公开(公告)号：US5701085A

公开(公告)日：1997-12-23

申请号：US498791

申请日：1995-07-05

申请人： Deviprasad Malladi ,  Lee Frederick Hanson ,  Jean Kahahane

发明人： Deviprasad Malladi ,  Lee Frederick Hanson ,  Jean Kahahane

IPC分类号： G01R1/04 ,  G01R31/28 ,  G01R1/07

CPC分类号： G01R31/2886 ,  G01R1/0483 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/73253 ,  H01L2924/1515 ,  H01L2924/15311

摘要： An apparatus for use in testing wire bond or flip chip connected integrated circuits includes a housing with a top side, a bottom side, and a perimeter region defining a housing central aperture. The housing further includes flip chip pads to accommodate flip chip solder connections to a flip chip integrated circuit during a first test period and wire bond pads to accommodate wire bond connections to a wire bond integrated circuit during a second test period. There are connector pins on the bottom side of the housing for connection with a printed circuit board. The printed circuit board includes an access aperture which is aligned with the housing central aperture. This configuration allows a test probe to access a flip chip integrated circuit positioned within the housing. It also allows a heat sink to be used when the housing incorporates a wire bonded integrated circuit.

摘要翻译： 用于测试引线接合或倒装芯片连接的集成电路的装置包括具有顶侧，底侧和限定壳体中心孔的周边区域的壳体。 壳体还包括倒装芯片焊盘，以在第一测试周期期间适应倒装芯片焊接连接到倒装芯片集成电路，并且引线接合焊盘以在第二测试周期期间适应引线键合连接到引线接合集成电路。 在外壳底部有连接器针脚，用于与印刷电路板连接。 印刷电路板包括与壳体中心孔对准的进入孔。 该配置允许测试探针访问位于壳体内的倒装芯片集成电路。 它还允许当外壳包含导线接合集成电路时使用散热器。