Template type cavity-formation device for low temperature cofired
ceramic (LTCC) sheets
    4.
    发明授权
    Template type cavity-formation device for low temperature cofired ceramic (LTCC) sheets 失效
    用于低温共烧陶瓷(LTCC)片材的模板型腔形成装置

    公开(公告)号:US5855803A

    公开(公告)日:1999-01-05

    申请号:US752111

    申请日:1996-11-20

    摘要: A cavity pattern for a laminated structure such as a substrate for integrated circuitry is formed in a sheet of unfired low temperature cofired ceramic (LTCC) material also known as "green" tape. One sheet at a time is placed in a flexible ram forming die including a resilient rubber pressure pad and a template including the pattern to be formed in the sheet. A pair of outer pressure plates hold the pressure pad and template in place. When a sheet of unfired LTCC material is placed between the pressure pad and template and pressurization is applied to the outer plates, extrusion of the rubber material through the template causes the tape to be sheared off at the edges of the holes in the template, thus effectively cutting the required pattern in the sheet. Following pressurization, the sheet now with the pattern cut therein is removed from the die and the residual tape cut-outs are subsequently removed from the template by a vacuum.

    摘要翻译: 用于层叠结构的空腔图案,例如用于集成电路的基板,形成在未烧制的低温共烧陶瓷(LTCC)材料片材中,也称为“绿色”带。 一次一片地放置在包括弹性橡胶压力垫的柔性冲头成型模具和包含要在板材中形成的图案的模板上。 一对外压板将压力垫和模板固定在适当位置。 当将一片未烧的LTCC材料放置在压垫和模板之间,并且对外板施加加压时,橡胶材料通过模板的挤出使得带在模板中的孔的边缘处被剪切,因此 有效地切割片材中所需的图案。 在加压之后,现在将其中切割的图案从模具中取出,然后通过真空从模板中除去残留的带切口。

    PLATING OF BRAZED RF CONNECTORS FOR T/R MODULES
    5.
    发明申请
    PLATING OF BRAZED RF CONNECTORS FOR T/R MODULES 失效
    用于T / R模块的BRAZED射频连接器的放置

    公开(公告)号:US20060003642A1

    公开(公告)日:2006-01-05

    申请号:US10879042

    申请日:2004-06-30

    IPC分类号: H01R13/73

    CPC分类号: H01R24/50 H01R13/03

    摘要: Slots or apertures are formed in the connector shroud of a T/R module in a plane perpendicular to the axis of the connector so as to allow plating solution to flow freely through the entire inner portion of the connector, particularly the rear portion, during fabrication of the T/R module. The slots are formed prior to the shroud being brazed on to the module substrate. By allowing plating solution to flow through the connector, the interior of the connector can be more thoroughly plated, thereby improving the yield of the assembly while reducing cost.

    摘要翻译: 在垂直于连接器的轴线的平面中,在T / R模块的连接器护罩中形成槽或孔,以便在制造过程中允许电镀液自由地流过连接器的整个内部,特别是后部 的T / R模块。 在将护罩钎焊到模块基板之前形成槽。 通过允许电镀溶液流过连接器,连接器的内部可以更彻底地镀覆,从而在降低成本的同时提高组件的产量。