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4 条记录 (耗时 0.03 秒)

    Method for packaging components
    1.
    发明授权
    Method for packaging components 有权
    包装组件的方法

    公开(公告)号：US08119502B2

    公开(公告)日：2012-02-21

    申请号：US12306848

    申请日：2007-05-24

    申请人： Dietrich Mund ,  Volker Seidemann ,  Edgar Pawlowski ,  Ralf Biertuempfel ,  Bernd Woelfing ,  Frank Fleissner ,  Petra Auchter-Krummel ,  Ulf Brauneck ,  Joseph S. Hayden ,  Ulrich Fotheringham

    发明人： Dietrich Mund ,  Volker Seidemann ,  Edgar Pawlowski ,  Ralf Biertuempfel ,  Bernd Woelfing ,  Frank Fleissner ,  Petra Auchter-Krummel ,  Ulf Brauneck ,  Joseph S. Hayden ,  Ulrich Fotheringham

    IPC分类号： H01L21/00

    CPC分类号： B81C1/00333 ,  H01L21/50 ,  H01L21/6835 ,  H01L27/14618 ,  H01L2221/68363 ,  H01L2924/16235

    摘要： The invention relates to a method for the manufacture of packaged components. The invention is based here on the problem of facilitating the application of covers with lateral dimensions that are smaller than the lateral dimensions of the functional substrate. For this purpose, a plate-like cover substrate is mounted on a carrier substrate. Then, on the uncovered side of the plate-like cover substrate, trenches are inserted, so that a composite part is obtained with the carrier substrate and individual covering parts that are separated from each other by the trenches, but interconnected by the carrier substrate. The covering parts of the composite part are connected with a functional substrate with a plurality of components. Then, the connection of the covering parts is dissolved with the carrier substrate, and the carrier substrate is removed, so that a composite is obtained with the functional substrate and a plurality of covering parts that cover functional areas.

    摘要翻译： 本发明涉及一种制造包装部件的方法。 本发明基于这样的问题：便于应用具有小于功能基板的横向尺寸的横向尺寸的盖。 为此，将板状盖基板安装在载体基板上。 然后，在板状覆盖基板的未覆盖面上插入沟槽，从而得到载体基板和通过沟槽彼此分离但由载体基板互连的各个覆盖部分的复合部件。 复合部件的覆盖部分与具有多个部件的功能基板连接。 然后，将覆盖部分的连接与载体基板一起溶解，并且移除载体基板，从而获得具有功能基板和覆盖功能区域的多个覆盖部分的复合体。

    Method for Packaging Components
    2.
    发明申请
    Method for Packaging Components 有权
    包装部件的方法

    公开(公告)号：US20100022053A1

    公开(公告)日：2010-01-28

    申请号：US12306848

    申请日：2007-05-24

    申请人： Dietrich Mund ,  Volker Seidemann ,  Edgar Pawlowski ,  Ralf Biertuempfel ,  Bernd Woelfing ,  Frank Fleissner ,  Petra Auchter-Krummel ,  Ulf Brauneck ,  Joseph S. Hayden ,  Ulrich Fotheringham

    发明人： Dietrich Mund ,  Volker Seidemann ,  Edgar Pawlowski ,  Ralf Biertuempfel ,  Bernd Woelfing ,  Frank Fleissner ,  Petra Auchter-Krummel ,  Ulf Brauneck ,  Joseph S. Hayden ,  Ulrich Fotheringham

    IPC分类号： H01L21/56

    CPC分类号： B81C1/00333 ,  H01L21/50 ,  H01L21/6835 ,  H01L27/14618 ,  H01L2221/68363 ,  H01L2924/16235

    摘要： The invention relates to a method for the manufacture of packaged components. The invention is based here on the problem of facilitating the application of covers with lateral dimensions that are smaller than the lateral dimensions of the functional substrate. For this purpose, a plate-like cover substrate is mounted on a carrier substrate. Then, on the uncovered side of the plate-like cover substrate, trenches are inserted, so that a composite part is obtained with the carrier substrate and individual covering parts that are separated from each other by the trenches, but interconnected by the carrier substrate. The covering parts of the composite part are connected with a functional substrate with a plurality of components. Then, the connection of the covering parts is dissolved with the carrier substrate, and the carrier substrate is removed, so that a composite is obtained with the functional substrate and a plurality of covering parts that cover functional areas.

    摘要翻译： 本发明涉及一种制造包装部件的方法。 本发明基于这样的问题：便于应用具有小于功能基板的横向尺寸的横向尺寸的盖。 为此，将板状盖基板安装在载体基板上。 然后，在板状覆盖基板的未覆盖面上插入沟槽，从而得到载体基板和通过沟槽彼此分离但由载体基板互连的各个覆盖部分的复合部件。 复合部件的覆盖部分与具有多个部件的功能基板连接。 然后，将覆盖部分的连接与载体基板一起溶解，并且移除载体基板，从而获得具有功能基板和覆盖功能区域的多个覆盖部分的复合体。

    Method for Measuring Topographic Structures on Devices
    3.
    发明申请
    Method for Measuring Topographic Structures on Devices 审中-公开
    测量设备上的地形结构的方法

    公开(公告)号：US20080144006A1

    公开(公告)日：2008-06-19

    申请号：US11569242

    申请日：2005-05-13

    申请人： Michael Stelzl ,  Volker Seidemann ,  Jürgen Leib ,  Ha-Duong Ngo

    发明人： Michael Stelzl ,  Volker Seidemann ,  Jürgen Leib ,  Ha-Duong Ngo

    IPC分类号： G01J3/00 ,  G01B11/28 ,  G01N21/55

    CPC分类号： G02B21/0076 ,  G01B11/0608

    摘要： In order to be able to measure topographies on wafers or devices in a fashion free from destruction, the invention provides a method for measuring three-dimensional topographic structures (22) on wafers (2) or devices in which with the aid of a confocal microscope (1) at least one fluorescing topographic structure (22) is scanned with excitation light, and the fluorescence light emitted from the focal point (17) in the focal plane (19) of the objective (15) and excited by the excitation light is detected, and measured data are obtained from the position of the focal point (17) and the detected fluorescence signal.

    摘要翻译： 为了能够以没有破坏的方式测量晶片或器件上的形貌，本发明提供了一种用于测量晶片（2）上的三维地形结构（22）的方法或其中借助于共聚焦显微镜 （1）用激发光扫描至少一个荧光地形结构（22），并且从物镜（15）的焦平面（19）发射并被激发光激发的焦点（17）发出的荧光是 从焦点（17）的位置和检测到的荧光信号获得检测和测量的数据。