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公开(公告)号：US20230216375A1
公开(公告)日：2023-07-06
申请号：US18181868
申请日：2023-03-10
Applicant: Delta Electronics, Inc.
Inventor： Chin-Chun LAI , Chao-Wen LU
IPC: H02K7/14 , H02K3/47 , H02K11/30 , F04D25/06 , F04D25/08 , F04D29/056 , F04D29/28 , H02K1/12 , H02K1/27 , H02K7/08 , H02K11/33 , F04D29/52
CPC classification number: H02K7/14 , H02K3/47 , H02K11/30 , F04D25/06 , F04D25/08 , F04D29/056 , F04D29/281 , H02K1/12 , H02K1/27 , H02K7/08 , H02K11/33 , F04D29/522 , F04D25/0653 , H02K2211/03 , F04D19/002
Abstract: A micro fan is provided. The micro fan includes a rotor and a stator. The stator includes a plurality of axial induced coil units and a circuit board. The axial induced coil units are respectively preformed as a plurality of stator magnetic pole units, and are coupled to the circuit board. At least one of the coil units includes a coil and insulation material. The insulation material is block-shaped and covers at least a portion of the coil, and the central axis of the coil is parallel to the shaft of the rotor.
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公开(公告)号：US20160064131A1
公开(公告)日：2016-03-03
申请号：US14839587
申请日：2015-08-28
Applicant: DELTA ELECTRONICS, INC.
Inventor： Chao-Wen LU , Chun-Chih WANG , Ding-Wei CHIU , Chung-Hung TANG
CPC classification number: H01F27/085 , H01L23/427 , H05K7/20 , H05K7/20172
Abstract: A heat dissipation device is applied to an electronic device and comprises a heat conduction plate, at least an induction coil and a first heat dissipation plate. The heat conduction plate receives the heat provided by a heat source and includes a first contact element disposed on a first surface of the heat conduction plate. The induction coil is disposed at the heat conduction plate. The first heat dissipation plate is disposed at the first contact element of the heat conduction plate. The first heat dissipation plate and the heat conduction plate form a gap. The first heat dissipation plate includes at least a first magnetic element disposed opposite the induction coil.
Abstract translation: 散热装置被应用于电子装置，并且包括至少感应线圈和第一散热板的导热板。 导热板接受由热源提供的热量，并且包括设置在导热板的第一表面上的第一接触元件。 感应线圈设置在导热板上。 第一散热板设置在导热板的第一接触元件处。 第一散热板和导热板形成间隙。 第一散热板至少包括与感应线圈相对设置的第一磁性元件。
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公开(公告)号：US20140226282A1
公开(公告)日：2014-08-14
申请号：US14175368
申请日：2014-02-07
Applicant: Delta Electronics, Inc.
Inventor： Chung-Hung TANG , Shih-Chou CHEN , Chun-Lung CHIU , Chao-Wen LU , Chun-Nan LIN , Fu-Mei HSU
IPC: H05K7/20
CPC classification number: G06F1/203 , H05K7/20172
Abstract: A heat dissipating apparatus includes a frame, an elastic body, a magnetic member and a coil. The frame has an opening. The elastic body is disposed on the frame, and the frame and the elastic body define a space. The magnetic member is located corresponding to the space and disposed at one side of the elastic body. The coil is located corresponding to the periphery of the space and disposed on the frame. An electronic device with the heat dissipating apparatus is also disclosed.
Abstract translation: 散热装置包括框架，弹性体，磁性构件和线圈。 框架有一个开口。 弹性体设置在框架上，框架和弹性体限定空间。 磁性构件对应于空间并且设置在弹性体的一侧。 线圈对应于空间的周边并且设置在框架上。 还公开了一种具有散热装置的电子装置。
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公开(公告)号：US20210003136A1
公开(公告)日：2021-01-07
申请号：US17025994
申请日：2020-09-18
Applicant: Delta Electronics, Inc.
Inventor： Chao-Wen LU , Chih-Wei CHAN , Che-Wei LEE
Abstract: A micro fan is provided. The micro fan includes a rotor and a stator. The stator includes an axial induced coil unit and a circuit board. The axial induced coil unit is made by twining a coil in an axial direction for at least two layers and in a radial direction for at least two layers.
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公开(公告)号：US20190296607A1
公开(公告)日：2019-09-26
申请号：US16437761
申请日：2019-06-11
Applicant: Delta Electronics, Inc.
Inventor： Chin-Chun LAI , Kun-Fu CHUANG , Chao-Wen LU
IPC: H02K7/14 , H02K3/47 , F04D29/056 , F04D25/06 , F04D25/08 , F04D29/28 , H02K11/33 , H02K1/12 , H02K1/27 , H02K7/08 , H02K11/30 , F04D29/52
Abstract: A micro fan is provided. The micro fan includes a rotor and a stator. The stator includes a plurality of axial induced coil units and a circuit board. The axial induced coil units are respectively preformed as a plurality of stator magnetic pole units, and are coupled to the circuit board. At least one of the coil units includes a coil and insulation material. The insulation material is block-shaped and covers at least a portion of the coil, and the central axis of the coil is parallel to the shaft of the rotor.
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Patent Agency Ranking
公开(公告)号：US20180026495A1
公开(公告)日：2018-01-25
申请号：US15467285
申请日：2017-03-23
Applicant: Delta Electronics, Inc.
Inventor： Chao-Wen LU , Che-Wei LEE , Chung-Chiao TAN
Abstract: A micro fan is provided. The micro fan includes a rotor and a stator. The stator includes an axial induced coil unit and a circuit board. The axial induced coil unit is made by twining a coil in an axial direction for at least two layers and in a radial direction for at least two layers.
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公开(公告)号：US20150110648A1
公开(公告)日：2015-04-23
申请号：US14283040
申请日：2014-05-20
Applicant: Delta Electronics, Inc.
Inventor： Chao-Wen LU , Chun-Chih WANG
CPC classification number: F04D25/062 , F04D17/16
Abstract: A thin type fan includes an impeller and a motor. The impeller includes a hub and a blade structure disposed around the hub. The motor includes a stator structure, a magnetic assembly, a bearing structure and a rotational shaft. The motor drives the impeller to rotate. The magnetic assembly is disposed within the hub and around the stator structure. The magnetic assembly includes a magnet and a magnetically permeable shell. The bearing structure includes a bearing seat and a single ball bearing. The single ball bearing is disposed in the bearing seat and forms an accommodating space, and the rotational shaft is disposed in the accommodating space.
Abstract translation: 薄型风扇包括叶轮和电动机。 叶轮包括轮毂和围绕轮毂设置的叶片结构。 电动机包括定子结构，磁性组件，轴承结构和旋转轴。 电机驱动叶轮旋转。 磁性组件设置在毂内且围绕定子结构。 磁性组件包括磁体和可磁化的外壳。 轴承结构包括轴承座和单个球轴承。 单个滚珠轴承设置在轴承座中并形成容纳空间，并且旋转轴设置在容纳空间中。
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公开(公告)号：US20230341062A1
公开(公告)日：2023-10-26
申请号：US17993858
申请日：2022-11-23
Applicant: DELTA ELECTRONICS, INC.
Inventor： Chao-Wen LU
CPC classification number: F16K27/067 , F16K5/0605 , F16K5/0647
Abstract: This disclosure is directed to a ball valve having an outer valve body, a valve core, a rotational assembly, and a functional assembly. The valve core is accommodated in the outer valve body, and the valve core has a flow channel defined therein. The rotational assembly is connected to the valve core for turning the valve core. A portion of the functional assembly is disposed in the flow channel.
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公开(公告)号：US20190383566A1
公开(公告)日：2019-12-19
申请号：US16557470
申请日：2019-08-30
Applicant: DELTA ELECTRONICS, INC.
Inventor： Chao-Wen LU
Abstract: A heat sink includes a heat conduction portion and a heat dissipation portion. The heat conduction portion contacts a heat source with a flat form. The heat dissipation portion is extended outward from at least one side of the thickness of the heat conduction portion and parallel to the heat conduction portion. The heat dissipation portion includes at least a first branch extended from the heat conduction portion and at least a second branch extended from the first branch.
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公开(公告)号：US20170156236A1
公开(公告)日：2017-06-01
申请号：US15094266
申请日：2016-04-08
Applicant: DELTA ELECTRONICS, INC.
Inventor： Chao-Wen LU
CPC classification number: F28F13/06 , F28D15/00 , F28D2021/0028 , F28F3/086 , F28F3/12 , F28F9/001 , F28F9/005 , F28F2250/08 , G06F1/203 , G06F2200/201
Abstract: A heat dissipation device includes a first casing, a second casing, a thin pump, and a cooling member. The second casing is connected to the first casing to form a first accommodating space and a second accommodating space adjacent to and communicating with the first accommodating space. The thin pump is disposed in the first accommodating space. The cooling member is disposed in the second accommodating space and has a plurality of spacers, and the spacers and the thin pump are disposed on the same plane of the first casing. A portable electronic device having the heat dissipation device is also disclosed.
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