-
公开(公告)号：US06671172B2
公开(公告)日：2003-12-30
申请号：US09950100
申请日：2001-09-10
IPC分类号： H05K720
CPC分类号： H01L23/3672 , H01L23/467 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： An electronic assembly comprising one or more high performance integrated circuits includes at least one high capacity heat sink. The heat sink, which comprises a number of fins projecting substantially radially from a core, is structured to capture air from a fan and to direct the air to optimize heat transfer from the heat sink. The heat sink fins can be formed in different shapes. In one embodiment, the fins are curved. In another embodiment, the fins are bent. In yet another embodiment, the fins are curved and bent. Methods of fabricating heat sinks and electronic assemblies, as well as application of the heat sink to an electronic assembly and to an electronic system, are also described.
摘要翻译： 包括一个或多个高性能集成电路的电子组件包括至少一个高容量散热器。 散热器包括从芯部大体上径向突出的多个翅片，其被构造成从风扇捕获空气并引导空气以优化从散热器的热传递。 散热片可以形成为不同的形状。 在一个实施例中，翅片是弯曲的。 在另一个实施例中，翅片弯曲。 在另一个实施例中，翅片弯曲并弯曲。 还描述了制造散热器和电子组件的方法，以及将散热器应用于电子组件和电子系统。
-
2.发明授权Electronic assemblies with high capacity heat sinks and methods of manufacture 有权具有高容量散热器的电子组件和制造方法公开(公告)号：US07200934B2
公开(公告)日：2007-04-10
申请号：US10656968
申请日：2003-09-05
CPC分类号： H01L23/3672 , H01L23/467 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： An electronic assembly comprising one or more high performance integrated circuits includes at least one high capacity heat sink. The heat sink, which comprises a number of fins projecting substantially radially from a core, is structured to capture air from a fan and to direct the air to optimize heat transfer from the heat sink. The heat sink fins can be formed in different shapes. In one embodiment, the fins are curved. In another embodiment, the fins are bent. In yet another embodiment, the fins are curved and bent. Methods of fabricating heat sinks and electronic assemblies, as well as application of the heat sink to an electronic assembly and to an electronic system, are also described.
摘要翻译： 包括一个或多个高性能集成电路的电子组件包括至少一个高容量散热器。 散热器包括从芯部大体上径向突出的多个翅片，其被构造成从风扇捕获空气并引导空气以优化从散热器的热传递。 散热片可以形成为不同的形状。 在一个实施例中，翅片是弯曲的。 在另一个实施例中，翅片弯曲。 在另一个实施例中，翅片弯曲并弯曲。 还描述了制造散热器和电子组件的方法，以及将散热器应用于电子组件和电子系统。
-
公开(公告)号：US06657862B2
公开(公告)日：2003-12-02
申请号：US09950101
申请日：2001-09-10
IPC分类号： H05K720
CPC分类号： H01L23/3672 , F21V29/773 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： Non-prismatic radial folded fin heat sinks include fin arrays comprised of folded fins joined to a thermally conductive central core. The fin arrays can have either a constant or variable bend radius. The non-prismatic radial folded fins can be made by stamping patterns into sheet metal prior to folding the sheet metal in opposite directions at various intervals to form outer and inner folds. By arranging the fins in a non-prismatic radial pattern around the central core, airflow generated by an overhead fan is better utilized, thus improving the cooling effect of the device.
-
公开(公告)号：US08205666B2
公开(公告)日：2012-06-26
申请号：US12761152
申请日：2010-04-15
CPC分类号： F28F3/022 , B21C23/10 , B21C23/14 , B23P2700/10 , F28F13/00 , H01L23/467 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： A heat sink (and method of forming a heat sink) is provided that includes a core having a central axis and a plurality of cooling fins arranged about the core. Each fin has a base and a tip. The fins may be shaped to capture a tangential component of air from the fan. At least one portion (such as upper portion) of the fins may be bent. A lower portion of each fin may also be bent.
摘要翻译： 提供了散热器（以及形成散热器的方法），其包括具有中心轴线的芯部和围绕芯部布置的多个散热片。 每个翅片都有一个基座和一个尖端。 翅片可以被成形为从风扇捕获空气的切向分量。 翅片的至少一部分（例如上部）可以弯曲。 每个翅片的下部也可以弯曲。
-
公开(公告)号：US07543457B2
公开(公告)日：2009-06-09
申请号：US11170427
申请日：2005-06-29
IPC分类号： F25D23/02
CPC分类号： H01L23/473 , F04D29/588 , H01L2924/0002 , H01L2924/00
摘要： According to some embodiments, systems for an integrated pump and reservoir may be provided. In some embodiments, a pump may comprise a housing defining an inlet to accept a fluid and an outlet to evacuate the fluid, an impeller disposed within the housing, wherein the impeller is to move the fluid toward the outlet, a motor to power the impeller, a reservoir hydraulically coupled to the inlet, and a cold plate disposed at least partially within the housing.
摘要翻译： 根据一些实施例，可以提供用于集成泵和储存器的系统。 在一些实施例中，泵可以包括限定入口以接收流体的外壳和排出流体的出口，设置在壳体内的叶轮，其中叶轮将流体朝向出口移动，电动机为叶轮供电 液压耦合到入口的储液器，以及至少部分地设置在壳体内的冷板。
-
6.发明授权Electronic assemblies with high capacity curved and bent fin heat sinks and associated methods 有权具有高容量弯曲和弯曲翅片散热器的电子组件及相关方法公开(公告)号：US07911790B2
公开(公告)日：2011-03-22
申请号：US11209414
申请日：2005-08-23
CPC分类号： H01L23/3672 , H01L23/467 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： An electronic assembly comprising one or more high performance integrated circuits includes at least one high capacity heat sink. The heat sink, which comprises a number of fins projecting substantially radially from a core, is structured to capture air from a fan and to direct the air to optimize heat transfer from the heat sink. The heat sink fins can be formed in different shapes. In one embodiment, the fins are curved. In another embodiment, the fins are bent. In yet another embodiment, the fins are curved and bent. Methods of fabricating heat sinks and electronic assemblies, as well as application of the heat sink to an electronic assembly and to an electronic system, are also described.
摘要翻译： 包括一个或多个高性能集成电路的电子组件包括至少一个高容量散热器。 散热器包括从芯部大体上径向突出的多个翅片，其被构造成从风扇捕获空气并引导空气以优化从散热器的热传递。 散热片可以形成为不同的形状。 在一个实施例中，翅片是弯曲的。 在另一个实施例中，翅片弯曲。 在另一个实施例中，翅片弯曲并弯曲。 还描述了制造散热器和电子组件的方法，以及将散热器应用于电子组件和电子系统。
-
公开(公告)号：US20080282775A1
公开(公告)日：2008-11-20
申请号：US12180733
申请日：2008-07-28
CPC分类号： H05K7/20272 , G01M3/228 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： According to some embodiments, a test fluid may be provided into a chamber associated with a cooling system for an electronic integrated circuit. Moreover, a valve may be partially inserted into an opening of the chamber to seal the chamber. The valve may include a first sealing portion to seal the chamber at the opening when the valve shaft is inserted the first distance. The valve may then be inserted an intermediate distance, between the first distance and a second distance, to unseal the chamber. Note that the valve may include a second sealing portion, offset from the first sealing portion, to seal the chamber at the opening when the valve is inserted the second distance. The valve may further define a passage, between the first and second sealing portions, to permit a flow of the test fluid when the valve is inserted the intermediate distance.
摘要翻译： 根据一些实施例，可以将测试流体提供到与用于电子集成电路的冷却系统相关联的室中。 此外，阀可以部分地插入到腔室的开口中以密封腔室。 阀可以包括第一密封部分，以在阀轴插入第一距离时将腔室密封在开口处。 然后，阀可以在第一距离和第二距离之间插入中间距离以开启腔室。 注意，阀可以包括从第一密封部分偏移的第二密封部分，以在阀插入第二距离时将腔室密封在开口处。 阀可以进一步限定在第一和第二密封部分之间的通道，以允许当阀插入中间距离时测试流体的流动。
-
公开(公告)号：US07400503B2
公开(公告)日：2008-07-15
申请号：US11828373
申请日：2007-07-26
IPC分类号： H05K7/20
CPC分类号： F04D29/588 , H01L23/3672 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： According to some embodiments, systems for low cost coaxial liquid cooling may be provided. In some embodiments, a system may comprise an axis. The system may further comprise a heat exchanger coupled to a pump, wherein the heat exchanger and the pump are oriented with respect to the axis.
摘要翻译： 根据一些实施例，可以提供用于低成本同轴液体冷却的系统。 在一些实施例中，系统可以包括轴。 该系统还可以包括耦合到泵的热交换器，其中热交换器和泵相对于轴线定向。
-
公开(公告)号：US07430119B2
公开(公告)日：2008-09-30
申请号：US11540224
申请日：2006-09-29
CPC分类号： H01L23/467 , F04D13/12 , F04D25/16 , F04D29/445 , F04D29/586 , G06F1/20 , H01L2924/0002 , H01L2924/00
摘要： According to some embodiments, an apparatus may comprise a cold plate comprising a plurality of fins and an impeller comprising a plurality of blades. An output fluid velocity angle defined by the plurality of fins may be aligned to an impeller inlet velocity angle. The impeller inlet velocity angle may be based on an operational speed of the plurality of blades and an angle of the plurality of blades with respect to a center of the impeller.
-
公开(公告)号：US07273090B2
公开(公告)日：2007-09-25
申请号：US11170425
申请日：2005-06-29
IPC分类号： F28F7/00
CPC分类号： H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： According to some embodiments, systems for an integrated cold plate and heat exchanger may be provided. In some embodiments, a device may comprise a cold plate to transfer heat to a fluid and a heat spreader integral with the cold plate, the heat spreader to accept heat from an electronic device. In some embodiments, the heat spreader and the cold plate are monolithic.
-
-
-
-
-
-
-
-
-
搜索结果
23 条记录 (耗时 0.039 秒)
