公开(公告)号：US20090145576A1

公开(公告)日：2009-06-11

申请号：US11719520

申请日：2006-08-10

申请人： David W. Wyrick ,  Daniel M. Hartmann ,  Joshua T. Nevill ,  Mehul Patell ,  Michael G. Pollack ,  Gregory A. Votaw ,  Hugh C. Crenshaw

发明人： David W. Wyrick ,  Daniel M. Hartmann ,  Joshua T. Nevill ,  Mehul Patell ,  Michael G. Pollack ,  Gregory A. Votaw ,  Hugh C. Crenshaw

IPC分类号： F28F27/00 ,  B01J19/00

CPC分类号： B01L3/502715 ,  B01J19/0093 ,  B01J2219/00783 ,  B01J2219/00822 ,  B01J2219/00831 ,  B01J2219/00873 ,  B01J2219/00891 ,  B01J2219/0095 ,  B01J2219/00961 ,  B01L3/502707 ,  B01L3/50273 ,  B01L3/565 ,  B01L7/00 ,  B01L9/527 ,  B01L2200/147 ,  B01L2300/1822 ,  B01L2300/1827 ,  B01L2400/0487 ,  F28F3/02

摘要： An actively temperature regulated microfluidic chip assembly includes a first thermally conductive body, a second thermally conductive body attached to the first thermally conductive body, a microfluidic chip encapsulated between the first and second thermally conductive bodies, and a temperature regulating element mounted to the first thermally conductive body for adding heat to or alternately removing heat from the chip. The temperature of the chip and thus the liquid contained and/or flowing therein can be regulated by measuring the temperature of the liquid and operating the temperature regulating element to establish a thermal gradient toward or alternately away from the liquid based on the measured temperature and in comparison with a desired set point temperature.

摘要翻译： 主动温度调节的微流体芯片组件包括第一导热体，连接到第一导热体的第二导热体，封装在第一和第二导热体之间的微流体芯片，以及安装在第一导热体上的温度调节元件 导电体，用于向芯片加热或交替地从芯片中去除热量。 可以通过测量液体的温度和操作温度调节元件来调节芯片的温度，从而使其中含有和/或流过的液体的温度基于测量的温度和/或在 与所需设定点温度进行比较。