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公开(公告)号：US06839972B2
公开(公告)日：2005-01-11
申请号：US10170401
申请日：2002-06-14
IPC分类号： G01B11/00 , G01B11/275 , G01C11/06 , H04N13/00
CPC分类号： G01B11/2755 , G01B11/002 , G01C11/06 , H04N13/239 , H04N13/243 , H04N13/246 , H04N2013/0081
摘要： A position determination system comprises a first measuring apparatus and a second measuring apparatus. The first measuring apparatus includes a first sensing device having a sensing field for obtaining positional data of a first testing target, a calibration target rigidly linked to the first sensing device, wherein the positional relationship between the first sensing device and the calibration target is known. The system has a repositioning mechanism for repositioning the sensing field of the first sensing device. The second measuring apparatus includes a second sensing device having a sensing field for obtaining positional data of a second testing target, a calibration sensing device rigidly linked to the second sensing device for obtaining positional data of the calibration target, wherein the positional relationship between the second sensing device and the calibration sensing device is known, and a repositioning mechanism for repositioning the sensing field of the second sensing device. Depending on different needs, the repositioning mechanism readjust the viewing fields of the sensing devices such that the testing targets are properly within the sensing fields of the sensing devices.
摘要翻译： 位置确定系统包括第一测量装置和第二测量装置。 第一测量装置包括具有用于获得第一测试目标的位置数据的感测场的第一感测装置，与第一感测装置刚性连接的校准目标，其中第一感测装置与校准目标之间的位置关系是已知的。 该系统具有用于重新定位第一感测装置的感测场的重新定位机构。 第二测量装置包括具有用于获得第二测试目标的位置数据的感测场的第二感测装置，刚性地链接到第二感测装置的校准感测装置，用于获得校准目标的位置数据，其中第二测量装置 感测装置和校准感测装置是已知的，以及用于重新定位第二感测装置的感测场的重新定位机构。 根据不同的需要，重新定位机构重新调整感测装置的观察区域，使得测试目标适当地在感测装置的感测场内。
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2.发明授权Self-calibrating 3D machine measuring system useful in motor vehicle wheel alignment 有权自动校准3D机器测量系统，用于汽车车轮定位公开(公告)号：US06731382B2
公开(公告)日：2004-05-04
申请号：US09928453
申请日：2001-08-14
申请人： David A. Jackson , Steven Glickman , Hoshang D. Shroff , Brian M. Bliven , Michael J. Kling, III
发明人： David A. Jackson , Steven Glickman , Hoshang D. Shroff , Brian M. Bliven , Michael J. Kling, III
IPC分类号： G01B1126
CPC分类号： G01B11/2755 , G01B2210/12 , G01B2210/143 , G01B2210/26 , G01B2210/30 , G01B2210/303
摘要： Techniques are disclosed for providing a system that has a plurality of devices in which the position of a device of the plurality of devices relative to another device of the plurality of devices is self-calibrated. In one embodiment, the system is a five-camera aligner for use in aligning motor vehicle wheels. In this embodiment, the aligner includes a first camera pod having two alignment cameras and a calibration camera, and a second camera pod having another two alignment cameras and a calibration target. Because the aligner has four alignment cameras and a calibration camera, the aligner is often referred to as a five-camera aligner. For illustration purposes, the first camera pod is herein referred to as the left camera pod and the second camera pod is herein referred to as the right camera pod. In one embodiment, the left camera pod is placed to the left of the aligner, and the right camera pod is placed to the right of the aligner. The two alignment cameras of the left camera pod focus at the two left wheels of the vehicle under alignment, while the two alignment cameras of the right camera pod focus at the two right wheels of the same vehicle. In addition, the calibration camera on the left pod focuses at the calibration target mounted in the right camera pod. In one embodiment, the relative positions of the elements (alignment camera, calibration camera, and calibration target) in each camera pod are pre-calibrated. Consequently, the aligner is fully calibrated when the position of the left camera pod to the right camera pod is measured. Further, the calibration camera is configured such that it periodically measures the position of the left camera pod relative to the right camera pod, rendering the aligner a self-calibrated aligner.
摘要翻译： 公开了用于提供具有多个设备的系统的技术，其中多个设备中的设备相对于多个设备中的另一设备的位置是自校准的。 在一个实施例中，该系统是用于对准机动车辆车轮的五摄像机对准器。 在该实施例中，对准器包括具有两个对准摄像机和校准摄像机的第一摄像机舱，以及具有另外两个对准摄像机和校准目标的第二摄像机舱。 由于对准器具有四个对准摄像机和校准摄像机，对准器通常被称为五摄像机对准器。 为了说明的目的，第一相机荚在本文中被称为左相机荚，并且第二相机荚在本文中被称为右相机荚。 在一个实施例中，左摄像机盒被放置在对准器的左侧，并且右摄像机盒被放置在对准器的右侧。 左摄像机舱的两个对准摄像机聚焦在对准的车辆的两个左轮，而右摄像机舱的两个对准摄像机聚焦在同一车辆的两个右轮上。 此外，左侧插座上的校准摄像机可将焦点放在安装在右侧摄像机盒中的校准目标上。 在一个实施例中，每个照相机盒中的元件（对准摄像机，校准摄像机和校准目标）的相对位置被预校准。 因此，当测量左摄像机荚的位置到正确的摄像机荚时，对准器被完全校准。 此外，校准相机被配置为使得其周期性地测量左摄像机盒相对于右摄像机盒的位置，使对准器成为自校准对准器。
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3.发明授权Edge roller assembly, method for contacting an edge of a substrate, and transport system for transporting semiconductor wafers to a wafer processing station 失效边缘辊组件，用于接触基板的边缘的方法以及用于将半导体晶片传送到晶片加工台的输送系统公开(公告)号：US06752162B1
公开(公告)日：2004-06-22
申请号：US09687747
申请日：2000-10-13
IPC分类号： B08B700
CPC分类号： H01L21/67706 , H01L21/67046 , H01L21/6776 , Y10S134/902
摘要： An edge roller assembly includes first and second grip rings. The grip rings are held together in an opposing relationship such that outer surfaces thereof define a groove for receiving an edge of a substrate. The grip rings may be O-rings formed of a rubber material. In one embodiment, the grip rings are held together by lower and upper clamp plates that are adjustably fastened together so that the clamping forces exerted on the substrate can be controlled. The upper clamp plate may have a height adjustment knob for adjusting the height of the edge roller assembly mounted thereon. A method for contacting an edge of a substrate and a transport system for transporting semiconductor wafers to a wafer processing station also are described.
摘要翻译： 边缘辊组件包括第一和第二夹环。 握持环以相对的关系保持在一起，使得其外表面限定用于接收基板的边缘的凹槽。 夹环可以是由橡胶材料形成的O形环。 在一个实施例中，夹环通过可调节地紧固在一起的下夹持板和上夹板保持在一起，使得可以控制施加在基底上的夹紧力。 上夹板可以具有用于调节安装在其上的边缘辊组件的高度的高度调节旋钮。 还描述了用于将基板的边缘和用于将半导体晶片传送到晶片加工台的输送系统接触的方法。
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4.发明授权Wafer scrubbing brush core having an internal motor and method of making the same 有权具有内部电动机的晶片擦洗刷芯及其制造方法公开(公告)号：US06557202B1
公开(公告)日：2003-05-06
申请号：US09454699
申请日：1999-12-03
IPC分类号： B08B1100
CPC分类号： H01L21/67046 , B08B1/04
摘要： A brush core and method of making a brush core are provided. The brush core is configured to be implemented in substrate preparation systems. The brush core is connected between a first end and a second end of a non-rotating shaft. A motor is contained within the brush core for rotating the brush core around the non-rotating shaft. The first end and the second end are each capable of being adjusted to calibrate and position the brush core. The calibrated position of the brush core can be set to compensate for a skewed substrate, or to achieve a desired pressure application profile over the substrate.
摘要翻译： 提供了刷芯和制造刷芯的方法。 刷芯被配置成在衬底制备系统中实现。 刷芯连接在非旋转轴的第一端和第二端之间。 电刷被容纳在电刷芯内，用于使刷芯围绕非旋转轴旋转。 第一端和第二端各自能够被调整以校准和定位刷芯。 刷芯的校准位置可以被设置为补偿偏斜的衬底，或者在衬底上实现期望的压力施加轮廓。
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5.发明授权Method for transferring wafers from a conveyor system to a wafer processing station 有权将晶片从传送系统传送到晶片处理台的方法公开(公告)号：US06439245B1
公开(公告)日：2002-08-27
申请号：US09608515
申请日：2000-06-30
申请人： Brian M. Bliven , Michael Ravkin
发明人： Brian M. Bliven , Michael Ravkin
IPC分类号： B08B704
CPC分类号： H01L21/67706 , H01L21/67046 , H01L21/6776 , Y10S134/902
摘要： A wheel for a conveyor system for transporting semiconductor wafers includes a first section for supporting a semiconductor wafer at a first level and a second section for supporting the wafer at a second level, with the first level being higher than the second level. In one embodiment, each of the first and second sections is semicircular. The first level may be substantially the same as a level at which the wafer is subjected to a wafer cleaning operation, and the distance the second level is below the first level may be in a range from about one sixteenth of an inch to about three sixteenths of an inch. A conveyor system for transporting wafers and a method for transferring wafers from a conveyor system to a wafer processing station also are described.
摘要翻译： 用于传送半导体晶片的传送系统的轮包括用于将第一级半导体晶片支撑的第一部分和用于将晶片支撑在第二级上的第二部分，其中第一级高于第二级。 在一个实施例中，第一和第二部分中的每一个是半圆形的。 第一级可以与晶片经历晶片清洁操作的水平基本相同，并且第二级别低于第一级的距离可以在从约十六分之一英寸到约三十六分之一的范围内 一英寸 还描述了用于传送晶片的传送系统和用于将晶片从传送系统传送到晶片处理台的方法。
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公开(公告)号：US06415804B1
公开(公告)日：2002-07-09
申请号：US09470676
申请日：1999-12-23
IPC分类号： B08B302
CPC分类号： H01L21/67017 , H01L21/67028 , Y10S134/902
摘要： A bowl includes a bottom wall having a generally circular shape. A sidewall extends upwardly from the bottom wall to define a cylindrical chamber. The sidewall has a projection that extends into the cylindrical chamber. The projection has a top surface that defines a step in the cylindrical chamber and a sloped surface that extends between the top surface and an inner surface of the sidewall. The top surface of the projection is sloped slightly downwardly. The sloped surface of the projection is oriented relative to the top surface such that extensions of the top surface and the sloped surface define an angle in a range from about 30 degrees to about 45 degrees. A spin, rinse, and dry module including the bowl and a method for loading a semiconductor wafer into a spin, rinse, and dry module also are described.
摘要翻译： 碗包括具有大致圆形形状的底壁。 侧壁从底壁向上延伸以限定圆柱形腔室。 侧壁具有延伸到圆柱形腔室中的突起。 突起具有限定圆柱形腔室中的台阶的顶表面和在顶壁和侧壁的内表面之间延伸的倾斜表面。 突起的顶部表面略微向下倾斜。 突起的倾斜表面相对于顶表面定向，使得顶表面和倾斜表面的延伸部分限定在约30度至约45度范围内的角度。 还描述了包括碗的旋转，冲洗和干燥模块以及将半导体晶片装载到旋转，冲洗和干燥模块中的方法。
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公开(公告)号：US06612315B2
公开(公告)日：2003-09-02
申请号：US10013198
申请日：2001-11-02
IPC分类号： B08B302
CPC分类号： H01L21/67017 , H01L21/67028 , Y10S134/902
摘要： A bowl includes a bottom wall having a generally circular shape. A sidewall extends upwardly from the bottom wall to define a cylindrical chamber. The sidewall has a projection that extends into the cylindrical chamber. The projection has a top surface that defines a step in the cylindrical chamber and a sloped surface that extends between the top surface and an inner surface of the sidewall. The top surface of the projection is sloped slightly downwardly. The sloped surface of the projection is oriented relative to the top surface such that extensions of the top surface and the sloped surface define an angle in a range from about 30 degrees to about 45 degrees. A spin, rinse, and dry module including the bowl and a method for loading a semiconductor wafer into a spin, rinse, and dry module also are described.
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公开(公告)号：US06607072B2
公开(公告)日：2003-08-19
申请号：US10193803
申请日：2002-07-11
申请人： Brian M. Bliven , Michael Ravkin
发明人： Brian M. Bliven , Michael Ravkin
IPC分类号： B65G1312
CPC分类号： H01L21/67706 , H01L21/67046 , H01L21/6776 , Y10S134/902
摘要： A wheel for a conveyor system for transporting semiconductor wafers includes a first section for supporting a semiconductor wafer at a first level and a second section for supporting the wafer at a second level, with the first level being higher than the second level. In one embodiment, each of the first and second sections is semicircular. The first level may be substantially the same as a level at which the wafer is subjected to a wafer cleaning operation, and the distance the second level is below the first level may be in a range from about one sixteenth of an inch to about three sixteenths of an inch. A conveyor system for transporting wafers and a method for transferring wafers from a conveyor system to a wafer processing station also are described.
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9.发明授权Method for controlling airflow on a backside of a semiconductor wafer during spin processing 失效用于在旋转处理期间控制半导体晶片的背面上的气流的方法公开(公告)号：US06505417B2
公开(公告)日：2003-01-14
申请号：US09471590
申请日：1999-12-23
IPC分类号： F26B300
CPC分类号： H01L21/67017
摘要： In a method for controlling airflow on a backside of a semiconductor wafer during spin processing, a wafer backing plate is first disposed below a semiconductor wafer. Air is then supplied to the volume defined by the wafer backing plate and the semiconductor wafer. The air may be supplied to the volume through a hollow core spindle, a rotary union, or apertures in the wafer backing plate. The separation distance between the wafer and the wafer backing plate and the flow rate of air supplied to the volume may be controlled to avoid any substantial recirculation of contaminated air into the volume. In addition to serving as one of the boundaries that define the volume, the wafer backing plate reduces particle recontamination on the backside of the wafer by preventing particles from contacting the backside of the wafer during spin processing.
摘要翻译： 在旋转处理期间用于控制半导体晶片的背面的气流的方法中，首先将晶片背板设置在半导体晶片的下方。 然后将空气供应到由晶片背板和半导体晶片限定的体积。 可以通过空心芯心轴，旋转接头或晶片背板中的孔将空气供应到体积。 可以控制晶片和晶片背板之间的间隔距离以及供应到体积的空气的流量，以避免污染的空气进入体积的任何实质的再循环。 除了作为限定体积的界限之外，晶片背板通过在旋转处理期间防止颗粒接触晶片的背面来减少晶片背面的颗粒再污染。
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