，然后当通过喷墨法等以微细液滴的形式将分散体排出时，通过在飞行中蒸发分散溶剂在液滴中浓缩分散体，成为 粘性分散体，可应用于多层涂料。

    Method for forming fine copper particle sintered product type of electric conductor having fine shape, method for forming fine copper wiring and thin copper film using said method
    4.
    发明申请
    Method for forming fine copper particle sintered product type of electric conductor having fine shape, method for forming fine copper wiring and thin copper film using said method 有权
    形成细铜颗粒烧结产品的方法，具有精细形状的导电体形成方法，使用所述方法形成细铜布线和薄铜膜的方法

    公开(公告)号：US20060210705A1

    公开(公告)日：2006-09-21

    申请号：US10556871

    申请日：2004-05-13

    申请人： Daisuke Itoh ,  Akihito Izumitani ,  Noriaki Hata ,  Yorishige Matsuba

    发明人： Daisuke Itoh ,  Akihito Izumitani ,  Noriaki Hata ,  Yorishige Matsuba

    IPC分类号： C23C26/00 ,  B05D3/02

    CPC分类号： H05K3/1283 ,  H01B1/22 ,  H05K3/102 ,  H05K3/105 ,  H05K2201/0257 ,  H05K2203/0315 ,  H05K2203/1131 ,  H05K2203/1157 ,  H05K2203/122

    摘要： The present invention provides a process for forming a copper fine particle sintered product type of a fine-shaped electric conductor showing superior electroconductivity, which comprises steps of drawing a fine pattern with the use of a dispersion containing the copper fine particles having a surface oxide film layer, conducting a treatment for reducing the copper fine particles with the surface oxide film layer or copper oxide fine particles included in the pattern at a comparatively low temperature, and baking the resultant copper fine particles. Specifically, the process carries out the processes of; applying a dispersion containing the copper fine particles having the surface oxide film layer thereon or the copper oxide fine particles with an average particle diameter of 10 μm or smaller onto a substrate; and then performing a series of the heat treatment steps of heating the particles in the coated layer at temperature of 350° C. or lower under an atmosphere containing a vapor and a gas of a compound having reducibility to reduce the oxide film by a reduction reaction which used the compound having reducibility as a reducing agent, subsequently repeating a heat treatment combining an oxidizing treatment of a short time with a re-reducing treatment, and sintering the resultant copper fine particles with each other to form a layer of the sintered product.

    摘要翻译： 本发明提供一种形成具有优异导电性的细微型导电体的铜微粒烧结体型的方法，该方法包括以下步骤：利用含有表面氧化膜的铜微粒的分散体 在比较低的温度下进行包含在图案中的表面氧化膜层或氧化铜微粒的铜微粒的还原处理，并烘烤得到的铜微粒。 具体来说，该过程执行过程; 将其上具有表面氧化膜层的铜微粒或平均粒径为10μm以下的氧化铜微粒分散在基板上; 然后进行一系列的热处理步骤，在含有还原性的化合物的气体和气体的气氛下，在350℃或更低的温度下加热涂层中的颗粒，以通过还原反应来还原氧化膜 其使用具有还原性的化合物作为还原剂，随后重复进行短时间的氧化处理与再还原处理的热处理，并将所得铜微粒彼此烧结以形成烧结产品层。

    Method for forming fine copper particle sintered product type of electric conductor having fine shape, and process for forming copper fine wiring and thin copper film by applying said method
    5.
    发明授权
    Method for forming fine copper particle sintered product type of electric conductor having fine shape, and process for forming copper fine wiring and thin copper film by applying said method 有权
    用于形成细铜粒微粒烧结产品的细形状导体的方法以及通过应用所述方法形成铜精细布线和薄铜膜的工艺

    公开(公告)号：US07820232B2

    公开(公告)日：2010-10-26

    申请号：US10556871

    申请日：2004-05-13

    申请人： Daisuke Itoh ,  Akihito Izumitani ,  Noriaki Hata ,  Yorishige Matsuba

    发明人： Daisuke Itoh ,  Akihito Izumitani ,  Noriaki Hata ,  Yorishige Matsuba

    IPC分类号： C23C26/00 ,  B05D3/02

    CPC分类号： H05K3/1283 ,  H01B1/22 ,  H05K3/102 ,  H05K3/105 ,  H05K2201/0257 ,  H05K2203/0315 ,  H05K2203/1131 ,  H05K2203/1157 ,  H05K2203/122

    摘要： The present invention provides a process for forming a copper fine particle sintered product type of a fine-shaped electric conductor showing superior electroconductivity, which comprises steps of drawing a fine pattern with the use of a dispersion containing the copper fine particles having a surface oxide film layer, conducting a treatment for reducing the copper fine particles with the surface oxide film layer or copper oxide fine particles included in the pattern at a comparatively low temperature, and baking the resultant copper fine particles. Specifically, the process carries out the processes of; applying a dispersion containing the copper fine particles having the surface oxide film layer thereon or the copper oxide fine particles with an average particle diameter of 10 μm or smaller onto a substrate; and then performing a series of the heat treatment steps of heating the particles in the coated layer at temperature of 350° C. or lower under an atmosphere containing a vapor and a gas of a compound having reducibility to reduce the oxide film by a reduction reaction which used the compound having reducibility as a reducing agent, subsequently repeating a heat treatment combining an oxidizing treatment of a short time with a re-reducing treatment, and sintering the resultant copper fine particles with each other to form a layer of the sintered product.

    摘要翻译： 本发明提供一种形成具有优异导电性的细微型导电体的铜微粒烧结体型的方法，该方法包括以下步骤：利用含有表面氧化膜的铜微粒的分散体 在比较低的温度下进行包含在图案中的表面氧化膜层或氧化铜微粒的铜微粒的还原处理，并烘烤得到的铜微粒。 具体来说，该过程执行过程; 将其上具有表面氧化膜层的铜微粒或平均粒径为10μm以下的氧化铜微粒分散在基板上; 然后进行一系列的热处理步骤，在含有还原性的化合物的气体和气体的气氛下，在350℃或更低的温度下加热涂层中的颗粒，以通过还原反应来还原氧化膜 其使用具有还原性的化合物作为还原剂，随后重复进行短时间的氧化处理与再还原处理的热处理，并将所得铜微粒彼此烧结以形成烧结产品层。