Abstract:
A method for solderless electrical press-fit contacting of electrically conductive press-fit pins in circuit boards include: providing a circuit board having a thickness, at least one electrical conductor path, and a contacting opening guided perpendicularly through the circuit board and having a metallized inner wall; providing an electrically conductive press-fit pin having a longitudinal axis and having a press-fit region suitable for press-fitting into the contacting opening and having a substantially round cross section; and press-fitting the press-fit pin into the contacting opening by applying onto the press-fit pin a force acting along the longitudinal axis of the press-fit pin, press-fitting being assisted by the application of ultrasound acting on the press-fit pin.
Abstract:
The present disclosure includes an electrical terminal that may include a first portion, a second portion, and/or a middle portion. A middle portion may be disposed between first and second portions and/or a middle portion may include a first middle section, a second middle section, a recessed portion disposed between the first middle section and the second middle section, and/or an aperture. The electrical terminal may include a transition portion that may be disposed between a middle portion and a second portion.
Abstract:
An improved passive electronic stacked component is described. The component has a stack of individual electronic capacitors and a first lead attached to a first side of the stack. A second lead is attached to a second side of the stack. A foot is attached to the first lead and extends inward towards the second lead. A stability pin is attached to one of the foot or the first lead.
Abstract:
Improved pin header assemblies, printed circuit board assemblies and methods of forming the same are disclosed. In an aspect, a method of forming a pin header assembly for use with a printed circuit board is provided. The method includes the step of providing a base formed of an electric insulator. The method further includes the step of forming a plurality of openings through the base. The method further includes the step of inserting a plurality of conductive pins through the openings, wherein a press fit is formed between the conductive pins and the base, and the conductive pins extend from opposite sides of the base.
Abstract:
A terminal includes a first board including an accommodation portion, the accommodation portion being disposed in a first groove of the first board, and a camera module mounted in the accommodation portion. A method for manufacturing a terminal includes obtaining a first board including an accommodation portion, the accommodation portion being disposed in a first groove of the first board, obtaining a camera module to be mounted in the accommodation portion, and mounting the camera module in the accommodation portion.
Abstract:
A pin having a contact part may be inserted into a receiving opening in a printed circuit board and anchored in the receiving opening with a press fit. Also, a method provides for inserting a pin into a receiving opening in a printed circuit board, in which the pin is inserted into the receiving opening from one side of the printed circuit board, and a contact part of the pin is anchored in the receiving opening with a press fit. The contact part is inserted into the receiving opening in a contactless manner or with a sliding fit and is subsequently deformed within the receiving opening by expansion transversally to the insertion direction in order to anchor the contact part in the receiving opening with a press fit.
Abstract:
Exemplary systems and methods for LED light engines include an LED package with electrical leads, each lead forming a compliant portion for making electrical and mechanical connection upon insertion into a receptacle of a circuit substrate. In an illustrative example, the electrical and mechanical connections may be formed upon the insertion of the compliant portion into the receptacle and without further process steps involving solder. Various examples may further include an elongated thermal dissipation member extending from a bottom of a package that contains the LED, where the elongated thermal member (e.g., tab) may be in substantial thermal communication with the LED die. As an example, the tab may provide a substantially reduced thermal impedance for dissipating heat from the LED die. Upon insertion into a circuit substrate, the LED package may be releasable by mechanical extraction without applied heat to facilitate repair or replacement, for example.
Abstract:
A light source unit including light emitting diodes mounted on a printed circuit board by not using a soldering method but a fitting method, and a backlight unit and liquid crystal display including the light source unit. The light source unit includes light emitting diodes including lead terminals and a printed circuit board including a fitting hole. Each of the lead terminals includes a base part and a fitting part protruding from the base part. The fitting part of the light emitting diode is fitted into the fitting hole of the printed circuit board and so that the light emitting diode is mounted on the printed circuit board.
Abstract:
The fixing member of the present invention can be mounted to a fixed member that is fixed to a printed circuit board and that is used for fixing the fixed member to the printed circuit board, the fixing member including: a mounting member main body fixed to the fixed member; male connector portions having at tip ends thereof lug portions that are engaged with an opening edge of an insertion opening in the printed circuit board when inserted into the inserting opening; and contact portions that contact with a soldering land formed at the printed circuit board and are joined to the soldering land by soldering when the lug portions are engaged with the opening edge, the contact portions being formed at the mounting portion main body and the male connector portions extend arm-shaped from the mounting portion main body or from the contact portions.
Abstract:
An electrical connector comprises an insulating housing and a plurality of terminals. The insulating housing has a plurality of terminal passageways, and each of the terminals has a clipping device, a stopping portion, a first flexible arm, a second flexible arm, and a contacting portion. Each clipping device of the terminals is separately held firmly in the containing trough, and the clipping device further comprises a first clipping portion and a second clipping portion. A containing space is formed between the first clipping portion and the second clipping portion, and a solder ball is clipped relatively in the containing space without reflowing the solder ball to the terminal. A top end of the first flexible arm and a top end of the second flexible arm are connected separately with to the contacting portion so that a top end of the terminal is of closed shape and the terminal will not be hooked by external objects.