摘要:
A diode-laser bar package includes two diode-laser bars mounted on a heat sink with slow-axes of the diode-laser bars aligned. Three spaced apart mounting bosses extend from the front of the heat sink. The package includes two cylindrical lens assemblies. Each lens assembly has an elongated cylindrical lens bonded to a rectangular mounting block. The cylindrical lenses are aligned with the diode-laser bars. Lateral faces of the mounting block are epoxy-bonded to lateral faces of the mounting bosses. Bonding is effected by injecting liquid epoxy between the faces to be bonded though holes extending through the mounting blocks from front to the lateral faces of the mounting blocks. The liquid epoxy is then cured to complete the attachment.
摘要:
A diode-laser bar package includes two diode-laser bars mounted on a heat sink with slow-axes of the diode-laser bars aligned. Three spaced apart mounting bosses extend from the front of the heat sink. The package includes two cylindrical lens assemblies. Each lens assembly has an elongated cylindrical lens bonded to a rectangular mounting block. The cylindrical lenses are aligned with the diode-laser bars. Lateral faces of the mounting block are epoxy-bonded to lateral faces of the mounting bosses. Bonding is effected by injecting liquid epoxy between the faces to be bonded though holes extending through the mounting blocks from front to the lateral faces of the mounting blocks. The liquid epoxy is then cured to complete the attachment.
摘要:
A directly cooled diode-laser bar package includes a diode-laser bar bonded to a heat-sink. The operating temperature of the diode-laser bar can be selectively varied by varying the thermal impedance of the heat-sink in or near a region of the heat-sink on which the diode-laser bar is bonded. The thermal impedance is selectively varied by varying the insertion depth of screws inserted into corresponding screw holes extending into the heat-sink close to or immediately adjacent the region on which the diode-laser bar is bonded.
摘要:
It is demonstrated that substantial operating-parameter-dependent temperature-differences can exist between diode-laser bars in pulsed operation of a stack of such bars arranged to provide a two-dimensional array of diode-laser emitters. These differences can produce distortion of the aggregate output spectrum of the stack. By selecting particular nominal emitting wavelengths of the diode-laser bars for specific positions in the stack, the aggregate emission-spectrum can be tailored to a desired shape for one or more sets of operating parameters of the stack.
摘要:
It is demonstrated that substantial operating-parameter-dependent temperature-differences can exist between diode-laser bars in pulsed operation of a stack of such bars arranged to provide a two-dimensional array of diode-laser emitters. These differences can produce distortion of the aggregate output spectrum of the stack. By selecting particular nominal emitting wavelengths of the diode-laser bars for specific positions in the stack, the aggregate emission-spectrum can be tailored to a desired shape for one or more sets of operating parameters of the stack.
摘要:
A directly cooled diode-laser bar package includes a diode-laser bar bonded to a heat-sink. The operating temperature of the diode-laser bar can be selectively varied by varying the thermal impedance of the heat-sink in or near a region of the heat-sink on which the diode-laser bar is bonded. The thermal impedance is selectively varied by varying the insertion depth of screws inserted into corresponding screw holes extending into the heat-sink close to or immediately adjacent the region on which the diode-laser bar is bonded.
摘要:
A diode-laser having an elongated diode-laser emitter is mounted on a relatively massive heat-sink. Two parallel grooves are machined into the heat-sink to leave a relatively narrow elongated ridge of the heat-sink between the grooves. The ridge has a width about equal to or narrower that the width of the emitter. The diode-laser is mounted on the heat-sink such that thermal communication between the emitter and heat-sink is essentially limited to thermal communication with the ridge.
摘要:
Laser treatment apparatus includes one diode-laser providing infrared radiation for the treatment and another diode-laser for providing visible radiation. A lens launches the infrared and visible radiations from the diode-lasers into the entrance face of the optical fiber for transporting the radiations to a treatment location.
摘要:
Laser treatment apparatus includes one diode-laser providing infrared radiation for the treatment and another diode-laser for providing visible radiation. A lens launches the infrared and visible radiations from the diode-lasers into the entrance face of the optical fiber for transporting the radiations to a treatment location.
摘要:
A diode-laser having an elongated diode-laser emitter is mounted on a relatively massive heat-sink. Two parallel grooves are machined into the heat-sink to leave a relatively narrow elongated ridge of the heat-sink between the grooves. The ridge has a width about equal to or narrower that the width of the emitter. The diode-laser is mounted on the heat-sink such that thermal communication between the emitter and heat-sink is essentially limited to thermal communication with the ridge.