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171 条记录 (耗时 0.02 秒)

    Structure of light emitting diode and method to assemble thereof
    2.
    发明授权
    Structure of light emitting diode and method to assemble thereof 有权
    发光二极管的结构及其组装方法

    公开(公告)号：US08987770B2

    公开(公告)日：2015-03-24

    申请号：US13095059

    申请日：2011-04-27

    申请人： Sheng-Jia Sheu ,  Chien-Chang Pei

    发明人： Sheng-Jia Sheu ,  Chien-Chang Pei

    IPC分类号： H01L33/36 ,  H05K3/32 ,  H01L33/62 ,  H05K3/20

    CPC分类号： H05K3/326 ,  H01L33/62 ,  H01L2924/0002 ,  H05K3/202 ,  H05K2201/0382 ,  H05K2201/10106 ,  H05K2201/10651 ,  H05K2201/10818 ,  H05K2201/1084 ,  Y10T29/41 ,  H01L2924/00

    摘要： A structure of a light emitting diode is provided. In one aspect, a light emitting diode structure comprises a light emitting diode, a conductive frame, and a substrate. The conductive frame is electrically connected to the light emitting diode and has a fixing hole connecting a first side of the conductive frame and a second side of the conductive frame opposite the first side. The fixing hole has a ladder-shaped inner sidewall with a first radius of the inner sidewall adjacent the first side smaller than a second radius of the inner sidewall adjacent the second side. The substrate has a conductive pillar that is received in the fixing hole by entering the fixing hole from the first side of the conductive frame and deformed such that the conductive pillar adheres to the ladder-shaped inner sidewall of the fixing hole.

    摘要翻译： 提供发光二极管的结构。 在一个方面，发光二极管结构包括发光二极管，导电框架和基板。 导电框架电连接到发光二极管，并且具有连接导电框架的第一侧和导电框架与第一侧相对的第二侧的固定孔。 固定孔具有梯形内侧壁，其内侧壁的第一半径与第一侧相邻，小于邻近第二侧的内侧壁的第二半径。 基板具有通过从导电框架的第一侧进入固定孔而被固定在固定孔中的导电柱，并使其导电柱粘附到固定孔的梯形内侧壁。

    Planar Contact with Solder
    3.
    发明申请
    Planar Contact with Solder 有权
    平面焊接

    公开(公告)号：US20130283608A1

    公开(公告)日：2013-10-31

    申请号：US13926069

    申请日：2013-06-25

    申请人： Interplex Industries, Inc.

    发明人： Jack Seidler

    IPC分类号： H05K3/00

    CPC分类号： H05K3/00 ,  B23K35/0244 ,  H01R12/57 ,  H01R12/707 ,  H01R43/0235 ,  H05K3/3426 ,  H05K3/3478 ,  H05K3/3489 ,  H05K2201/0311 ,  H05K2201/10704 ,  H05K2201/10795 ,  H05K2201/1084 ,  H05K2201/10924 ,  H05K2201/10984 ,  H05K2203/0405 ,  H05K2203/0415 ,  Y02P70/613 ,  Y10T29/49147

    摘要： A method of fixing reflowable elements on electrical contacts. The method includes providing a strip having a number of electrical contacts, each contact including a contact body and a tail portion extending away from the contact body. The tail portions of the contacts are then disposed adjacent an elongate reflowable member. The elongate reflowable member is pushed onto the tail portions of the plurality of contacts. Subsequently, the elongate reflowable member is cut into a plurality of separate reflowable elements, each reflowable element corresponding to one of the tail portions. The electrical contacts with the reflowable element attached thereto are separated from the strip.

    摘要翻译： 将可回流元件固定在电触点上的方法。 该方法包括提供具有多个电触点的条带，每个触点包括接触体和远离接触体延伸的尾部。 然后将触头的尾部设置在细长的可回流构件附近。 细长的可回流构件被推到多个触点的尾部。 随后，细长可回流构件被切割成多个单独的可回流元件，每个可回流元件对应于尾部中的一个。 与附接到其上的可回流元件的电接触与条分离。

    Circuit module
    4.
    发明授权
    Circuit module 有权
    电路模块

    公开(公告)号：US08339800B2

    公开(公告)日：2012-12-25

    申请号：US13024348

    申请日：2011-02-10

    申请人： Yoshihiro Yamaguchi ,  Tomonori Ito

    发明人： Yoshihiro Yamaguchi ,  Tomonori Ito

    IPC分类号： H05K7/12

    CPC分类号： H05K3/3426 ,  H05K1/111 ,  H05K3/341 ,  H05K2201/09381 ,  H05K2201/10371 ,  H05K2201/1084 ,  H05K2203/046 ,  Y02P70/613

    摘要： A circuit module includes a substrate, a component land provided on the substrate, an electronic component bonded to the component land, a case land provided on the substrate, and a case bonded to the case land so as to cover the electronic component. The case includes a top plate, and a leg that extends from a peripheral edge of the top plate in a direction substantially perpendicular to the top plate and that includes a groove in an end surface thereof that is bonded to the case land.

    摘要翻译： 电路模块包括基板，设置在基板上的部件焊盘，接合到部件焊盘的电子部件，设置在基板上的壳体焊盘，以及覆盖电子部件的壳体。 壳体包括顶板和腿部，其从顶板的周缘沿基本上垂直于顶板的方向延伸，并且在其端面中包括接合到壳体平台的凹槽。

    Lead plate and protection circuit module having the same
    6.
    发明申请
    Lead plate and protection circuit module having the same 有权
    引线板和保护电路模块具有相同的功能

    公开(公告)号：US20110151730A1

    公开(公告)日：2011-06-23

    申请号：US12923563

    申请日：2010-09-28

    申请人： Bong-Young Kim ,  Young-Ho Kim

    发明人： Bong-Young Kim ,  Young-Ho Kim

    IPC分类号： H01R13/02

    CPC分类号： H05K3/3426 ,  H01M2/0404 ,  H01M2/22 ,  H01M10/052 ,  H05K3/3405 ,  H05K2201/1034 ,  H05K2201/10757 ,  H05K2201/1084 ,  Y02P70/613

    摘要： A lead plate for connecting a printed circuit board (PCB) of a secondary battery to an bare cell includes a mounting portion connected to the PCB, a joint portion connected to the bare cell, a surface area of the joint portion facing the bare cell being smaller than a surface area of the mounting portion facing the PCB, and a step portion connecting the mounting portion and the joint portion to each other.

    摘要翻译： 用于将二次电池的印刷电路板（PCB）连接到裸电池的引线板包括连接到PCB的安装部分，连接到裸电池的接合部分，与裸电池相对的接合部分的表面区域 小于面向PCB的安装部分的表面积，以及将安装部分和接合部分彼此连接的台阶部分。

    Component for connection to a second component
    7.
    发明授权
    Component for connection to a second component 失效
    用于连接到第二个组件的组件

    公开(公告)号：US07690931B2

    公开(公告)日：2010-04-06

    申请号：US11827536

    申请日：2007-07-12

    申请人： Jürgen Lappöhn

    发明人： Jürgen Lappöhn

    IPC分类号： H01R12/00

    CPC分类号： H01R4/02 ,  H01R12/57 ,  H05K3/3426 ,  H05K2201/10189 ,  H05K2201/1084 ,  Y02P70/613

    摘要： The invention relates to a first component (12, 13, 31, 36a-36c, 50, 62) intended for being connected to a second component (14, 15, 51, 63a-63c). The first component (12, 13, 31, 36a-36c, 50, 62) comprises at least one recess (16, 17, 32, 37a-37c, 52a-52c, 64a-64c) having at least one opening (19, 20, 34, 35, 54a-54c) which will be filled at least in part by the second component (14, 15, 51, 63a-63c) which latter is in a flowing condition during establishment of the connection, at least in the area of the opening (19, 34, 54a-54c). A reduction in cross-section (18, 33, 38a-38c, 53a-53c, 65a-65c) is provided in the recess (16, 17, 32, 37a-37c, 52a-52c, 64a-64c) that will be back-filled by the second component (14, 15, 51, 63a-63c) during establishment of the connection. The reduction in cross-section (18, 33, 38a-38c, 53a-53c, 65a-65c) is provided in the recess (16, 17, 32, 37a-37c, 52a-52c, 64a-64c) on the side facing the second component (14, 15, 51, 63a-63c).

    摘要翻译： 本发明涉及用于连接到第二部件（14,15,51,63a-63c）的第一部件（12,13,31,36a-36c，50,62）。 第一部件（12,13,31,36a-36c，50,62）包括至少一个凹部（16,17,32,37a-37c，52a-52c，64a-64c），其具有至少一个开口（19， 20,34,35,54a-54c），其将至少部分地由在连接建立期间处于流动状态的第二部件（14,15,51,63a-63c）填充，至少在 开口（19,34,54a-54c）的区域。 在凹部（16,17,32,37a-37c，52a-52c，64a-64c）中设置横截面（18,33,38a-38c，53a-53c，65a-65c） 在建立连接期间由第二部件（14,15,51,63a-63c）反向填充。 在侧面的凹部（16,17,32,37a-37c，52a-52c，64a-64c）中设置横截面（18,33,38a-38c，53a-53c，65a-65c）的减小 面对第二部件（14,15,51,63a-63c）。

    Socket connector
    8.
    发明授权
    Socket connector 有权
    插座连接器

    公开(公告)号：US07601012B2

    公开(公告)日：2009-10-13

    申请号：US11000889

    申请日：2004-12-02

    申请人： Ted Ju

    发明人： Ted Ju

    IPC分类号： H01R12/00

    CPC分类号： H01R4/028 ,  H01R12/57 ,  H05K3/3426 ,  H05K2201/10189 ,  H05K2201/1084 ,  H05K2203/046 ,  Y02P70/613

    摘要： A socket connector is bonded to a circuit board by solder materials. The solder materials are well arranged so that no short circuits occur. The socket connector can be applied in a wide range of uses with high yield and reduced cost. The socket connector has an insulative housing having a plurality of terminals and a solder material therein. The socket connector is characterized by the insulative housing being provided with a plurality of overflow holes in a direction along which the insulative housing and terminals apply pressure to the solder material.

    摘要翻译： 插座连接器通过焊料粘合到电路板上。 焊料材料布置良好，不会发生短路。 插座连接器可以广泛应用于高产量和低成本。 插座连接器具有绝缘壳体，其中具有多个端子和焊料材料。 插座连接器的特征在于，绝缘壳体沿着绝缘壳体和端子对焊料材料施加压力的方向设置有多个溢流孔。

    Board connector
    10.
    发明授权
    Board connector 有权
    板连接器

    公开(公告)号：US07467956B2

    公开(公告)日：2008-12-23

    申请号：US11663770

    申请日：2005-09-27

    申请人： Hiroki Hirai ,  Kenji Okamura ,  Masahide Hio ,  Tetsuya Aihara ,  Hiroshi Nakano ,  Shigeki Shimada

    发明人： Hiroki Hirai ,  Kenji Okamura ,  Masahide Hio ,  Tetsuya Aihara ,  Hiroshi Nakano ,  Shigeki Shimada

    IPC分类号： H01R12/00

    CPC分类号： H05K3/3426 ,  H01R12/707 ,  H01R12/714 ,  H05K3/341 ,  H05K2201/10189 ,  H05K2201/1084 ,  Y02P70/613

    摘要： A plurality of terminal fittings 11 are mounted to a housing 20, board connecting portions 13 having mounting portions 14 at lower ends protrude rearward, fixed fittings 30 having mounting plates 32 at lower edges are mounted to opposite side surfaces of the housing 20, and the mounting portion 14 of each terminal fitting 11 and the mounting plates 32 of the fixed fittings 30 are secured to a PCB 40 by reflow soldering. During the reflow soldering, a drawing force toward the PCB 40 acts on each of the terminal fittings 11 and the fixed fittings 30 based on surface tension of molten solder H, but the center of the fixed fitting 30 in the fore/aft direction of the board connecting portion 13 is positioned forward of the center of gravity position O of a connector 10, and rotation moment Mb toward the PCB 40 acts on the front of the housing 20 based on a drawing force Fb on the side of the fixed fitting 30 to prevent the front from being raised.

    摘要翻译： 多个端子配件11安装在壳体20上，具有下端的安装部分14的板连接部分13向后突出，在下边缘处具有安装板32的固定配件30安装在壳体20的相对侧表面上， 每个端子接头11的安装部分14和固定配件30的安装板32通过回流焊接固定到PCB40上。 在回流焊接期间，基于熔融焊料H的表面张力，朝向PCB 40的拉力作用在端子配件11和固定配件30中的每一个上，但固定配件30的中心在前后方向上 板连接部分13位于连接器10的重心位置O的前方，并且朝向PCB 40的转动力矩Mb基于固定配件30侧的拉拔力Fb作用在壳体20的前部上 防止前方被抬起。