公开(公告)号：US07819506B2

公开(公告)日：2010-10-26

申请号：US11685334

申请日：2007-03-13

申请人： David Christopher Graham ,  Eric Spencer Hall ,  Gary Anthony Holt, Jr. ,  Richard Leo Hubert, II ,  Johnny Dale Massie ,  Sean Terrance Weaver ,  Jonathan Harold Laurer ,  Rich Wells

发明人： David Christopher Graham ,  Eric Spencer Hall ,  Gary Anthony Holt, Jr. ,  Richard Leo Hubert, II ,  Johnny Dale Massie ,  Sean Terrance Weaver ,  Jonathan Harold Laurer ,  Rich Wells

IPC分类号： B41J2/05

CPC分类号： B41J2/1623 ,  B41J2/14024 ,  B41J2/1408 ,  B41J2/1603

摘要： Thermally curable encapsulant compositions, micro-fluid ejection devices, and methods for protecting micro-fluid ejection heads. One such encapsulant composition may include one having from about 50.0 to about 95.0 percent by weight of at least one cross-linkable resin having a flexible backbone; from about 0.1 to about 20.0 percent by weight of at least one thermal curative agent; and from about 0.0 to about 50.0 percent by weight filler, and exhibits a relatively low shear modulus upon curing (e.g., less than about 10.0 MPa at 25° C.).

摘要翻译： 可热固化的密封剂组合物，微流体喷射装置和用于保护微流体喷射头的方法。 一种这样的密封剂组合物可以包括具有约50.0至约95.0重量％的至少一种具有柔性骨架的可交联树脂的组合物; 约0.1至约20.0重量％的至少一种热固化剂; 和约0.0-约50.0重量％的填料，并且在固化时表现出相对较低的剪切模量（例如在25℃下小于约10.0MPa）。

公开(公告)号：US20070229575A1

公开(公告)日：2007-10-04

申请号：US11685334

申请日：2007-03-13

申请人： David Christopher Graham ,  Eric Spencer Hall ,  Gary Anthony Holt ,  Richard Leo Hubert ,  Johnny Dale Massie ,  Sean Terrance Weaver ,  Jonathan Harold Laurer ,  Rich Wells

发明人： David Christopher Graham ,  Eric Spencer Hall ,  Gary Anthony Holt ,  Richard Leo Hubert ,  Johnny Dale Massie ,  Sean Terrance Weaver ,  Jonathan Harold Laurer ,  Rich Wells

IPC分类号： B41J2/015

CPC分类号： B41J2/1623 ,  B41J2/14024 ,  B41J2/1408 ,  B41J2/1603

摘要： Thermally curable encapsulant compositions, micro-fluid ejection devices, and methods for protecting micro-fluid ejection heads. One such encapsulant composition may include one having from about 50.0 to about 95.0 percent by weight of at least one cross-linkable resin having a flexible backbone; from about 0.1 to about 20.0 percent by weight of at least one thermal curative agent; and from about 0.0 to about 50.0 percent by weight filler, and exhibits a relatively low shear modulus upon curing (e.g., less than about 10.0 MPa at 25° C.).

摘要翻译： 可热固化的密封剂组合物，微流体喷射装置和用于保护微流体喷射头的方法。 一种这样的密封剂组合物可以包括具有约50.0至约95.0重量％的至少一种具有柔性骨架的可交联树脂的组合物; 约0.1至约20.0重量％的至少一种热固化剂; 和约0.0-约50.0重量％的填料，并且在固化时表现出相对较低的剪切模量（例如在25℃下小于约10.0MPa）。

公开(公告)号：US20100210759A1

公开(公告)日：2010-08-19

申请号：US12767857

申请日：2010-04-27

申请人： David Christopher Graham ,  Gary Anthony Holt, JR. ,  Jonathan Harold Laurer ,  Johnny Dale Massie, II ,  Melissa Marie Waldeck ,  Sean Terrence Weaver ,  Rich Wells

发明人： David Christopher Graham ,  Gary Anthony Holt, JR. ,  Jonathan Harold Laurer ,  Johnny Dale Massie, II ,  Melissa Marie Waldeck ,  Sean Terrence Weaver ,  Rich Wells

IPC分类号： C09J163/00

CPC分类号： B41J2/1623 ,  B41J2/14024 ,  B41J2/1408 ,  B41J2/1601

摘要： Adhesive compositions, micro-fluid ejection devices, and methods for attaching micro-fluid ejection heads to devices. One such adhesive composition is provided for use in attaching a micro-fluid ejection head to a device, such as to reduce chip bowing and/or to decrease chip fragility upon curing of the adhesive. Such an exemplary composition may include one having from about 50.0 to about 95.0 percent by weight of at least one cross-linkable resin selected from the group consisting of epoxy resins, siloxane resins, urethane resins, and functionalized olefin resins; from about 0.1 to about 25.0 percent by weight of at least one thermal curative agent; and from about 0.0 to about 30.0 percent by weight filler, and exhibit a relatively low shear modulus upon curing (e.g., less than about 10.0 MPa at 25° C.).

摘要翻译： 粘合剂组合物，微流体喷射装置和用于将微流体喷射头附接到装置的方法。 提供一种这样的粘合剂组合物用于将微流体喷射头附接到装置，例如在粘合剂固化时减少切屑弯曲和/或降低切屑脆性。 这样的示例性组合物可以包括具有约50.0至约95.0重量％的至少一种选自环氧树脂，硅氧烷树脂，聚氨酯树脂和官能化烯烃树脂的交联树脂; 约0.1至约25.0重量％的至少一种热固化剂; 和约0.0-约30.0重量％的填料，并且在固化时表现出相对低的剪切模量（例如在25℃下小于约10.0MPa）。

公开(公告)号：US08163819B2

公开(公告)日：2012-04-24

申请号：US12767857

申请日：2010-04-27

申请人： David Christopher Graham ,  Gary Anthony Holt, Jr. ,  Jonathan Harold Laurer ,  Johnny Dale Massie, II ,  Melissa Marie Waldeck ,  Sean Terrence Weaver ,  Rich Wells

发明人： David Christopher Graham ,  Gary Anthony Holt, Jr. ,  Jonathan Harold Laurer ,  Johnny Dale Massie, II ,  Melissa Marie Waldeck ,  Sean Terrence Weaver ,  Rich Wells

IPC分类号： C08L63/00 ,  C09J163/00

CPC分类号： B41J2/1623 ,  B41J2/14024 ,  B41J2/1408 ,  B41J2/1601

摘要： Adhesive compositions, micro-fluid ejection devices, and methods for attaching micro-fluid ejection heads to devices. One such adhesive composition is provided for use in attaching a micro-fluid ejection head to a device, such as to reduce chip bowing and/or to decrease chip fragility upon curing of the adhesive. Such an exemplary composition may include one having from about 50.0 to about 95.0 percent by weight of at least one cross-linkable resin selected from the group consisting of epoxy resins, siloxane resins, urethane resins, and functionalized olefin resins; from about 0.1 to about 25.0 percent by weight of at least one thermal curative agent; and from about 0.0 to about 30.0 percent by weight filler, and exhibit a relatively low shear modulus upon curing (e.g., less than about 10.0 MPa at 25° C.).

摘要翻译： 粘合剂组合物，微流体喷射装置和用于将微流体喷射头附接到装置的方法。 提供一种这样的粘合剂组合物用于将微流体喷射头附接到装置，例如在粘合剂固化时减少切屑弯曲和/或降低切屑脆性。 这样的示例性组合物可以包括具有约50.0至约95.0重量％的至少一种选自环氧树脂，硅氧烷树脂，聚氨酯树脂和官能化烯烃树脂的交联树脂; 约0.1至约25.0重量％的至少一种热固化剂; 和约0.0-约30.0重量％的填料，并且在固化时表现出相对低的剪切模量（例如在25℃下小于约10.0MPa）。

公开(公告)号：US20070232055A1

公开(公告)日：2007-10-04

申请号：US11423720

申请日：2006-06-13

申请人： Richard Earl Corley ,  Shelby Wayne Dennis ,  Edgar Colin Diaz ,  Richard Leo Hubert ,  Jonathan Harold Laurer ,  Tu Phan ,  George Allan Ping ,  Jeanne Marie Saldanha Singh ,  Mary Claire Smoot ,  Paul Timothy Spivey

发明人： Richard Earl Corley ,  Shelby Wayne Dennis ,  Edgar Colin Diaz ,  Richard Leo Hubert ,  Jonathan Harold Laurer ,  Tu Phan ,  George Allan Ping ,  Jeanne Marie Saldanha Singh ,  Mary Claire Smoot ,  Paul Timothy Spivey

IPC分类号： H01L21/4763

CPC分类号： H01L21/56 ,  H01L2924/0002 ,  H01L2924/00

摘要： Methods and apparatuses for applying a protective material to an interconnect associated with a component. One such method involves placing a stencil in close proximity to an interconnect that extends over a cavity. An amount of protective material is placed on the stencil. A wiper is passed across the stencil. The wiper has an angle of attack of less than 50 degrees. At least a desired thickness of protective material is applied to the interconnect.

摘要翻译： 将保护材料施加到与部件相关联的互连的方法和装置。 一种这样的方法包括将模板放置在靠近空腔上延伸的互连件附近。 将一定量的保护材料放在模板上。 刮水器穿过模板。 刮水器的冲击角小于50度。 至少所需的保护材料厚度被施加到互连。