公开(公告)号：US08119502B2

公开(公告)日：2012-02-21

申请号：US12306848

申请日：2007-05-24

申请人： Dietrich Mund ,  Volker Seidemann ,  Edgar Pawlowski ,  Ralf Biertuempfel ,  Bernd Woelfing ,  Frank Fleissner ,  Petra Auchter-Krummel ,  Ulf Brauneck ,  Joseph S. Hayden ,  Ulrich Fotheringham

发明人： Dietrich Mund ,  Volker Seidemann ,  Edgar Pawlowski ,  Ralf Biertuempfel ,  Bernd Woelfing ,  Frank Fleissner ,  Petra Auchter-Krummel ,  Ulf Brauneck ,  Joseph S. Hayden ,  Ulrich Fotheringham

IPC分类号： H01L21/00

CPC分类号： B81C1/00333 ,  H01L21/50 ,  H01L21/6835 ,  H01L27/14618 ,  H01L2221/68363 ,  H01L2924/16235

摘要： The invention relates to a method for the manufacture of packaged components. The invention is based here on the problem of facilitating the application of covers with lateral dimensions that are smaller than the lateral dimensions of the functional substrate. For this purpose, a plate-like cover substrate is mounted on a carrier substrate. Then, on the uncovered side of the plate-like cover substrate, trenches are inserted, so that a composite part is obtained with the carrier substrate and individual covering parts that are separated from each other by the trenches, but interconnected by the carrier substrate. The covering parts of the composite part are connected with a functional substrate with a plurality of components. Then, the connection of the covering parts is dissolved with the carrier substrate, and the carrier substrate is removed, so that a composite is obtained with the functional substrate and a plurality of covering parts that cover functional areas.

摘要翻译： 本发明涉及一种制造包装部件的方法。 本发明基于这样的问题：便于应用具有小于功能基板的横向尺寸的横向尺寸的盖。 为此，将板状盖基板安装在载体基板上。 然后，在板状覆盖基板的未覆盖面上插入沟槽，从而得到载体基板和通过沟槽彼此分离但由载体基板互连的各个覆盖部分的复合部件。 复合部件的覆盖部分与具有多个部件的功能基板连接。 然后，将覆盖部分的连接与载体基板一起溶解，并且移除载体基板，从而获得具有功能基板和覆盖功能区域的多个覆盖部分的复合体。

公开(公告)号：US20100022053A1

公开(公告)日：2010-01-28

申请号：US12306848

申请日：2007-05-24

申请人： Dietrich Mund ,  Volker Seidemann ,  Edgar Pawlowski ,  Ralf Biertuempfel ,  Bernd Woelfing ,  Frank Fleissner ,  Petra Auchter-Krummel ,  Ulf Brauneck ,  Joseph S. Hayden ,  Ulrich Fotheringham

发明人： Dietrich Mund ,  Volker Seidemann ,  Edgar Pawlowski ,  Ralf Biertuempfel ,  Bernd Woelfing ,  Frank Fleissner ,  Petra Auchter-Krummel ,  Ulf Brauneck ,  Joseph S. Hayden ,  Ulrich Fotheringham

IPC分类号： H01L21/56

CPC分类号： B81C1/00333 ,  H01L21/50 ,  H01L21/6835 ,  H01L27/14618 ,  H01L2221/68363 ,  H01L2924/16235

摘要： The invention relates to a method for the manufacture of packaged components. The invention is based here on the problem of facilitating the application of covers with lateral dimensions that are smaller than the lateral dimensions of the functional substrate. For this purpose, a plate-like cover substrate is mounted on a carrier substrate. Then, on the uncovered side of the plate-like cover substrate, trenches are inserted, so that a composite part is obtained with the carrier substrate and individual covering parts that are separated from each other by the trenches, but interconnected by the carrier substrate. The covering parts of the composite part are connected with a functional substrate with a plurality of components. Then, the connection of the covering parts is dissolved with the carrier substrate, and the carrier substrate is removed, so that a composite is obtained with the functional substrate and a plurality of covering parts that cover functional areas.

摘要翻译： 本发明涉及一种制造包装部件的方法。 本发明基于这样的问题：便于应用具有小于功能基板的横向尺寸的横向尺寸的盖。 为此，将板状盖基板安装在载体基板上。 然后，在板状覆盖基板的未覆盖面上插入沟槽，从而得到载体基板和通过沟槽彼此分离但由载体基板互连的各个覆盖部分的复合部件。 复合部件的覆盖部分与具有多个部件的功能基板连接。 然后，将覆盖部分的连接与载体基板一起溶解，并且移除载体基板，从而获得具有功能基板和覆盖功能区域的多个覆盖部分的复合体。

公开(公告)号：US20090217516A1

公开(公告)日：2009-09-03

申请号：US12373066

申请日：2007-07-05

申请人： Edgar Pawlowski ,  Ralf Biertuempfel ,  Bernd Woelfing ,  Frank Fleissner ,  Petra Auchter-Krummel ,  Ulf Brauneck ,  Joseph S. Hayden ,  Ulrich Fotheringham

发明人： Edgar Pawlowski ,  Ralf Biertuempfel ,  Bernd Woelfing ,  Frank Fleissner ,  Petra Auchter-Krummel ,  Ulf Brauneck ,  Joseph S. Hayden ,  Ulrich Fotheringham

IPC分类号： H05K3/00 ,  H04N5/335

CPC分类号： H01L27/14625 ,  C03B11/082 ,  C03B17/06 ,  C03B2215/05 ,  C03B2215/414 ,  C03C17/02 ,  C03C19/00 ,  H01L27/14618 ,  H01L27/1462 ,  H01L27/14621 ,  H01L27/14632 ,  H01L27/14685 ,  H01L27/14687 ,  H01L27/15 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/02325 ,  H01L33/005 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2933/0058 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/49137 ,  H01L2924/00

摘要： The invention relates to the production of optoelectronic components, optical components being mounted in the composite wafer. Provided to this end is a method for producing optoelectronic components, in particular image signal acquiring or image signal outputting components, in the case of which optical components are respectively provided, picked up and mounted on a wafer, the optical components preferably respectively being positioned individually or in groups relative to the position of assigned optoelectronic or optical components of the wafer or of a wafer to be connected thereto.

摘要翻译： 本发明涉及光电子元件的制造，光学元件安装在复合晶片中。 为此，提供了在分别设置，拾取和安装在晶片上的光学部件的情况下，制造光电子部件，特别是图像信号获取或图像信号输出部件的方法，光学部件优选地分别独立地定位 或者相对于晶片或与其连接的晶片的所分配的光电子元件或光学元件的位置成组。

公开(公告)号：US09027237B2

公开(公告)日：2015-05-12

申请号：US12373066

申请日：2007-07-05

申请人： Edgar Pawlowski ,  Ralf Biertuempfel ,  Bernd Woelfing ,  Frank Fleissner ,  Petra Auchter-Krummel ,  Ulf Brauneck ,  Joseph S. Hayden ,  Ulrich Fotheringham

发明人： Edgar Pawlowski ,  Ralf Biertuempfel ,  Bernd Woelfing ,  Frank Fleissner ,  Petra Auchter-Krummel ,  Ulf Brauneck ,  Joseph S. Hayden ,  Ulrich Fotheringham

IPC分类号： H05K3/30 ,  H01L27/146 ,  C03B11/08 ,  C03C17/02 ,  C03C19/00 ,  H01L31/0203 ,  H01L31/0232 ,  C03B17/06

CPC分类号： H01L27/14625 ,  C03B11/082 ,  C03B17/06 ,  C03B2215/05 ,  C03B2215/414 ,  C03C17/02 ,  C03C19/00 ,  H01L27/14618 ,  H01L27/1462 ,  H01L27/14621 ,  H01L27/14632 ,  H01L27/14685 ,  H01L27/14687 ,  H01L27/15 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/02325 ,  H01L33/005 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2933/0058 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/49137 ,  H01L2924/00

摘要： A method for producing optoelectronic components, the method comprising the steps of: providing optical components; picking up, by means of a robot arm, the optical components provided; subsequent to picking up the optical components, mounting the optical components directly on a first wafer by means of the robot arm; wherein the first wafer has optoelectronic components attached, and the optical components being positioned individually or in groups relative to the position of the optoelectronic components of the first wafer using the robot arm; and utilizing, as the first wafer, a glass wafer having i) spectrally filtering glass being an infrared filter glass and ii) an infrared filter coating, the glass wafer having a thickness in the range of 50 to 500 micrometers.

摘要翻译： 一种光电子部件的制造方法，其特征在于，包括以下步骤：提供光学部件; 通过机器人手臂拾取提供的光学部件; 在拾取光学部件之后，通过机器人臂将光学部件直接安装在第一晶片上; 其中所述第一晶片具有附接的光电子部件，并且所述光学部件使用所述机器人手臂相对于所述第一晶片的所述光电子部件的位置单独地或分组地定位; 并且利用具有i）作为红外滤光器玻璃的光谱过滤玻璃和ii）红外滤光器涂层的玻璃晶片，所述玻璃晶片的厚度在50至500微米的范围内。

公开(公告)号：US20060050513A1

公开(公告)日：2006-03-09

申请号：US11211244

申请日：2005-08-25

申请人： Ulf Brauneck ,  Klaus-Dieter Loosen

发明人： Ulf Brauneck ,  Klaus-Dieter Loosen

IPC分类号： F21V9/00

CPC分类号： G02B5/281 ,  F21S41/13 ,  F21S41/683

摘要： The invention relates to a headlamp having at least one broadband light source and a filter, the filter having at least a first frequency band within the near infrared wavelength region with a high transmission τ1 preferably with τ1>90%, and a second frequency band, which comprises the violet to red color region of the visible wavelength region, with a low transmission τ2, in particular with τ2

摘要翻译： 本发明涉及一种具有至少一个宽带光源和滤光器的前照灯，该滤光器具有在近红外波长区域内的至少第一频带，其具有高的发射波长，优选为τ _{1 90％，以及包括可见波长区域的紫色至红色区域的第二频带，具有低的传输τ2，特别是与τ 2 <0.01％。 在第二频带内，至少一个频率峰值位于可见波长区域的蓝绿色区域，具有发射波形，其中τ2 p <0.1％，以补偿可见红光成分。}

公开(公告)号：US20080297886A1

公开(公告)日：2008-12-04

申请号：US12129071

申请日：2008-05-29

申请人： Ulf Brauneck ,  Ulrich Jeschkowski ,  Thomas Strohmaier ,  Wolfgang Erbach

发明人： Ulf Brauneck ,  Ulrich Jeschkowski ,  Thomas Strohmaier ,  Wolfgang Erbach

IPC分类号： F21V9/06

CPC分类号： G02B5/283 ,  Y10S359/90

摘要： The invention is based on the object of providing UV interference filters having improved long-term stability. For this purpose, a method for producing a dielectric transmission interference filter is provided, in which an alternating layer system having the constituents magnesium fluoride, lead fluoride and antimony oxide is produced on a substrate by co-evaporation. After deposition, the substrate is subjected to heat treatment and irradiated with UV light in order to stabilize the layer system.

摘要翻译： 本发明基于提供具有改善的长期稳定性的UV干涉滤光器的目的。 为此，提供了一种用于制造电介质传输干涉滤光器的方法，其中通过共蒸发在基底上产生具有氟化镁，氟化铅和氧化锑的交替层系统。 沉积后，对基板进行热处理并用UV光照射，以使层系统稳定。

公开(公告)号：US08000002B2

公开(公告)日：2011-08-16

申请号：US12129071

申请日：2008-05-29

申请人： Ulf Brauneck ,  Ulrich Jeschkowski ,  Thomas Strohmaier ,  Wolfgang Erbach

发明人： Ulf Brauneck ,  Ulrich Jeschkowski ,  Thomas Strohmaier ,  Wolfgang Erbach

IPC分类号： F21V9/06

CPC分类号： G02B5/283 ,  Y10S359/90

摘要： The invention is based on the object of providing UV interference filters having improved long-term stability. For this purpose, a method for producing a dielectric transmission interference filter is provided, in which an alternating layer system having the constituents magnesium fluoride, lead fluoride and antimony oxide is produced on a substrate by co-evaporation. After deposition, the substrate is subjected to heat treatment and irradiated with UV light in order to stabilize the layer system.

摘要翻译： 本发明基于提供具有改善的长期稳定性的UV干涉滤光器的目的。 为此，提供了一种用于制造电介质传输干涉滤光器的方法，其中通过共蒸发在基底上产生具有氟化镁，氟化铅和氧化锑的交替层系统。 沉积后，对基板进行热处理并用UV光照射，以使层系统稳定。