公开(公告)号：US06910636B2

公开(公告)日：2005-06-28

申请号：US10459352

申请日：2003-06-11

申请人： Deok-heung Kim ,  Chang-gyoo Kim ,  Seung-seob Lee

发明人： Deok-heung Kim ,  Chang-gyoo Kim ,  Seung-seob Lee

IPC分类号： B42D15/10 ,  G06K19/077 ,  H01L25/00 ,  H05K1/11 ,  H05K1/14 ,  H05K3/28 ,  G06K19/06

CPC分类号： G06K19/07769 ,  G06K19/07745 ,  G06K19/07749 ,  G06K19/0775 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2924/00011 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/3025 ,  H05K1/11 ,  H05K1/141 ,  H05K3/284 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01049

摘要： An IC card includes an antenna circuit pattern formed on an insulation film and having a wire-shaped antenna portion, a portion corresponding to a chip bump of a combi-chip, and an attachment portion to which an external contact pad is attached. The combi-chip is attached to a portion corresponding to the chip bump of the combi-chip module on the antenna circuit pattern. At least one dielectric layer is attached to the antenna circuit pattern. An external contact pad is inserted in a hole formed in part of the dielectric layer and attached to the hole and has terminals formed in an outer surface and an inner surface of a substrate and connected to one another. The terminals on the inner surface contact the attachment portion is provided on the antenna circuit pattern.

摘要翻译： IC卡包括形成在绝缘膜上并具有线状天线部分的天线电路图案，对应于组合芯片的芯片凸块的部分和附接有外部接触垫的附接部分。 组合芯片连接到天线电路图案上对应于组合芯片模块的芯片凸块的部分。 至少一个电介质层连接到天线电路图案。 将外部接触垫插入到形成在电介质层的一部分中的孔中并附着到孔上，并且具有形成在基板的外表面和内表面中并且彼此连接的端子。 在天线电路图案上设置有内表面上接触连接部分的端子。