公开(公告)号：US09805956B2

公开(公告)日：2017-10-31

申请号：US13747774

申请日：2013-01-23

申请人： Dawei Xing ,  Jie Liu ,  Hong Wei Guan ,  Yue Gen Yu ,  Seow Kiang Khoo

发明人： Dawei Xing ,  Jie Liu ,  Hong Wei Guan ,  Yue Gen Yu ,  Seow Kiang Khoo

IPC分类号： H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L23/495 ,  H01L23/498 ,  H05K1/02

CPC分类号： H01L21/4828 ,  H01L21/561 ,  H01L23/3121 ,  H01L23/49558 ,  H01L23/49582 ,  H01L23/49861 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H05K1/02 ,  H01L2924/00014 ,  H01L2924/00

摘要： Disclosed is a method of manufacturing a lead frame, which comprises the steps of: providing an electrically-conductive base material having first and second planar sides; forming a plurality of conductive contact points on the first planar side of the base material; providing a non-conductive filling material over the first planar side of the base material so that the filling material fills spaces in-between the plurality of contact points to a form a layer comprising the filling material and the plurality of contact points; and etching the second planar side of the base material to expose a pattern of the filling material from the second planar side of the base material and to thereby form a plurality of isolated conductive regions on the second planar side of the base material, each isolated conductive region being connected with at least a respective one of the plurality of contact points on the first planar side of the base material. A lead frame structure is also disclosed.

公开(公告)号：US09202712B2

公开(公告)日：2015-12-01

申请号：US14158321

申请日：2014-01-17

申请人： Dawei Xing ,  Jie Liu ,  Hong Wei Guan ,  Yue Gen Yu ,  Seow Kiang Khoo

发明人： Dawei Xing ,  Jie Liu ,  Hong Wei Guan ,  Yue Gen Yu ,  Seow Kiang Khoo

IPC分类号： H01L21/00 ,  H01L21/48 ,  H01L23/495 ,  H01L23/498 ,  H01L23/00 ,  H01L23/31 ,  H01L21/56

CPC分类号： H01L21/4828 ,  H01L21/561 ,  H01L23/3121 ,  H01L23/49548 ,  H01L23/49582 ,  H01L23/49861 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00012

摘要： A method of manufacturing a lead frame, comprising the steps of: providing an electrically-conductive base material having first and second planar sides; forming a patterned conductive layer on the first planar side of the base material; etching the second planar side of the base material at portions with respect to exposed portions on the first planar side of the base material comprising the patterned conductive layer, to form partially-etched portions on the second planar side of the base material; providing a non-conductive filling material over the second planar side of the base material, wherein the filling material fills spaces inside the partially-etched portions on the second planar side of the base material to form adjacent portions of the filling material and a plurality of conductive portions on the second planar side of the base material; and etching the exposed portions of the first planar side of the base material comprising the patterned conductive layer to form partially-etched portions on the first planar side of the base material that combine with the partially-etched portions on the second planar side of the base material to thereby form a plurality of separate conductive regions on the first planar side of the base material, each conductive region being electrically conductive with at least a respective one of the plurality of conductive portions on the second planar side of the base material.

摘要翻译： 一种制造引线框架的方法，包括以下步骤：提供具有第一和第二平面侧面的导电基材; 在基材的第一平面侧上形成图案化的导电层; 在相对于包括图案化导电层的基材的第一平面侧上的暴露部分的部分处蚀刻基材的第二平面侧，以在基材的第二平面侧上形成部分蚀刻部分; 在所述基材的所述第二平面侧上设置不导电的填充材料，其中所述填充材料填充所述基材的所述第二平面侧上的部分蚀刻部分内的空间，以形成所述填充材料的相邻部分， 在基材的第二平面侧的导电部分; 并且蚀刻包括图案化导电层的基材的第一平面侧的暴露部分，以在基材的第一平面侧上形成部分蚀刻部分，其与基底的第二平面侧上的部分蚀刻部分组合 从而在基材的第一平面侧上形成多个单独的导电区域，每个导电区域与基材的第二平面侧上的多个导电部分中的至少一个导电部分导电。