公开(公告)号：US20040171315A1

公开(公告)日：2004-09-02

申请号：US10746192

申请日：2003-12-26

Applicant: Delta Electronics Inc.

Inventor： Pei-Sheng Liao ,  Jui-Yuan Hsu ,  Bay Shao-Ru Su

IPC: H01R013/42

CPC classification number: H01R12/7023 ,  H01R12/7058 ,  H05K3/306 ,  H05K3/308 ,  H05K2201/0311 ,  H05K2201/10568 ,  H05K2201/1059 ,  H05K2201/10651 ,  H05K2201/1084 ,  H05K2201/10856 ,  H05K2203/167

Abstract: A joint structure of electronic element for linking circuit board and electronic element is provided. The joint structure of an electronic element for being electrically connected to a circuit board has at least one slot positioned thereon. And, the joint structure of the electronic element includes: at least one terminal which has a curved portion including a deflected angle with a normal line of a plane of the circuit board, wherein when the joint structure of the electronic element is connected with the slot, the terminal produces an elastic stress through suffering a jostle from the slot so as to urge against the slot for forming an electrical connection therebetween.

Abstract translation: 提供了用于连接电路板和电子元件的电子元件的接合结构。 用于电连接到电路板的电子元件的接合结构具有至少一个位于其上的槽。 并且，电子元件的接合结构包括：至少一个端子，其具有包括与电路板的平面的法线的偏转角度的弯曲部分，其中当电子元件的接合结构与槽 ，终端通过从槽中穿过约束而产生弹性应力，以便推动抵靠槽以在它们之间形成电连接。

公开(公告)号：US20040252457A1

公开(公告)日：2004-12-16

申请号：US10691647

申请日：2003-10-24

Applicant: Delta Electronics, Inc.

Inventor： Hung-Chang Hsieh ,  Chih-Chi Wu ,  Jui-Yuan Hsu ,  Chih-Jen Chen ,  Min-Kuang Chang

IPC: H05K007/20

CPC classification number: H05K7/20909 ,  G06F1/20

Abstract: A heat-dispersing module of an electronic device is disclosed. The heat-dispersing module includes: a housing having a top surface, a bottom surface, a first side surface and a second side surface, wherein the first side surface is opposite to the second side surface; a heat-dispersing fan mounted on the first side surface of the housing; a first vent area disposed on the second side surface of the housing; a second vent area disposed on the top surface of the housing; and a printed circuit board positioned in the housing, thereby a first airflow channel is formed between the top surface of the housing and the printed circuit board and a second airflow channel is formed between the bottom surface of the housing and the printed circuit board, wherein the printed circuit board produces a relatively higher heat at the second airflow channel than the first airflow channel and a distance of the second airflow channel from the printed circuit board to the bottom surface is relatively larger than that of the first airflow channel from the printed circuit board to the top surface.

Abstract translation: 公开了一种电子设备的散热模块。 散热模块包括：壳体，其具有顶表面，底表面，第一侧表面和第二侧表面，其中第一侧表面与第二侧表面相对; 安装在所述壳体的所述第一侧表面上的散热风扇; 设置在所述壳体的第二侧表面上的第一通气区域; 设置在所述壳体的顶表面上的第二通气区域; 以及位于壳体中的印刷电路板，由此在壳体的顶表面和印刷电路板之间形成第一气流通道，并且在壳体的底表面和印刷电路板之间形成第二气流通道，其中 印刷电路板在第二气流通道处产生比第一气流通道相对较高的热量，并且第二气流通道从印刷电路板到底面的距离比来自印刷电路的第一气流通道的距离 板到顶面。

公开(公告)号：US20040218360A1

公开(公告)日：2004-11-04

申请号：US10691641

申请日：2003-10-24

Applicant: Delta Electronics, Inc.

Inventor： Hung-Chang Hsieh ,  Chih-Chi Wu ,  Jui-Yuan Hsu ,  Chih-Jen Chen ,  Min-Wen Kao ,  Jen-Chieh Peng

IPC: H05K007/20

CPC classification number: H05K7/20172

Abstract: A heat-dissipating fan module of an electronic apparatus is disclosed. The heat-dissipating fan module includes a casing having an opening, the opening having a guiding device along an edge thereof, and a heat-dissipating fan fixed to one side of the casing and correspondingly disposed on the opening.

Abstract translation: 公开了一种电子设备的散热风扇组件。 散热风扇模块包括具有开口的壳体，该开口具有沿其边缘的引导装置，以及固定在壳体的一侧并相应地设置在开口上的散热风扇。