Automatic focused ion beam imaging system and method
    2.
    发明授权
    Automatic focused ion beam imaging system and method 有权
    自动聚焦离子束成像系统及方法

    公开(公告)号:US06453063B1

    公开(公告)日:2002-09-17

    申请号:US09238435

    申请日:1999-01-28

    IPC分类号: G06K900

    摘要: A method of imaging an integrated circuit using a focused ion beam system is presented. According to the method an integrated circuit is imaged in plan-view using a focused ion beam system. Circuit information is then extracted absent processing. In another embodiment, a method and system for imaging an entire IC automatically without removing the IC from the imaging system and requiring minimal operator intervention is presented. The method employs a focused ion beam system to image an exposed layer of an integrated circuit and then to etch a portion of the exposed layer in situ. Imaging and etching are repeated until substantially the entire integrated circuit is imaged. A processor is used to assemble the layers into a three-dimensional topography of the integrated circuit. Because of known relationships between layers, the mosaicing is facilitated and the final topography is more reliable than those produced by currently known computer implemented methods.

    摘要翻译: 提出了一种使用聚焦离子束系统对集成电路进行成像的方法。 根据该方法,使用聚焦离子束系统在平面图中成像集成电路。 然后在没有处理的情况下提取电路信息。 在另一个实施例中,提出了一种用于自动成像整个IC而不从成像系统中移除IC并且需要最小的操作者干预的方法和系统。 该方法采用聚焦离子束系统来对集成电路的暴露层进行成像,然后原位蚀刻暴露层的一部分。 重复成像和蚀刻,直到基本上整个集成电路被成像。 处理器用于将层组装成集成电路的三维形貌。 由于层之间已知的关系,便于马赛克化,并且最终的形貌比目前已知的计算机实现的方法产生的形状更可靠。