公开(公告)号：US20230230870A1

公开(公告)日：2023-07-20

申请号：US17801649

申请日：2021-03-26

Applicant: Denka Company Limited

Inventor： Mizuki HASUMI ,  Tomoya TSUKUI

IPC: H01L21/683 ,  H01L21/304 ,  H01L23/00

CPC classification number: H01L21/6836 ,  H01L21/304 ,  H01L24/11 ,  H01L2221/68327 ,  H01L2224/11009

Abstract: A sheet for processing a wafer, including a substrate sheet that comes into contact with a main surface of the wafer, wherein the substrate sheet has an exponential coefficient in an exponential trendline for storage modulus E′30-80 at 30° C. to 80° C. of −0.035 to −0.070.

公开(公告)号：US20170200629A1

公开(公告)日：2017-07-13

申请号：US15326195

申请日：2015-07-06

Applicant: Denka Company Limited

Inventor： Tomoya TSUKUI ,  Gosuke NAKAJIMA

IPC: H01L21/683 ,  H01L21/78 ,  C09J133/10 ,  C09J5/06 ,  C09J4/06 ,  C09J7/02

CPC classification number: H01L21/6836 ,  C08F220/18 ,  C08F299/065 ,  C08G18/6254 ,  C08G18/673 ,  C08G18/755 ,  C08G18/792 ,  C08G18/8025 ,  C08G18/8029 ,  C08G18/8175 ,  C09J4/06 ,  C09J5/06 ,  C09J7/35 ,  C09J7/385 ,  C09J133/06 ,  C09J133/10 ,  C09J175/04 ,  C09J175/16 ,  C09J187/00 ,  C09J2203/326 ,  C09J2205/31 ,  C09J2433/00 ,  C09J2475/00 ,  H01L21/78 ,  H01L2221/68336 ,  C08F220/14 ,  C08F2220/1858 ,  C08F220/06 ,  C08F220/20 ,  C08F2220/1808 ,  C08F2220/1825 ,  C08F2220/281

Abstract: An adhesive sheet is provided that is capable of inhibiting scraping up of an adhesive in the dicing step, does not cause chip detachment during dicing processing, facilitates picking up, and does not readily develop adhesive transfer. According to the present invention, an adhesive sheet is provided that comprises a substrate film and an adhesive layer laminated on the film, wherein the adhesive layer contains 100 parts by mass of a (meth)acrylate copolymer, from 5 to 250 parts by mass of a photopolymerizable compound, from 20 to 160 parts by mass of a softener, from 0.1 to 30 parts by mass of a curing agent, and from 0.1 to 20 parts by mass of a photopolymerization initiator, and the photopolymerizable compound has a weight average molecular weight from 40,000 to 220,000.

公开(公告)号：US20160130481A1

公开(公告)日：2016-05-12

申请号：US14895546

申请日：2014-06-10

Applicant: DENKA COMPANY LIMITED

Inventor： Gosuke NAKAJIMA ,  Tomoya TSUKUI

IPC: C09J133/08 ,  C09J183/10 ,  C09J133/14

CPC classification number: C09J133/08 ,  C08F2/48 ,  C08G18/6229 ,  C08G18/673 ,  C08G18/73 ,  C08G18/792 ,  C08G18/8022 ,  C08L75/14 ,  C08L83/00 ,  C09J4/06 ,  C09J7/35 ,  C09J133/06 ,  C09J133/14 ,  C09J175/04 ,  C09J175/16 ,  C09J183/10 ,  C09J2203/326 ,  C09J2433/00 ,  H01L21/6836 ,  H01L2221/68327 ,  C08F2220/1808 ,  C08F2220/281 ,  C08F2220/1858 ,  C08F220/20

Abstract: A heat-resistant adhesive sheet for semiconductor testing, used in a performance test while semiconductor chips are heated includes: a base material; and an adhesive layer provided on the base material, the base material having a thermal shrinkage of lower than 1% when being heated at 150 degrees Celsius for 30 minutes and a linear expansion coefficient of equal to or lower than 5.0×10−5 at 60 to 150 degrees Celsius, and the adhesive layer containing a (meth)acrylic acid ester copolymer, a photopolymerizable compound, a polyfunctional isocyanate curing agent, and photoinitiator. The adhesive layer contains 5 to 200 parts by mass of the photopolymerizable compound, 0.5 to 20 parts by mass of the polyfunctional isocyanate curing agent, and 0.1 to 20 parts by mass of the photoinitiator, with respect to 100 parts by mass of the(meth)acrylic acid ester copolymer. The adhesive layer is free of tackifying resin.

Abstract translation: 用于半导体芯片加热时的性能测试中的用于半导体测试的耐热粘合片包括：基材; 以及设置在基材上的粘合剂层，当在150℃下加热30分钟时，该基材的热收缩率低于1％，线膨胀系数等于或低于5.0×10-5的线膨胀系数在60 和含有（甲基）丙烯酸酯共聚物的粘合剂层，光聚合性化合物，多官能异氰酸酯固化剂和光引发剂。 粘合剂层含有5〜200质量份的光聚合性化合物，0.5〜20质量份的多官能异氰酸酯固化剂和0.1〜20质量份的光引发剂，相对于100质量份的（甲基 ）丙烯酸酯共聚物。 粘合剂层不含增粘树脂。