公开(公告)号：US20050241128A1

公开(公告)日：2005-11-03

申请号：US10922850

申请日：2004-08-23

申请人： Cynthia Berry ,  Alex Bailey

发明人： Cynthia Berry ,  Alex Bailey

IPC分类号： H01G7/00 ,  H01L21/48 ,  H01M8/12 ,  H05K1/03 ,  H05K1/18 ,  H05K3/46

CPC分类号： H01M8/12 ,  H01L21/481 ,  H05K1/0306 ,  H05K1/183 ,  H05K3/4629 ,  H05K3/4697 ,  H05K2203/061 ,  H05K2203/063 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/49126 ,  Y10T156/1062

摘要： A method of forming an LTCC structure having at least one open cavity on each of first and second opposing sides is disclosed that includes the steps of forming a first LTCC structure including a first side having a plurality of cavities and a second side, subjecting the first LTCC structure to a first pressure, forming a second LTCC structure including a first side having a plurality of cavities and a second side, subjecting the second LTCC structure to a second pressure, arranging the first LTCC structure and the second LTCC structure such that the first LTCC structure second side faces the second LTCC structure second side, and subjecting the placed-together first and second LTCC structures to a third pressure to join the first LTCC structure to the second LTCC structure. A product formed by the subject method is also disclosed.

摘要翻译： 公开了一种在第一和第二相对侧的每一个上形成具有至少一个开放空腔的LTCC结构的方法，其包括形成第一LTCC结构的步骤，所述第一LTCC结构包括具有多个腔和第二侧的第一侧， LTCC结构形成第一压力，形成包括具有多个空腔的第一侧和第二侧的第二LTCC结构，使第二LTCC结构受到第二压力，将第一LTCC结构和第二LTCC结构布置成使得第一 LTCC结构第二面朝向第二LTCC结构第二面，并且将放置在一起的第一和第二LTCC结构施加到第三压力以将第一LTCC结构连接到第二LTCC结构。 还公开了通过本发明方法形成的产品。

公开(公告)号：US20050205195A1

公开(公告)日：2005-09-22

申请号：US10802746

申请日：2004-03-18

申请人： Cynthia Berry ,  Alex Bailey ,  Robert Fisher ,  Tapan Gupta ,  Daniel Brosey ,  Steve Smalley ,  William Thomas

发明人： Cynthia Berry ,  Alex Bailey ,  Robert Fisher ,  Tapan Gupta ,  Daniel Brosey ,  Steve Smalley ,  William Thomas

IPC分类号： C03B29/00 ,  H01L21/48 ,  H01L23/495 ,  H05K1/09 ,  H05K3/24

CPC分类号： H05K3/248 ,  H01L21/4867 ,  H05K1/092 ,  H05K3/1291 ,  H05K2201/035 ,  H05K2203/1126 ,  H05K2203/1476 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49163

摘要： An LTCC module includes a base on one or more surfaces for receiving one or more external components to be attached to the module. A base is formed of a plurality of layers of metallization in a predetermined pattern. The layers include an adhesion layer on the LTCC module surface, with one or more intermediate layers, followed by a top layer. The module is fired with each application of the layers at a reduced temperature lower than the normal cofiring temperature of the LTCC module, but of sufficient value to partially sinter the layers. After the last applied top layer, the module is fired once at an elevated temperature to fully sinter the layers.

摘要翻译： LTCC模块包括在一个或多个表面上的基座，用于接收要连接到模块的一个或多个外部组件。 基底由预定图案的多层金属化形成。 这些层包括在LTCC模块表面上的粘附层，具有一个或多个中间层，随后是顶层。 在低于LTCC模块的正常共烧温度的降低温度下，每层施加该模块，但具有足够的值以部分地烧结层。 在最后施加的顶层之后，模块在升高的温度下被烧一次以完全烧结层。

公开(公告)号：US20050189630A1

公开(公告)日：2005-09-01

申请号：US10786125

申请日：2004-02-26

申请人： Cynthia Berry ,  Alex Bailey

发明人： Cynthia Berry ,  Alex Bailey

IPC分类号： H01L23/02 ,  H01L23/13 ,  H01L23/498 ,  H05K1/09 ,  H05K1/18 ,  H05K3/24 ,  H05K3/32

CPC分类号： H01L23/49883 ,  H01L23/13 ,  H01L23/49833 ,  H01L2224/73265 ,  H01L2924/09701 ,  H05K1/092 ,  H05K1/182 ,  H05K3/248 ,  H05K3/328 ,  H05K2201/035 ,  H05K2203/049 ,  Y10T29/49018 ,  Y10T29/49078 ,  Y10T29/49155

摘要： An LTCC (low temperature cofired ceramic) structure which has conductors to which leads are to be bonded for connection to external circuitry. The conductors include additives to promote adhesion to the ceramic layer. The presence of these additives degrade bonding performance. For better bondability of the leads, a pure conductor metal layer, devoid of the additives is placed on the conductors in areas where leads are to be bonded. This pure conductor metal layer may be cofired with the stack of ceramic layers or may be post fired after stack firing.

摘要翻译： LTCC（低温共烧陶瓷）结构，其具有用于连接到外部电路的引线的导体。 导体包括用于促进与陶瓷层的粘附的添加剂。 这些添加剂的存在降低了粘合性能。 为了使引线具有更好的粘合性，在引线要被接合的区域中的导体上放置没有添加剂的纯导体金属层。 该纯导体金属层可以与陶瓷层的堆叠共烧，或者可以在堆叠烧制之后进行烧制。

公开(公告)号：US20050156689A1

公开(公告)日：2005-07-21

申请号：US10758095

申请日：2004-01-16

申请人： Michael Hageman ,  Cynthia Berry

发明人： Michael Hageman ,  Cynthia Berry

IPC分类号： H01P1/20 ,  H01P1/207 ,  H01P1/208 ,  H01P11/00

CPC分类号： H01P1/20 ,  H01P1/207 ,  H01P1/2088 ,  H01P11/007

摘要： A method of tuning the frequency response of filters embedded in or formed on a ceramic substrate, such as but not limited to a low temperature co-fired ceramic substrate (LTCC), by re-firing a previously fired LTCC substrate to a temperature which is greater by a predetermined, relatively small, amount than that of the temperature produced during the original firing profile of the substrate so as to change the dielectric constant of the substrate, and thus cause a desired shift in the filter's frequency response.

摘要翻译： 通过将先前烧制的LTCC衬底重新烧结到温度为（℃）的温度，调节嵌入或形成在陶瓷衬底（例如但不限于低温共烧陶瓷衬底（LTCC））上的滤波器的频率响应的方法， 比基板的原始焙烧曲线期间产生的温度预定的相对小的量更大，以便改变基板的介电常数，从而导致滤波器的频率响应的期望的偏移。

公开(公告)号：US20060236533A1

公开(公告)日：2006-10-26

申请号：US11450417

申请日：2006-06-12

申请人： Cynthia Berry ,  Alex Bailey

发明人： Cynthia Berry ,  Alex Bailey

IPC分类号： H05K3/10 ,  H05K3/02

CPC分类号： H01L23/49883 ,  H01L23/13 ,  H01L23/49833 ,  H01L2224/73265 ,  H01L2924/09701 ,  H05K1/092 ,  H05K1/182 ,  H05K3/248 ,  H05K3/328 ,  H05K2201/035 ,  H05K2203/049 ,  Y10T29/49018 ,  Y10T29/49078 ,  Y10T29/49155

摘要： An LTCC (low temperature cofired ceramic) structure which has conductors to which leads are to be bonded for connection to external circuitry. The conductors include additives to promote adhesion to the ceramic layer. The presence of these additives degrade bonding performance. For better bondability of the leads, a pure conductor metal layer, devoid of the additives is placed on the conductors in areas where leads are to be bonded. This pure conductor metal layer may be cofired with the stack of ceramic layers or may be post fired after stack firing.

摘要翻译： LTCC（低温共烧陶瓷）结构，其具有用于连接到外部电路的引线的导体。 导体包括用于促进与陶瓷层的粘附的添加剂。 这些添加剂的存在降低了粘合性能。 为了使引线具有更好的粘合性，在引线要接合的区域中的导体上放置没有添加剂的纯导体金属层。 该纯导体金属层可以与陶瓷层的堆叠共烧，或者可以在堆叠烧制之后进行烧制。