公开(公告)号：US20070188997A1

公开(公告)日：2007-08-16

申请号：US11353897

申请日：2006-02-14

申请人： David Hockanson ,  Rodney Slone

发明人： David Hockanson ,  Rodney Slone

IPC分类号： H05K7/00 ,  H05K7/20 ,  H01L21/00 ,  H05K1/14

CPC分类号： H05K1/0262 ,  G06F1/182 ,  G06F1/189 ,  H01L23/50 ,  H01L2224/16225 ,  H01L2924/10253 ,  H05K1/0263 ,  H05K1/112 ,  H05K1/181 ,  H05K2201/10734 ,  H01L2924/00

摘要： An interconnect system between an integrated circuit device and a printed circuit board may include a filter between the integrated circuit device and the power subsystem of the printed circuit board. The filter may be a low-pass filter that reduces current in a higher frequency range without negatively modifying current in a lower frequency range and may reduce radiated emissions produced during operation of the integrated circuit. The filter may be implemented by arranging core-power voltage conductors and ground conductors at a first or second level interconnect into one or more voltage groupings and one or more adjacent ground groupings such that series inductance is increased. In some embodiments, the first level interconnect may include conductive bumps or pads between an integrated circuit and a substrate. In some embodiments, the second level interconnect may include solder balls, pins, pads, or other conductors of a package, socket, or interposer.

摘要翻译： 集成电路器件和印刷电路板之间的互连系统可以包括集成电路器件和印刷电路板的电源子系统之间的滤波器。 滤波器可以是低通滤波器，其在较低频率范围内减少电流，而不会在较低频率范围内对电流进行负调整，并可减少集成电路运行期间产生的辐射发射。 滤波器可以通过将第一或第二电平互连处的核心电源电压导体和接地导体布置成一个或多个电压组和一个或多个相邻的接地组来实现，使得串联电感增加。 在一些实施例中，第一级互连可以包括集成电路和衬底之间的导电凸块或焊盘。 在一些实施例中，第二级互连可以包括焊球，引脚，焊盘或封装，插座或插入件的其它导体。