公开(公告)号：US20210214489A1

公开(公告)日：2021-07-15

申请号：US17055350

申请日：2019-06-07

Applicant: Dexerials Corporation

Inventor： Kazunobu KAMIYA ,  Hiroki SHIBUYA

IPC: C08G59/70 ,  C08G59/40 ,  C08J3/24 ,  C08J3/28 ,  C08K7/22

Abstract: A cationic curable composition that generates a silanol group by light irradiation and is cured by heat, the cationic curable composition including: a cationic curable component; porous particles holding an aluminum chelate; and a photodegradable silicon compound that generates a silanol group by photodegradation.

公开(公告)号：US20240384147A1

公开(公告)日：2024-11-21

申请号：US18690044

申请日：2022-08-22

Applicant: DEXERIALS CORPORATION

Inventor： Yijing ZHAO ,  Hiroki SHIBUYA ,  Yuki IWATA ,  Takeshi NISHIO ,  Makoto INOUE ,  Ryoko KAWAKAMI

IPC: C09K5/14 ,  C08G65/26 ,  C08J5/18 ,  C08K3/08 ,  C08K9/02

Abstract: A thermally conductive composition including a curable component, a curing agent configured to cure the curable component, and a metallic filler is provided. The metallic filler contains thermally conductive particles and low-melting-point metallic particles. A volume average particle diameter of the thermally conductive particles is greater than a volume average particle diameter of the low-melting-point metallic particles. A melting point of the low-melting-point metallic particles is lower than a thermal curing treatment temperature of the thermally conductive composition.