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49 条记录 (耗时 0.03 秒)

    Magnetic head with thin trailing pedestal layer
    1.
    发明授权
    Magnetic head with thin trailing pedestal layer 失效
    磁头与薄拖尾基座层

    公开(公告)号：US07292409B1

    公开(公告)日：2007-11-06

    申请号：US10788766

    申请日：2004-02-27

    申请人： Kroum S. Stoev ,  Francis H. Liu ,  James H. Wang ,  Marcos M. Lederman ,  David J. Seagle

    发明人： Kroum S. Stoev ,  Francis H. Liu ,  James H. Wang ,  Marcos M. Lederman ,  David J. Seagle

    IPC分类号： G11B5/147 ,  G11B5/17 ,  G11B5/187

    CPC分类号： G11B5/3146 ,  G11B5/17 ,  G11B5/3116 ,  G11B5/3123

    摘要： A magnetic head for a disk drive is disclosed that has a first soft magnetic pole layer disposed in the head adjacent to a medium-facing surface and extending perpendicular to the medium-facing surface; a second soft magnetic pole layer disposed closer than the first pole layer to the trailing end, the second pole layer magnetically coupled to the first pole layer in a backgap region; a soft magnetic pedestal adjoining the second pole layer, disposed closer than the second pole layer to the medium-facing surface and extending less than the second pole layer extends from the medium-facing surface, the pedestal separated from the first pole layer by a nonferromagnetic gap, the pedestal having a thickness that is less than four hundred and fifty nanometers between the gap and the second pole layer. Longitudinal and perpendicular recording embodiments are disclosed, as well as solenoidal, single-layer and dual-layer reversed-current coil structures.

    摘要翻译： 公开了一种用于磁盘驱动器的磁头，其具有第一软磁极层，该第一软磁极层设置在与中间面向表面相邻并且垂直于介质面向表面延伸的头部中; 第二软磁极层，设置成比所述第一极层更靠近所述后端，所述第二极层在后隙区域中磁耦合到所述第一极层; 邻近第二极层的软磁性基座设置成比第二极层更靠近介质相对表面并且延伸小于第二极层从中介面向表面延伸，基座与第一极层分离，由非铁磁 间隙，所述基座在所述间隙和所述第二极层之间具有小于四百五十纳米的厚度。 公开纵向和垂直记录实施例，以及螺线管，单层和双层反向电流线圈结构。

    Highly conductive lead adjoining MR stripe and extending beyond stripe height at junction
    2.
    发明授权
    Highly conductive lead adjoining MR stripe and extending beyond stripe height at junction 有权
    高导电导线邻接MR条纹，并在结处延伸超过条纹高度

    公开(公告)号：US07211339B1

    公开(公告)日：2007-05-01

    申请号：US10226398

    申请日：2002-08-22

    申请人： David J. Seagle ,  Marcos M. Lederman

    发明人： David J. Seagle ,  Marcos M. Lederman

    IPC分类号： G11B5/127

    CPC分类号： G11B5/3906 ,  G11B5/398 ,  Y10T428/1171 ,  Y10T428/1193

    摘要： Magnetoresistive (MR) sensors are disclosed that have leads with reduced resistance, improving the signal-to-noise ratio of the sensors. The leads have broad layers of highly conductive material for connection to MR structures, as opposed to thin wires of highly conductive material or broad layers of resistive material, lowering the resistance of the leads. The low-resistance leads can be formed without increasing the shield-to-shield spacing, providing highly sensitive and focused MR sensors.

    摘要翻译： 公开了具有降低电阻的引线的磁阻（MR）传感器，提高了传感器的信噪比。 引线具有用于连接到MR结构的宽导电材料层，与高导电材料或宽电阻材料层的细线相反，降低了引线的电阻。 可以在不增加屏蔽间隔的情况下形成低电阻引线，提供高灵敏度和聚焦的MR传感器。

    Verification of a fabrication process used to form read elements in magnetic heads
    3.
    发明授权
    Verification of a fabrication process used to form read elements in magnetic heads 有权
    用于在磁头中形成读取元件的制造工艺的验证

    公开(公告)号：US07919967B2

    公开(公告)日：2011-04-05

    申请号：US11965502

    申请日：2007-12-27

    申请人： Satoru Araki ,  Robert S. Beach ,  David J. Seagle

    发明人： Satoru Araki ,  Robert S. Beach ,  David J. Seagle

    IPC分类号： G01R31/08 ,  G01R27/08

    CPC分类号： G01R31/2884 ,  G01R33/1207 ,  G11B5/127

    摘要： Test methods and components are disclosed for testing the quality of a fabrication process used to form read elements in magnetic heads. A wafer is populated with one or more test components along with magnetic heads. The test components are formed by the same or similar fabrication processes as the read elements, but do not include a conductive MR sensor between the test leads. By measuring the resistance of the test components, the formation of parasitic shunts can be identified in the test components, which may indicate the formation of parasitic shunts in the read elements. Thus, the quality of the fabrication process in forming read elements in magnetic head may be determined.

    摘要翻译： 公开了用于测试用于在磁头中形成读取元件的制造工艺的质量的测试方法和部件。 晶片与磁头一起安装有一个或多个测试部件。 测试部件通过与读取元件相同或相似的制造工艺形成，但不包括测试引线之间的导电MR传感器。 通过测量测试部件的电阻，可以在测试部件中识别寄生分流器的形成，这可以指示在读取元件中形成寄生分流。 因此，可以确定在磁头中形成读取元件的制造工艺的质量。

    Test components fabricated with large area sensors used for determining the resistance of an MR sensor
    4.
    发明授权
    Test components fabricated with large area sensors used for determining the resistance of an MR sensor 有权
    用大面积传感器制造的测试部件用于确定MR传感器的电阻

    公开(公告)号：US07855553B2

    公开(公告)日：2010-12-21

    申请号：US11965587

    申请日：2007-12-27

    申请人： Robert S. Beach ,  Mary K. Gutberlet ,  David J. Seagle

    发明人： Robert S. Beach ,  Mary K. Gutberlet ,  David J. Seagle

    IPC分类号： G01R33/12

    CPC分类号： G11B20/1816 ,  G11B5/3166 ,  G11B5/3173 ,  G11B5/3193 ,  G11B5/3903 ,  G11B2220/2516

    摘要： Test methods and components are disclosed for testing resistances of magnetoresistance (MR) sensors in read elements. Test components are fabricated on a wafer with a first test lead, a test MR sensor, and a second test lead. The test leads and test MR sensor are fabricated with similar processes as first shields, MR sensors, and second shields of read elements on tie wafer. However, the test MR sensor is fabricated with an area that is larger than areas of the MR sensors in the read elements. The larger area of the test MR sensor causes the resistance of the test MR sensor to be insignificant compared to the lead resistance. Thus, a resistance measurement of the test component represents the lead resistance of a read element. An accurate resistance measurement of an MR sensor in a read element may then be determined by subtracting the lead resistance.

    摘要翻译： 公开了用于测试读取元件中的磁阻（MR）传感器的电阻的测试方法和组件。 在具有第一测试导线，测试MR传感器和第二测试导线的晶片上制造测试部件。 测试引线和测试MR传感器采用与晶片上的读取元件的第一屏蔽，MR传感器和第二屏蔽类似的工艺制造。 然而，测试MR传感器的制造面积大于读取元件中MR传感器的面积。 测试MR传感器的较大面积导致测试MR传感器的电阻与引线电阻相比不显着。 因此，测试部件的电阻测量表示读取元件的引线电阻。 然后可以通过减去引线电阻来确定读取元件中的MR传感器的精确电阻测量。

    Electrical lapping guides made from tunneling magnetoresistive (TMR) material
    5.
    发明授权
    Electrical lapping guides made from tunneling magnetoresistive (TMR) material 失效
    由隧道磁阻（TMR）材料制成的电气研磨导轨

    公开(公告)号：US07564110B2

    公开(公告)日：2009-07-21

    申请号：US11379321

    申请日：2006-04-19

    申请人： Robert S. Beach ,  Daniele Mauri ,  David J. Seagle ,  Jila Tabib

    发明人： Robert S. Beach ,  Daniele Mauri ,  David J. Seagle ,  Jila Tabib

    IPC分类号： H01L29/82

    CPC分类号： G11B5/3173 ,  B82Y10/00 ,  B82Y25/00 ,  G11B5/3169 ,  G11B5/3906 ,  G11B5/3909 ,  H01L43/12

    摘要： Tunneling magnetoresistive (TMR) electrical lapping guides (ELG) are disclosed for use in wafer fabrication of magnetic sensing devices, such as magnetic recording heads using TMR read elements. A TMR ELG includes a TMR stack comprising a first conductive layer, a barrier layer, and a second conductive layer of TMR material. The TMR ELG also includes a first lead and a second lead that connect to conductive pads used for applying a sense current to the TMR ELG in a current in plane (CIP) fashion. The first lead contacts one side of the TMR stack so that the first lead contacts both the first conductive layer and the second conductive layer of the TMR stack. The second lead contacts the other side of the TMR stack so that the second lead contacts both the first conductive layer and the second conductive layer of the TMR stack.

    摘要翻译： 公开了隧道磁阻（TMR）电研磨引导件（ELG），用于磁感测装置的晶片制造，例如使用TMR读取元件的磁记录头。 TMR ELG包括TMR堆叠，其包括第一导电层，阻挡层和TMR材料的第二导电层。 TMR ELG还包括连接到用于以当前平面（CIP）方式向TMR ELG施加感测电流的导电焊盘的第一引线和第二引线。 第一引线接触TMR堆叠的一侧，使得第一引线接触TMR堆叠的第一导电层和第二导电层。 第二引线接触TMR堆叠的另一侧，使得第二引线接触TMR堆叠的第一导电层和第二导电层。

    VERIFICATION OF A FABRICATION PROCESS USED TO FORM READ ELEMENTS IN MAGNETIC HEADS
    7.
    发明申请
    VERIFICATION OF A FABRICATION PROCESS USED TO FORM READ ELEMENTS IN MAGNETIC HEADS 有权
    用于形成读取磁头元件的制造工艺的验证

    公开(公告)号：US20090168214A1

    公开(公告)日：2009-07-02

    申请号：US11965502

    申请日：2007-12-27

    申请人： Satoru Araki ,  Robert S. Beach ,  David J. Seagle

    发明人： Satoru Araki ,  Robert S. Beach ,  David J. Seagle

    IPC分类号： G11B27/36

    CPC分类号： G01R31/2884 ,  G01R33/1207 ,  G11B5/127

    摘要： Test methods and components are disclosed for testing the quality of a fabrication process used to form read elements in magnetic heads. A wafer is populated with one or more test components along with magnetic heads. The test components are formed by the same or similar fabrication processes as the read elements, but do not include a conductive MR sensor between the test leads. By measuring the resistance of the test components, the formation of parasitic shunts can be identified in the test components, which may indicate the formation of parasitic shunts in the read elements. Thus, the quality of the fabrication process in forming read elements in magnetic head may be determined.

    摘要翻译： 公开了用于测试用于在磁头中形成读取元件的制造工艺的质量的测试方法和部件。 晶片与磁头一起安装有一个或多个测试部件。 测试部件通过与读取元件相同或相似的制造工艺形成，但不包括测试引线之间的导电MR传感器。 通过测量测试部件的电阻，可以在测试部件中识别寄生分流器的形成，这可以指示在读取元件中形成寄生分流。 因此，可以确定在磁头中形成读取元件的制造工艺的质量。

    MAGNETIC SENSOR HAVING HARD BIAS STRUCTURE FOR OPTIMIZED HARD BIAS FIELD AND HARD BIAS COERCIVITY
    9.
    发明申请
    MAGNETIC SENSOR HAVING HARD BIAS STRUCTURE FOR OPTIMIZED HARD BIAS FIELD AND HARD BIAS COERCIVITY 有权
    具有优化硬度偏差的硬偏置结构的磁传感器和硬偏置系数

    公开(公告)号：US20130163121A1

    公开(公告)日：2013-06-27

    申请号：US13335589

    申请日：2011-12-22

    申请人： Quang Le ,  David J. Seagle ,  Guangli Liu ,  Yongchul Ahn ,  Simon H. Liao

    发明人： Quang Le ,  David J. Seagle ,  Guangli Liu ,  Yongchul Ahn ,  Simon H. Liao

    IPC分类号： G11B5/60 ,  G11B5/127

    CPC分类号： G11B5/3909 ,  B82Y10/00 ,  G11B5/3932 ,  G11B2005/3996

    摘要： A magnetic read sensor having a hard bias structure that extends beyond the back edge of the sensor stack by a controlled, distance that is chosen to maximize both hard bias field and hard bias magnetic coercivity and anisotropy. The hard bias structure has a back edge that is well defined and that has a square corner at its innermost end adjacent to the sensor stack. The magnetic sensor can be constructed by a process that includes a separate making an milling process that is dedicated to defining the back edge of the hard bias structure.

    摘要翻译： 具有硬偏压结构的磁读取传感器，其通过受控的距离延伸超过传感器堆叠的后边缘，该距离被选择为最大化硬偏置磁场和硬偏磁磁矫顽力和各向异性。 硬偏置结构具有良好限定的后边缘，并且在与传感器堆叠相邻的最内端具有正方形角。 磁传感器可以通过包括单独制造专用于限定硬偏压结构的后边缘的铣削过程的工艺来构造。

    Integrated touch-down pad and touch-down sensor
    10.
    发明授权
    Integrated touch-down pad and touch-down sensor 有权
    集成的触摸板和触摸屏传感器

    公开(公告)号：US08335053B2

    公开(公告)日：2012-12-18

    申请号：US12914883

    申请日：2010-10-28

    申请人： Yingjian Chen ,  David J. Seagle ,  Samuel W. Yuan

    发明人： Yingjian Chen ,  David J. Seagle ,  Samuel W. Yuan

    IPC分类号： G11B21/02

    CPC分类号： G11B5/607 ,  G11B5/6076

    摘要： In one general embodiment, a magnetic head includes a touch-down pad, comprising at least one shielding element positioned between a leading edge of a main magnetic pole and a trailing edge of a lower return pole; an embedded contact sensor (ECS) in an electrically isolating layer, the ECS positioned near an ABS side of the magnetic head and between the leading edge of the main magnetic pole and the trailing edge of the lower return pole; and a first thermal fly-height control (TFC) element positioned away from the ABS side of the magnetic head. Additional systems and methods are also presented.

    摘要翻译： 在一个一般实施例中，磁头包括一个触控板，包括位于主磁极的前缘和下回极的后缘之间的至少一个屏蔽元件; 位于电绝缘层中的嵌入式接触传感器（ECS），ECS位于磁头的ABS侧附近，并且位于主磁极的前缘和下返回极的后缘之间; 以及远离磁头的ABS侧定位的第一热飞跃高度控制（TFC）元件。 还介绍了其他系统和方法。