公开(公告)号：US07819506B2

公开(公告)日：2010-10-26

申请号：US11685334

申请日：2007-03-13

申请人： David Christopher Graham ,  Eric Spencer Hall ,  Gary Anthony Holt, Jr. ,  Richard Leo Hubert, II ,  Johnny Dale Massie ,  Sean Terrance Weaver ,  Jonathan Harold Laurer ,  Rich Wells

发明人： David Christopher Graham ,  Eric Spencer Hall ,  Gary Anthony Holt, Jr. ,  Richard Leo Hubert, II ,  Johnny Dale Massie ,  Sean Terrance Weaver ,  Jonathan Harold Laurer ,  Rich Wells

IPC分类号： B41J2/05

CPC分类号： B41J2/1623 ,  B41J2/14024 ,  B41J2/1408 ,  B41J2/1603

摘要： Thermally curable encapsulant compositions, micro-fluid ejection devices, and methods for protecting micro-fluid ejection heads. One such encapsulant composition may include one having from about 50.0 to about 95.0 percent by weight of at least one cross-linkable resin having a flexible backbone; from about 0.1 to about 20.0 percent by weight of at least one thermal curative agent; and from about 0.0 to about 50.0 percent by weight filler, and exhibits a relatively low shear modulus upon curing (e.g., less than about 10.0 MPa at 25° C.).

摘要翻译： 可热固化的密封剂组合物，微流体喷射装置和用于保护微流体喷射头的方法。 一种这样的密封剂组合物可以包括具有约50.0至约95.0重量％的至少一种具有柔性骨架的可交联树脂的组合物; 约0.1至约20.0重量％的至少一种热固化剂; 和约0.0-约50.0重量％的填料，并且在固化时表现出相对较低的剪切模量（例如在25℃下小于约10.0MPa）。

公开(公告)号：US20070229575A1

公开(公告)日：2007-10-04

申请号：US11685334

申请日：2007-03-13

申请人： David Christopher Graham ,  Eric Spencer Hall ,  Gary Anthony Holt ,  Richard Leo Hubert ,  Johnny Dale Massie ,  Sean Terrance Weaver ,  Jonathan Harold Laurer ,  Rich Wells

发明人： David Christopher Graham ,  Eric Spencer Hall ,  Gary Anthony Holt ,  Richard Leo Hubert ,  Johnny Dale Massie ,  Sean Terrance Weaver ,  Jonathan Harold Laurer ,  Rich Wells

IPC分类号： B41J2/015

CPC分类号： B41J2/1623 ,  B41J2/14024 ,  B41J2/1408 ,  B41J2/1603

摘要： Thermally curable encapsulant compositions, micro-fluid ejection devices, and methods for protecting micro-fluid ejection heads. One such encapsulant composition may include one having from about 50.0 to about 95.0 percent by weight of at least one cross-linkable resin having a flexible backbone; from about 0.1 to about 20.0 percent by weight of at least one thermal curative agent; and from about 0.0 to about 50.0 percent by weight filler, and exhibits a relatively low shear modulus upon curing (e.g., less than about 10.0 MPa at 25° C.).

摘要翻译： 可热固化的密封剂组合物，微流体喷射装置和用于保护微流体喷射头的方法。 一种这样的密封剂组合物可以包括具有约50.0至约95.0重量％的至少一种具有柔性骨架的可交联树脂的组合物; 约0.1至约20.0重量％的至少一种热固化剂; 和约0.0-约50.0重量％的填料，并且在固化时表现出相对较低的剪切模量（例如在25℃下小于约10.0MPa）。

公开(公告)号：US20100210759A1

公开(公告)日：2010-08-19

申请号：US12767857

申请日：2010-04-27

申请人： David Christopher Graham ,  Gary Anthony Holt, JR. ,  Jonathan Harold Laurer ,  Johnny Dale Massie, II ,  Melissa Marie Waldeck ,  Sean Terrence Weaver ,  Rich Wells

发明人： David Christopher Graham ,  Gary Anthony Holt, JR. ,  Jonathan Harold Laurer ,  Johnny Dale Massie, II ,  Melissa Marie Waldeck ,  Sean Terrence Weaver ,  Rich Wells

IPC分类号： C09J163/00

CPC分类号： B41J2/1623 ,  B41J2/14024 ,  B41J2/1408 ,  B41J2/1601

摘要： Adhesive compositions, micro-fluid ejection devices, and methods for attaching micro-fluid ejection heads to devices. One such adhesive composition is provided for use in attaching a micro-fluid ejection head to a device, such as to reduce chip bowing and/or to decrease chip fragility upon curing of the adhesive. Such an exemplary composition may include one having from about 50.0 to about 95.0 percent by weight of at least one cross-linkable resin selected from the group consisting of epoxy resins, siloxane resins, urethane resins, and functionalized olefin resins; from about 0.1 to about 25.0 percent by weight of at least one thermal curative agent; and from about 0.0 to about 30.0 percent by weight filler, and exhibit a relatively low shear modulus upon curing (e.g., less than about 10.0 MPa at 25° C.).

摘要翻译： 粘合剂组合物，微流体喷射装置和用于将微流体喷射头附接到装置的方法。 提供一种这样的粘合剂组合物用于将微流体喷射头附接到装置，例如在粘合剂固化时减少切屑弯曲和/或降低切屑脆性。 这样的示例性组合物可以包括具有约50.0至约95.0重量％的至少一种选自环氧树脂，硅氧烷树脂，聚氨酯树脂和官能化烯烃树脂的交联树脂; 约0.1至约25.0重量％的至少一种热固化剂; 和约0.0-约30.0重量％的填料，并且在固化时表现出相对低的剪切模量（例如在25℃下小于约10.0MPa）。

公开(公告)号：US08163819B2

公开(公告)日：2012-04-24

申请号：US12767857

申请日：2010-04-27

申请人： David Christopher Graham ,  Gary Anthony Holt, Jr. ,  Jonathan Harold Laurer ,  Johnny Dale Massie, II ,  Melissa Marie Waldeck ,  Sean Terrence Weaver ,  Rich Wells

发明人： David Christopher Graham ,  Gary Anthony Holt, Jr. ,  Jonathan Harold Laurer ,  Johnny Dale Massie, II ,  Melissa Marie Waldeck ,  Sean Terrence Weaver ,  Rich Wells

IPC分类号： C08L63/00 ,  C09J163/00

CPC分类号： B41J2/1623 ,  B41J2/14024 ,  B41J2/1408 ,  B41J2/1601

摘要： Adhesive compositions, micro-fluid ejection devices, and methods for attaching micro-fluid ejection heads to devices. One such adhesive composition is provided for use in attaching a micro-fluid ejection head to a device, such as to reduce chip bowing and/or to decrease chip fragility upon curing of the adhesive. Such an exemplary composition may include one having from about 50.0 to about 95.0 percent by weight of at least one cross-linkable resin selected from the group consisting of epoxy resins, siloxane resins, urethane resins, and functionalized olefin resins; from about 0.1 to about 25.0 percent by weight of at least one thermal curative agent; and from about 0.0 to about 30.0 percent by weight filler, and exhibit a relatively low shear modulus upon curing (e.g., less than about 10.0 MPa at 25° C.).

摘要翻译： 粘合剂组合物，微流体喷射装置和用于将微流体喷射头附接到装置的方法。 提供一种这样的粘合剂组合物用于将微流体喷射头附接到装置，例如在粘合剂固化时减少切屑弯曲和/或降低切屑脆性。 这样的示例性组合物可以包括具有约50.0至约95.0重量％的至少一种选自环氧树脂，硅氧烷树脂，聚氨酯树脂和官能化烯烃树脂的交联树脂; 约0.1至约25.0重量％的至少一种热固化剂; 和约0.0-约30.0重量％的填料，并且在固化时表现出相对低的剪切模量（例如在25℃下小于约10.0MPa）。

公开(公告)号：US08292402B2

公开(公告)日：2012-10-23

申请号：US12030467

申请日：2008-02-13

申请人： Sean Terrance Weaver ,  Rich Wells

发明人： Sean Terrance Weaver ,  Rich Wells

IPC分类号： B41J2/14

CPC分类号： B41J2/1603 ,  B41J2/162 ,  B41J2/1623 ,  B41J2/1631 ,  B41J2/1634 ,  B41J2/1645 ,  G03F7/038 ,  G03F7/0751

摘要： The present disclosure relates to photoresist compositions suitable for thin layer photoimageable nozzle plates for micro-fluid ejection devices and methods of making and using such thin layer nozzle plates. The photoresist compositions may comprise a high-molecular weight phenoxy resin, a di-functional epoxy resin, and a multi-functional epoxy resin.

摘要翻译： 本公开涉及适用于微流体喷射装置的薄层可光成像喷嘴板的光致抗蚀剂组合物以及制造和使用这种薄层喷嘴板的方法。 光致抗蚀剂组合物可以包含高分子量苯氧树脂，二官能环氧树脂和多官能环氧树脂。

公开(公告)号：US20090201338A1

公开(公告)日：2009-08-13

申请号：US12030467

申请日：2008-02-13

申请人： Sean Terrance Weaver ,  Rich Wells

发明人： Sean Terrance Weaver ,  Rich Wells

IPC分类号： B41J2/16 ,  G03F7/00

CPC分类号： B41J2/1603 ,  B41J2/162 ,  B41J2/1623 ,  B41J2/1631 ,  B41J2/1634 ,  B41J2/1645 ,  G03F7/038 ,  G03F7/0751

摘要： The present disclosure relates to photoresist compositions suitable for thin layer photoimageable nozzle plates for micro-fluid ejection devices and methods of making and using such thin layer nozzle plates. The photoresist compositions may comprise a high-molecular weight phenoxy resin, a di-functional epoxy resin, and a multi-functional epoxy resin.

摘要翻译： 本公开涉及适用于微流体喷射装置的薄层可光成像喷嘴板的光致抗蚀剂组合物以及制造和使用这种薄层喷嘴板的方法。 光致抗蚀剂组合物可以包含高分子量苯氧树脂，二官能环氧树脂和多官能环氧树脂。

公开(公告)号：US08007990B2

公开(公告)日：2011-08-30

申请号：US12496786

申请日：2009-07-02

申请人： Girish S. Patil ,  Sean T. Weaver ,  Rich Wells

发明人： Girish S. Patil ,  Sean T. Weaver ,  Rich Wells

IPC分类号： G03F7/26

CPC分类号： B41J2/1603 ,  B41J2/1631 ,  B41J2/1645

摘要： Thick film layers for a micro-fluid ejection head, micro-fluid ejection heads, and methods for making micro-fluid ejection head and thick film layers. One such thick film layer is derived from a difunctional epoxy component having a weight average molecular weight ranging from about 2500 to about 4000 Daltons, a photoacid generator, an aryl ketone solvent, and an adhesion enhancing component. One such thick film layer has a cross-link density upon curing that increases the dimensional stability of the thick film layer sufficient to provide flow features therein having substantially vertical walls.

摘要翻译： 用于微流体喷射头，微流体喷射头和用于制造微流体喷射头和厚膜层的方法的厚膜层。 一种这样的厚膜层衍生自重均分子量为约2500至约4000道尔顿的双官能环氧组分，光酸产生剂，芳基酮溶剂和粘合增强组分。 一个这样的厚膜层在固化时具有交联密度，这增加了厚膜层的尺寸稳定性，足以提供具有基本垂直壁的流动特征。

公开(公告)号：US20070236542A1

公开(公告)日：2007-10-11

申请号：US11382876

申请日：2006-05-11

申请人： David Graham ,  Gary Holt ,  Jonathan Laurer ,  Johnny Massie ,  Melissa Waldeck ,  Sean Weaver ,  Rich Wells

发明人： David Graham ,  Gary Holt ,  Jonathan Laurer ,  Johnny Massie ,  Melissa Waldeck ,  Sean Weaver ,  Rich Wells

IPC分类号： B41J2/045

CPC分类号： B41J2/1623 ,  B41J2/14024 ,  B41J2/1408 ,  B41J2/1601

摘要： Adhesive compositions, micro-fluid ejection devices, and methods for attaching micro-fluid ejection heads to devices. One such adhesive composition is provided for use in attaching a micro-fluid ejection head to a device, such as to reduce chip bowing and/or to decrease chip fragility upon curing of the adhesive. Such an exemplary composition may include one having from about 50.0 to about 95.0 percent by weight of at least one cross-linkable resin selected from the group consisting of epoxy resins, siloxane resins, urethane resins, and functionalized olefin resins; from about 0.1 to about 25.0 percent by weight of at least one thermal curative agent; and from about 0.0 to about 30.0 percent by weight filler, and exhibit a relatively low shear modulus upon curing (e.g., less than about 10.0 MPa at 25° C.).

摘要翻译： 粘合剂组合物，微流体喷射装置和用于将微流体喷射头附接到装置的方法。 提供一种这样的粘合剂组合物用于将微流体喷射头附接到装置，例如在粘合剂固化时减少切屑弯曲和/或降低切屑脆性。 这样的示例性组合物可以包括具有约50.0至约95.0重量％的至少一种选自环氧树脂，硅氧烷树脂，聚氨酯树脂和官能化烯烃树脂的交联树脂; 约0.1至约25.0重量％的至少一种热固化剂; 和约0.0-约30.0重量％的填料，并且在固化时表现出相对低的剪切模量（例如在25℃下小于约10.0MPa）。

公开(公告)号：US07654637B2

公开(公告)日：2010-02-02

申请号：US11361732

申请日：2006-02-24

申请人： Sean T. Weaver ,  Rich Wells

发明人： Sean T. Weaver ,  Rich Wells

IPC分类号： B41J2/14 ,  G03F1/00

CPC分类号： B41J2/162 ,  B41J2/1603 ,  B41J2/1631 ,  B41J2/1645

摘要： Nozzle members, such as for a micro-fluid ejection head, micro-fluid ejection heads, and a method for making the same. One such nozzle member includes a negative photoresist composition derived from a first di-functional epoxy compound, a relatively high molecular weight polyhydroxy ether, a photoacid generator devoid of aryl sulfonium salts, an adhesion enhancer, and an aliphatic ketone solvent. The nozzle member has a thickness ranging from about 10 microns to about 30 microns.

摘要翻译： 喷嘴构件，例如微流体喷射头，微流体喷射头及其制造方法。 一个这样的喷嘴构件包括衍生自第一二官能环氧化合物，相对高分子量的多羟基醚，不含芳基锍盐的光酸产生剂，粘附增强剂和脂族酮溶剂的负性光致抗蚀剂组合物。 喷嘴构件具有约10微米至约30微米的厚度。

公开(公告)号：US20070076060A1

公开(公告)日：2007-04-05

申请号：US11361732

申请日：2006-02-24

申请人： Sean Weaver ,  Rich Wells

发明人： Sean Weaver ,  Rich Wells

IPC分类号： B41J2/045

CPC分类号： B41J2/162 ,  B41J2/1603 ,  B41J2/1631 ,  B41J2/1645

摘要： Nozzle members, such as for a micro-fluid ejection head, micro-fluid ejection heads, and a method for making the same. One such nozzle member includes a negative photoresist composition derived from a first di-functional epoxy compound, a relatively high molecular weight polyhydroxy ether, a photoacid generator devoid of aryl sulfonium salts, an adhesion enhancer, and an aliphatic ketone solvent. The nozzle member has a thickness ranging from about 10 microns to about 30 microns.

摘要翻译： 喷嘴构件，例如微流体喷射头，微流体喷射头及其制造方法。 一个这样的喷嘴构件包括衍生自第一二官能环氧化合物，相对高分子量的多羟基醚，不含芳基锍盐的光酸产生剂，粘附增强剂和脂族酮溶剂的负性光致抗蚀剂组合物。 喷嘴构件具有约10微米至约30微米的厚度。