Process and apparatus for improved module assembly using shape memory alloy springs
    1.
    发明授权
    Process and apparatus for improved module assembly using shape memory alloy springs 失效
    使用形状记忆合金弹簧改进模块组装的工艺和装置

    公开(公告)号:US06436223B1

    公开(公告)日:2002-08-20

    申请号:US09250312

    申请日:1999-02-16

    IPC分类号: B32B3100

    摘要: A fixture and process for assembly of semiconductor modules. Each module comprises a substrate and a cover attached to the substrate. The fixture comprises a baseplate adapted to accept the substrate and a spring-loading device containing a shape memory alloy spring engaging the cover. The shape memory alloy spring exerts a lesser force at room temperature and an elevated force at the bonding temperature of the bonding agent used to attach the cover to the substrate. The process comprises the steps of (a) loading she module into an assembly fixture and aligning a shape memory alloy spring over the module at room temperature; (b) placing the fixture and module into a heating chamber; (c) heating the fixture and module to a temperature sufficient for bonding and above the shape memory alloy spring transition temperature range so that the spring exerts an elevated force on the module; and (d) cooping the fixture and module below the transition temperature so that the spring exerts a lesser amount of force on the module, and disengaging the springs at the lower temperature.

    摘要翻译: 用于组装半导体模块的夹具和工艺。 每个模块包括衬底和附接到衬底的盖。 所述固定装置包括适于接纳所述基板的基板和包含接合所述盖的形状记忆合金弹簧的弹簧加载装置。 形状记忆合金弹簧在室温下施加较小的力,并且在用于将盖附着到基底上的粘结剂的粘结温度下提高力。 该过程包括以下步骤:(a)将模块加载到组装夹具中并在室温下将形状记忆合金弹簧对准模块; (b)将灯具和模块放入加热室; (c)将夹具和模块加热到足以粘结的温度并高于形状记忆合金弹簧转变温度范围,使得弹簧在模块上施加升高的力; 和(d)将夹具和模块配合在转变温度以下,使得弹簧在模块上施加较小的力,并在较低温度下分离弹簧。

    Methods and systems of producing blister packaging
    3.
    发明授权
    Methods and systems of producing blister packaging 有权
    生产泡罩包装的方法和系统

    公开(公告)号:US06851874B2

    公开(公告)日:2005-02-08

    申请号:US10174263

    申请日:2002-06-18

    CPC分类号: B65B61/025 B65B9/04

    摘要: A blister packaging production line preferably includes an unmarked supply of backing for blister packaging, a printer for selectively printing on the backing and a host system controlling the printer and providing a variety of desired designs to the printer. The design being printed on the backing can be changed on-demand by transmitting a new design from the host system to the printer. Additionally, a blister packaging production line may include an unmarked supply of material backing for blister packaging, a printer for selectively printing on the material and a shaping device for forming recesses in the material that will receive items being blister packaged. The printed design can be of any desired length.

    摘要翻译: 泡罩包装生产线优选地包括用于泡罩包装的未标记的背衬供应,用于在背衬上选择性地印刷的打印机以及控制打印机的主机系统并且向打印机提供各种期望的设计。 印刷在背板上的设计可以通过从主机系统向打印机发送新的设计来按需更改。 此外,泡罩包装生产线可以包括用于泡罩包装的未标记的材料背衬供应,用于在材料上选择性印刷的打印机和用于在材料中形成凹部的成型装置,其将接收泡罩包装的物品。 印刷设计可以是任何期望的长度。

    Pharmaceutical dose form with a patterned coating and method of making the same
    4.
    发明授权
    Pharmaceutical dose form with a patterned coating and method of making the same 失效
    具有图案化涂层的药物剂型及其制备方法

    公开(公告)号:US08609198B2

    公开(公告)日:2013-12-17

    申请号:US10896301

    申请日:2004-07-21

    摘要: A method for producing a pharmaceutical dose form includes depositing a measured quantity of a first coating material on an external surface of the dose form in a patterned configuration. A measured quantity of a second coating material is deposited on the surface of the dose form in a patterned configuration in relationship to the first coating material. The first and second coating materials form a coating layer in overlying relationship with at least a portion of the external surface of the dose form.

    摘要翻译: 制备药物剂型的方法包括在图案化构型中将测量量的第一涂层材料沉积在剂量形式的外表面上。 测量量的第二涂料以与第一涂料相关的图案化构型沉积在剂型表面上。 第一和第二涂层材料形成与剂量形式的外表面的至少一部分重叠关系的涂层。