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公开(公告)号：US06793561B2
公开(公告)日：2004-09-21
申请号：US09948165
申请日：2001-09-06
IPC分类号： B24B5300
CPC分类号： B24B37/14 , B24B37/013
摘要： The present invention comprises a chemical mechanical polishing tool comprising a polishing platen and a removable, replaceable platen top mounted on a top surface of the platen. Preferably, the platen top comprises a material substantially impervious to the slurries used when planarizing an object. Most preferably, the platen top comprises aluminum alloy or glass. The platen top may be tailored to provide enhanced polishing conditions by acting as an insulator, a conductor or machined to be concave or convex. The invention may further include endpoint sensors attached to the platen top.
摘要翻译： 本发明包括一种化学机械抛光工具，其包括抛光压板和安装在压板的顶表面上的可移除的可替换的压板顶板。 优选地，压板顶部包括当平坦化物体时使用的浆料基本上不可渗透的材料。 最优选地，压板顶部包括铝合金或玻璃。 压板顶部可以被调整为通过充当绝缘体，导体或机械加工成凹凸的方式提供增强的抛光条件。 本发明还可以包括附接到压板顶部的端点传感器。
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公开(公告)号：US06247368B1
公开(公告)日：2001-06-19
申请号：US09225149
申请日：1999-01-04
申请人： Scott R. Cline , Willi O. Kalvaitis , Richard J. Lebel , Charles A. McKinney , Douglas P. Nadeau , Theodore G. van Kessel
发明人： Scott R. Cline , Willi O. Kalvaitis , Richard J. Lebel , Charles A. McKinney , Douglas P. Nadeau , Theodore G. van Kessel
IPC分类号： G01N2900
CPC分类号： H01L21/67265 , G01N29/11 , G01N29/28 , G01N29/40 , G01N2291/101 , H01L21/67259
摘要： A semiconductor post-polishing processing apparatus and method employing a non-optical wafer sensor for detecting the presence of a semiconductor wafer within the processing stations. The apparatus comprising a wet processing station, a wafer transport track, and the non-optical sensor. Preferably, the non-optical wafer sensor is a transducer, and most preferably, a piezo element, which emits and detects sound waves. The sound waves are reflected back to the emitter signaling the presence of a semiconductor wafer. The signal is sent to a receiver linked to a processor which is adapted to move a wafer holder situated at the end of the transport track to receive a wafer in the next available empty slot of the holder. The non-optical wafer sensor is impervious to slurry and CMP residue, film build-up, bubbles, wafer color/hue variations, and other wet environment problems.
摘要翻译： 一种使用非光学晶片传感器来检测处理站内半导体晶片的存在的半导体后抛光处理装置和方法。 该装置包括湿处理站，晶片传输轨道和非光学传感器。 优选地，非光学晶片传感器是换能器，最优选地，发射和检测声波的压电元件。 声波被反射回发射体，表明存在半导体晶片。 信号被发送到连接到处理器的接收器，该处理器适于移动位于传送轨道的端部处的晶片保持器，以在保持器的下一个可用空槽中接收晶片。 非光学晶片传感器不受浆料和CMP残留物，膜积聚，气泡，晶片颜色/色调变化和其他湿环境问题的影响。
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公开(公告)号：US5885135A
公开(公告)日：1999-03-23
申请号：US842129
申请日：1997-04-23
申请人： Daniel D. Desorcie , Richard J. Lebel , Charles A. McKinney , Rock Nadeau , Timothy J. Rickard, Jr. , Paul H. Smith, Jr. , Douglas K. Sturtevant , Matthew T. Tiersch
发明人： Daniel D. Desorcie , Richard J. Lebel , Charles A. McKinney , Rock Nadeau , Timothy J. Rickard, Jr. , Paul H. Smith, Jr. , Douglas K. Sturtevant , Matthew T. Tiersch
IPC分类号： B24B41/06 , H01L21/302 , H01L21/304 , B24B1/00
CPC分类号： B24B37/102 , B24B37/30 , B24B41/06 , H01L21/302
摘要： An apparatus for polishing a semiconductor wafer is provided which includes a wafer carrier having on its lower surface a non-uniform surface structure means to vary the force against a wafer during a polishing operation so that the polishing is enhanced and imparts a planar surface across the polished wafer. Preferred non-uniform surface structure means include use of a wafer carrier having on its lower surface a backing film having a first central portion having a predetermined compressibility and a second peripheral portion having a different compressibility than the first portion. Another non-uniform surface structure means to vary the force against the wafer comprises a wafer carrier having on its lower surface a raised circumferential region around the periphery of the carrier.
摘要翻译： 提供了一种用于抛光半导体晶片的装置，其包括晶片载体，该晶片载体在其下表面具有不均匀的表面结构装置，以在抛光操作期间改变对晶片的力，使得抛光被增强并且在平面 抛光晶圆。 优选的不均匀表面结构包括使用晶片载体，其在其下表面具有背衬膜，该背衬膜具有具有预定压缩性的第一中心部分和具有与第一部分不同的可压缩性的第二周边部分。 另一种不均匀的表面结构意味着改变对晶片的力包括晶片载体，其在其下表面上具有围绕载体周边的凸起的周向区域。
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