CMP apparatus and load cup mechanism
    1.
    发明申请
    CMP apparatus and load cup mechanism 失效
    CMP装置和装载杯机构

    公开(公告)号:US20050227595A1

    公开(公告)日:2005-10-13

    申请号:US10821758

    申请日:2004-04-09

    摘要: In accordance with one embodiment of the invention, a load cup mechanism is provided for loading and unloading apparatus such as a CMP apparatus. The load cup mechanism, configured to load a work piece into and to unload a work piece from the apparatus, comprises a load cup arm configured to pivot about an axis between a load position aligned with the apparatus and an off-load position. A work piece platform is coupled to an end of the load cup arm and a plurality of lift fingers and a plurality of guide fingers, configured to support and center a work piece, are spaced about the work piece platform. A plurality of guide posts are spaced apart about the periphery of the work piece platform and are configured to align the work piece platform, in the load position, to the processing apparatus.

    摘要翻译: 根据本发明的一个实施例,提供了用于装载和卸载诸如CMP装置的装置的装载杯机构。 负载杯机构构造成将工件装载到装置中并从工具卸载工件,包括负载杯臂,其配置成围绕与该装置对准的负载位置和卸载位置之间的轴线枢转。 工件平台联接到负载杯臂的端部,并且构造成支撑和居中工件的多个提升指和多个引导指在工件平台周围间隔开。 多个引导柱围绕工件平台的周边间隔开,并且被构造成使处于装载位置的工件平台对准处理装置。

    Workpiece handling end-effector and a method for processing workpieces using a workpiece handling end-effector
    2.
    发明授权
    Workpiece handling end-effector and a method for processing workpieces using a workpiece handling end-effector 失效
    工件处理端部执行器和使用工件处理端部执行器处理工件的方法

    公开(公告)号:US06979034B2

    公开(公告)日:2005-12-27

    申请号:US10801404

    申请日:2004-03-12

    摘要: A two sided wafer handling end-effector provides for the efficient loading and unloading of wafers into and out of a wafer processing apparatus. Each side of the end-effector includes spaced apart rotatable catch mechanisms between which a wafer is firmly grasped. When the end-effector is positioned beneath the wafer processing apparatus the catch mechanisms are rotated to an open position and a lifting surface on the catch mechanisms lifts the wafer into the wafer processing apparatus. When the catch mechanisms are in the open position the wafer is centered on the end-effector by rotatable rocker assemblies that contact the edge of the wafer. As the end-effector is raised into contact with the processing apparatus, the rocker assemblies rotate to a lowered position in the end-effector while arcuate surfaces on the assemblies maintain contact with the wafer edge.

    摘要翻译: 双面晶片处理端部执行器提供晶片加工和卸载晶片处理装置的有效装载和卸载。 末端执行器的每一侧包括间隔开的可旋转的捕获机构,在其之间牢固地抓住晶片。 当末端执行器定位在晶片处理装置下方时,捕捉机构旋转到打开位置,并且捕获机构上的提升表面将晶片提升到晶片处理装置中。 当捕获机构处于打开位置时,通过接触晶片边缘的可旋转的摇臂组件,晶片以端部执行器为中心。 当末端执行器升高成与处理装置接触时,摇臂组件在端部执行器中旋转到降低的位置,同时组件上的弧形表面保持与晶片边缘的接触。

    Workpiece handling end-effector and a method for processing workpieces using a workpiece handling end-effector
    3.
    发明授权
    Workpiece handling end-effector and a method for processing workpieces using a workpiece handling end-effector 失效
    工件处理端部执行器和使用工件处理端部执行器处理工件的方法

    公开(公告)号:US06752442B2

    公开(公告)日:2004-06-22

    申请号:US10040996

    申请日:2001-11-09

    IPC分类号: B66C110

    摘要: A two sided wafer handling end-effector provides for the efficient loading and unloading of wafers into and out of a wafer processing apparatus. Each side of the end-effector includes spaced apart rotatable catch mechanisms between which a wafer is firmly grasped. When the end-effector is positioned beneath the wafer processing apparatus, the catch mechanisms are rotated to an open position and a lifting surface on the catch mechanisms lifts the wafer into the wafer processing apparatus. When the catch mechanisms are in the open position, the wafer is centered on the end-effector by rotatable rocker assemblies that contact the edge of the wafer. As the end-effector is raised into contact with the processing apparatus, the rocker assemblies rotate to a lowered position in the end-effector while arcuate surfaces on the assemblies maintain contact with the wafer edge.

    摘要翻译: 双面晶片处理端部执行器提供晶片加工和卸载晶片处理装置的有效装载和卸载。 末端执行器的每一侧包括间隔开的可旋转的捕获机构,在其之间牢固地抓住晶片。 当末端执行器位于晶片处理装置下方时,捕捉机构被旋转到打开位置,并且捕获机构上的提升表面将晶片提升到晶片处理装置中。 当捕捉机构处于打开位置时,通过接触晶片边缘的可旋转的摇臂组件,晶片以端部执行器为中心。 当末端执行器升高成与处理装置接触时,摇臂组件在端部执行器中旋转到降低的位置,同时组件上的弧形表面保持与晶片边缘的接触。

    Method and apparatus for teaching robot station location
    4.
    发明授权
    Method and apparatus for teaching robot station location 失效
    教学机器人位置的方法和装置

    公开(公告)号:US06567725B1

    公开(公告)日:2003-05-20

    申请号:US10195619

    申请日:2002-07-15

    IPC分类号: G05B1500

    摘要: Apparatus for teaching robot station location relative to a work piece apparatus includes an attachment that can be temporarily coupled to the apparatus and positioned in known relationship to the robot station location. A plurality of positional sensors are mounted on the attachment ring, the sensors each configured to produce a signal when a work piece carried by a robot arm is positioned a predetermined distance from the sensor. A signal receiver is configured to receive signals from the sensors and to indicate which of the sensors has produced the signal. The indication may be the activation of an LED display that indicates to an operator what the next movement of the robot arm should be in order to center the work piece with respect to the robot station location.

    摘要翻译: 用于教导相对于工件装置的机器人站位置的装置包括可以临时耦合到装置并以与机器人站位置已知的关系定位的附件。 多个位置传感器安装在安装环上,传感器被配置为当由机器人手臂承载的工件位于与传感器预定距离时产生信号。 信号接收器被配置为从传感器接收信号并且指示哪些传感器产生了该信号。 该指示可以是LED显示器的激活,其向操作者指示机器人手臂的下一个移动应该是为了使工件相对于机器人站位置居中。