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    Apparatus for separating wafers from polishing pads used in chemical-mechanical planarization of semiconductor wafers
    1.
    发明授权
    Apparatus for separating wafers from polishing pads used in chemical-mechanical planarization of semiconductor wafers 失效
    用于将晶片与用于半导体晶片的化学机械平面化的抛光垫分离的装置

    公开(公告)号：US5882248A

    公开(公告)日：1999-03-16

    申请号：US910693

    申请日：1997-08-13

    申请人： David Q. Wright ,  Mike Walker ,  Karl M. Robinson

    发明人： David Q. Wright ,  Mike Walker ,  Karl M. Robinson

    IPC分类号： B24B37/34 ,  B24B5/00

    CPC分类号： B24B37/345 ,  Y10S451/921

    摘要： The present invention is a planarizing machine for use in chemical-mechanical planarization of semiconductor wafers that has a moveable platen, a polishing pad, a wafer carrier, and a wafer separator. The polishing pad is positioned on the platen, and it has a planarizing surface with an operational zone upon which the wafer may be planarized. The wafer carrier holds a wafer and is positionable opposite the polishing pad to engage the wafer with the operational zone of the polishing pad. The wafer separator engages either the polishing pad, the wafer, or the wafer carrier to urge a portion of the wafer away from the pad.

    摘要翻译： 本发明是一种用于半导体晶片的化学机械平面化的平面化机器，其具有可移动的压板，抛光垫，晶片载体和晶片分离器。 抛光垫定位在压板上，并且其具有平面化表面，其具有操作区域，晶片可以在其上被平坦化。 晶片载体保持晶片并且可与抛光垫相对定位以将晶片与抛光垫的操作区接合。 晶片分离器接合抛光垫，晶片或晶片载体以将晶片的一部分远离焊盘。

    Apparatus for separating wafers from polishing pads used in chemical-mechanical planarization of semiconductor wafers
    2.
    发明授权
    Apparatus for separating wafers from polishing pads used in chemical-mechanical planarization of semiconductor wafers 失效
    用于将晶片与用于半导体晶片的化学机械平面化的抛光垫分离的装置

    公开(公告)号：US5658190A

    公开(公告)日：1997-08-19

    申请号：US573430

    申请日：1995-12-15

    申请人： David Q. Wright ,  Mike Walker ,  Karl M. Robinson

    发明人： David Q. Wright ,  Mike Walker ,  Karl M. Robinson

    IPC分类号： B24B37/34 ,  B24B5/00 ,  B24B29/00

    CPC分类号： B24B37/345 ,  Y10S451/921

    摘要： The present invention is a planarizing machine for use in chemical-mechanical planarization of semiconductor wafers that has a moveable platen, a polishing pad, a wafer carrier, and a wafer separator. The polishing pad is positioned on the platen, and it has a planarizing surface with an operational zone upon which the wafer may be planarized. The wafer carrier holds a wafer and is positionable opposite the polishing pad to engage the wafer with the operational zone of the polishing pad. The wafer separator engages either the polishing pad, the wafer, or the wafer carrier to urge a portion of the wafer away from the pad.

    摘要翻译： 本发明是一种用于半导体晶片的化学机械平面化的平面化机器，其具有可移动的压板，抛光垫，晶片载体和晶片分离器。 抛光垫定位在压板上，并且其具有平面化表面，其具有操作区域，晶片可以在其上被平坦化。 晶片载体保持晶片并且可与抛光垫相对定位以将晶片与抛光垫的操作区接合。 晶片分离器接合抛光垫，晶片或晶片载体以将晶片的一部分远离焊盘。

    Commutator truing lathe
    4.
    发明授权
    Commutator truing lathe 失效
    换向器车床

    公开(公告)号：US5203243A

    公开(公告)日：1993-04-20

    申请号：US617117

    申请日：1990-11-21

    申请人： Mike Walker

    发明人： Mike Walker

    IPC分类号： B23B5/00

    CPC分类号： B23B5/00 ,  Y10T82/24 ,  Y10T82/2522

    摘要： A truing lathe has its components mounted on a base. A pair of stands for holding the workpiece are mounted on the base. The stands have a pair of notches where the workpiece rests and is rotatable therein. An electric motor with a pulley head is mounted on one of the stands and below the notches so that the motor drive shaft aligns with the axis of rotation of the workpiece. One loop of a stretchable endless belt is slipped over the midsection of the workpiece while the other loop is stretched to fit around the drive pulley. The cutting bit is mounted on separate longitudinally and transversely moveable blocks so that the bit can be adjusted radially and longitudinally relative to the axis of rotation of the workpiece to machine the workpiece. The mounting stand and the way the workpiece is rotated results in minimal precession of the workpiece on the lathe to allow for a closer and truer machining of the workpiece. The lathe is compactly built and can be powered by batteries under field conditions to repair electric motors used in radio controlled model cars. The type of electric motor used to run the lathe is the same type of electric motor used to power radio controlled model cars. The lathe also can be used in the hobbyist's shop.

    摘要翻译： 修整车床的组件安装在基座上。 用于保持工件的一对支架安装在基座上。 支架具有一对凹口，其中工件搁置并且可在其中旋转。 具有滑轮头的电动机安装在一个支架上并且在凹口下方，使得电动机驱动轴与工件的旋转轴线对准。 可伸缩环形带的一个环被滑过工件的中部，而另一个环被拉伸以适合于驱动滑轮周围。 切割头安装在分开的纵向和横向可移动块上，使得钻头可相对于工件的旋转轴线径向和纵向调节以加工工件。 安装支架和工件的旋转方式使得工件在车床上的进动最小化，从而可以更加逼真地对工件进行加工。 车床结构紧凑，可在现场条件下由电池供电，以修复无线电控制车型中使用的电动马达。 用于运行车床的电动机的类型是用于为无线电控制的模型车辆供电的相同类型的电动机。 车床也可以在爱好者的店里使用。

    Workspace partition system
    5.
    发明授权
    Workspace partition system 有权
    工作区分区系统

    公开(公告)号：US06253509B1

    公开(公告)日：2001-07-03

    申请号：US09373737

    申请日：1999-08-13

    申请人： John Hellwig ,  Steven Verbeek ,  Mike Walker ,  John Francis Gill ,  Randy Joseph Verhasselt ,  Errol Stafford Pearsons

    发明人： John Hellwig ,  Steven Verbeek ,  Mike Walker ,  John Francis Gill ,  Randy Joseph Verhasselt ,  Errol Stafford Pearsons

    IPC分类号： E04H100

    CPC分类号： E04B2/7422 ,  E04B2002/7462 ,  E04B2002/7488 ,  E04B2002/749

    摘要： A workspace partition system, for example, for an office building includes a relocatable cable raceway that can be positioned selectively at the belt line or at the baseline of a wall panel of the system depending on where power and data communications are required. Each wall panel of the system includes a structural frame. A raceway element can be selectively coupled to the frame in co-operation with any transverse member of the frame. Front and rear cover plates can be attached to mechanically protect cabling within the raceway. This design allows the panel to be reconfigured on site to change the location of the raceway.

    摘要翻译： 例如，用于办公楼的工作空间分区系统包括可重定位的电缆轨道，其可以根据需要在哪里进行电力和数据通信，被选择性地定位在系统的皮带线路或系统的墙板的基线处。 系统的每个墙板包括一个结构框架。 轨道元件可以与框架的任何横向构件协作选择性地联接到框架。 前盖板和后盖板可以连接到机械保护滚道内的布线。 此设计允许在现场重新配置面板以更改滚道的位置。