公开(公告)号：US20150337857A1

公开(公告)日：2015-11-26

申请号：US14573663

申请日：2014-12-17

Applicant: DELTA ELECTRONICS, INC.

Inventor： Chao-Wen LU ,  Chun-Chih WANG ,  Ding-Wei CHIU

IPC: F04D29/52 ,  F04D29/60 ,  F04D13/06

CPC classification number: F04D29/522 ,  F04D13/0606 ,  F04D25/0613 ,  F04D29/4226 ,  F04D29/441 ,  F04D29/60 ,  F04D29/626 ,  F05D2260/601

Abstract: A fan device includes a bottom shell, a cover, and an impeller. The cover includes a main body, a support, and a spoiler. The main body has a through opening. A connection position between the support and the main body has a first folding line. The support is bended along the first folding line to form a portion of the through opening. The support is perpendicular to the main body, and is abutted against the bottom shell. A connection position between the spoiler and the main body has a second folding line. The spoiler is bended along the second folding line to locate in the through opening. An acute angle is formed between the spoiler and the surface of the main body facing away from the bottom shell. The impeller is located in an accommodating space between the cover and the bottom shell.

Abstract translation: 风扇装置包括底壳，盖和叶轮。 盖子包括主体，支架和扰流器。 主体有通孔。 支撑体和主体之间的连接位置具有第一折叠线。 支撑件沿着第一折叠线弯曲以形成通孔的一部分。 支撑件垂直于主体，并且抵靠着底壳。 扰流器和主体之间的连接位置具有第二折叠线。 扰流板沿着第二条折叠线弯曲以定位在通孔中。 在扰流器和主体的远离底壳的表面之间形成锐角。 叶轮位于盖和底壳之间的容纳空间中。

公开(公告)号：US20150177795A1

公开(公告)日：2015-06-25

申请号：US14463275

申请日：2014-08-19

Applicant: DELTA ELECTRONICS, INC.

Inventor： Chao-Wen LU ,  Chun-Chih WANG ,  Ding-Wei CHIU

IPC: G06F1/20 ,  H05K7/20

CPC classification number: H05K7/20136 ,  G06F1/203 ,  H05K7/20154 ,  H05K7/2049

Abstract: A heat dissipating device for dissipating the heat produced by a heating element is disclosed. The heat dissipating device includes a fixing assembly, two moving assemblies and an elastic assembly. The fixing assembly has a thermal conductive member. Each moving assembly has a mass body and is relatively moveable with respect to the fixing assembly. The two moving assemblies are disposed on two opposite sides of the fixing assembly, respectively, and each moving assembly forms a moving space with respect to the fixing assembly. The elastic assembly connects the fixing assembly to the two moving assemblies.

Abstract translation: 公开了一种用于耗散由加热元件产生的热量的散热装置。 散热装置包括固定组件，两个移动组件和弹性组件。 固定组件具有导热构件。 每个移动组件具有质量体并且相对于固定组件相对可移动。 两个移动组件分别设置在固定组件的两个相对侧上，并且每个移动组件相对于固定组件形成移动空间。 弹性组件将固定组件连接到两个移动组件。

公开(公告)号：US20170184117A1

公开(公告)日：2017-06-29

申请号：US15218325

申请日：2016-07-25

Applicant: Delta Electronics, Inc.

Inventor： Chao-Wen LU ,  Chun-Chih WANG ,  Ding-Wei CHIU

IPC: F04D29/28 ,  F04D17/16 ,  F04D29/30 ,  F04D25/02 ,  F04D29/42

CPC classification number: F04D29/282 ,  F04D25/0613 ,  F04D29/30

Abstract: A centrifugal blower is provided. The centrifugal blower includes a hub, a shaft, a motor, a plurality of blades, a rib, and a first fin. The shaft is connected to the hub. The motor rotates the shaft. Each blade includes a rib and a first fin. The rib is connected to the hub, wherein the rib extends from the hub to an end of the blade. The first fin is disposed on a first side of the rib and connected to the hub, wherein the first fin includes a first surface, the rib protrudes from the first surface, and the thickness of the first fin is less than the thickness of the rib.

公开(公告)号：US20160064131A1

公开(公告)日：2016-03-03

申请号：US14839587

申请日：2015-08-28

Applicant: DELTA ELECTRONICS, INC.

Inventor： Chao-Wen LU ,  Chun-Chih WANG ,  Ding-Wei CHIU ,  Chung-Hung TANG

IPC: H01F7/06 ,  H01F27/28 ,  H05K7/20

CPC classification number: H01F27/085 ,  H01L23/427 ,  H05K7/20 ,  H05K7/20172

Abstract: A heat dissipation device is applied to an electronic device and comprises a heat conduction plate, at least an induction coil and a first heat dissipation plate. The heat conduction plate receives the heat provided by a heat source and includes a first contact element disposed on a first surface of the heat conduction plate. The induction coil is disposed at the heat conduction plate. The first heat dissipation plate is disposed at the first contact element of the heat conduction plate. The first heat dissipation plate and the heat conduction plate form a gap. The first heat dissipation plate includes at least a first magnetic element disposed opposite the induction coil.

Abstract translation: 散热装置被应用于电子装置，并且包括至少感应线圈和第一散热板的导热板。 导热板接受由热源提供的热量，并且包括设置在导热板的第一表面上的第一接触元件。 感应线圈设置在导热板上。 第一散热板设置在导热板的第一接触元件处。 第一散热板和导热板形成间隙。 第一散热板至少包括与感应线圈相对设置的第一磁性元件。