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公开(公告)号：US20200055728A1
公开(公告)日：2020-02-20
申请号：US16550129
申请日：2019-08-23
Applicant: DigitalOptics Corporation MEMS
Inventor： Ankur Jain , Roman C. Gutierrez , Shi-Sheng Lee , Robert J. Calvet , Xiaolei Liu
Abstract: A device may comprise a substrate formed of a first semiconductor material and a trench formed in the substrate. A second semiconductor material may be formed in the trench. The second semiconductor material may have first and second portions that are isolated with respect to one another and that are isolated with respect to the first semiconductor material.
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公开(公告)号：US09880371B2
公开(公告)日：2018-01-30
申请号：US15362252
申请日：2016-11-28
Applicant: DigitalOptics Corporation
Inventor： Roman C. Gutierrez , Robert J. Calvet , Ankur Jain
CPC classification number: G02B7/10 , B81C1/00301 , B81C1/00317 , B81C1/0038 , G02B7/102 , G02B27/646 , G03B3/10 , G03B5/00 , G03B13/36 , G03B2205/0046 , G03B2205/0053 , H02N1/008 , Y10T29/49002
Abstract: A microelectromechanical systems (MEMS) device may be provided with one or more sintered electrical contacts. The MEMS device may be a MEMS actuator or a MEMS sensor. The sintered electrical contacts may be silver-paste metalized electrical contacts. The sintered electrical contacts may be formed by depositing a sintering material such as a metal paste, a metal preform, a metal ink, or a metal powder on a wafer of released MEMS devices and heating the wafer so that the deposited sintering material diffuses into a substrate of the device, thereby making electrical contact with the device. The deposited sintering material may break through an insulating layer on the substrate during the sintering process. The MEMS device may be a multiple degree of freedom actuator having first and second MEMS actuators that facilitate autofocus, zoom, and optical image stabilization for a camera.
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公开(公告)号：US20170329098A1
公开(公告)日：2017-11-16
申请号：US15362252
申请日：2016-11-28
Applicant: DigitalOptics Corporation
Inventor： Roman C. Gutierrez , Robert J. Calvet , Ankur Jain
CPC classification number: G02B7/10 , B81C1/00301 , B81C1/00317 , B81C1/0038 , G02B7/102 , G02B27/646 , G03B3/10 , G03B5/00 , G03B13/36 , G03B2205/0046 , G03B2205/0053 , H02N1/008 , Y10T29/49002
Abstract: A microelectromechanical systems (MEMS) device may be provided with one or more sintered electrical contacts. The MEMS device may be a MEMS actuator or a MEMS sensor. The sintered electrical contacts may be silver-paste metalized electrical contacts. The sintered electrical contacts may be formed by depositing a sintering material such as a metal paste, a metal preform, a metal ink, or a metal powder on a wafer of released MEMS devices and heating the wafer so that the deposited sintering material diffuses into a substrate of the device, thereby making electrical contact with the device. The deposited sintering material may break through an insulating layer on the substrate during the sintering process. The MEMS device may be a multiple degree of freedom actuator having first and second MEMS actuators that facilitate autofocus, zoom, and optical image stabilization for a camera.
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公开(公告)号：US09611926B2
公开(公告)日：2017-04-04
申请号：US14101287
申请日：2013-12-09
Applicant: DigitalOptics Corporation MEMS
Inventor： Roman C. Gutierrez , Robert J. Calvet , Ankur Jain , Xiaolei Liu , Guiqin Wang
CPC classification number: H02K5/24 , B81B3/0062 , B81B2203/058 , F16H49/00 , G02B7/005 , G02B26/0841 , G03B3/10 , G03B5/00 , G03B13/34 , G03B2205/0007 , G03B2205/0046 , G03B2205/0084 , H02N1/008 , H04N5/2257 , Y10T29/49826 , Y10T74/18056
Abstract: A device can have an outer frame and an actuator. The actuator can have a movable frame and a fixed frame. At least one torsional flexure and at least one hinge flexure can cooperate to provide comparatively high lateral stiffness between the outer frame and the movable frame and can cooperate to provide comparatively low rotational stiffness between the outer frame and the movable frame.
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公开(公告)号：US20150146312A1
公开(公告)日：2015-05-28
申请号：US14585172
申请日：2014-12-29
Applicant: DigitalOptics Corporation
Inventor： Roman C. Gutierrez , Robert J. Calvet , Ankur Jain
CPC classification number: G02B7/10 , B81C1/00301 , B81C1/00317 , B81C1/0038 , G02B7/102 , G02B27/646 , G03B3/10 , G03B5/00 , G03B13/36 , G03B2205/0046 , G03B2205/0053 , H02N1/008 , Y10T29/49002
Abstract: A microelectromechanical systems (MEMS) device may be provided with one or more sintered electrical contacts. The MEMS device may be a MEMS actuator or a MEMS sensor. The sintered electrical contacts may be silver-paste metalized electrical contacts. The sintered electrical contacts may be formed by depositing a sintering material such as a metal paste, a metal preform, a metal ink, or a metal powder on a wafer of released MEMS devices and heating the wafer so that the deposited sintering material diffuses into a substrate of the device, thereby making electrical contact with the device. The deposited sintering material may break through an insulating layer on the substrate during the sintering process. The MEMS device may be a multiple degree of freedom actuator having first and second MEMS actuators that facilitate autofocus, zoom, and optical image stabilization for a camera.
Abstract translation: 微机电系统（MEMS）装置可以设置有一个或多个烧结电触点。 MEMS器件可以是MEMS致动器或MEMS传感器。 烧结的电触点可以是银糊金属化的电触点。 烧结的电接触可以通过在释放的MEMS器件的晶片上沉积诸如金属糊料，金属预制件，金属油墨或金属粉末的烧结材料并加热晶片来形成，使得沉积的烧结材料扩散到 衬底，从而与器件电接触。 沉积的烧结材料可以在烧结过程中穿过衬底上的绝缘层。 MEMS器件可以是具有促进相机的自动聚焦，变焦和光学图像稳定的第一和第二MEMS致动器的多自由度致动器。
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Patent Agency Ranking
公开(公告)号：US08922870B2
公开(公告)日：2014-12-30
申请号：US14042214
申请日：2013-09-30
Applicant: DigitalOptics Corporation MEMS
Inventor： Ankur Jain , Roman C. Gutierrez
CPC classification number: B81C1/00523 , B81B3/0021 , B81B2203/033 , B81C1/00095 , B81C1/00571 , G03B3/10 , G03B2205/0061
Abstract: An electronic device may have a MEMS device formed of a first conductive material. A trench may be formed in the MEMS device. A layer of non-conductive material may be formed in the trench. A second conductive material may be formed upon the non-conductive material.
Abstract translation: 电子设备可以具有由第一导电材料形成的MEMS器件。 可以在MEMS器件中形成沟槽。 可以在沟槽中形成非导电材料层。 可以在非导电材料上形成第二导电材料。
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公开(公告)号：US20140036342A1
公开(公告)日：2014-02-06
申请号：US14042214
申请日：2013-09-30
Applicant: DigitalOptics Corporation MEMS
Inventor： Ankur Jain , Roman C. Gutierrez
CPC classification number: B81C1/00523 , B81B3/0021 , B81B2203/033 , B81C1/00095 , B81C1/00571 , G03B3/10 , G03B2205/0061
Abstract: An electronic device may have a MEMS device formed of a first conductive material. A trench may be formed in the MEMS device. A layer of non-conductive material may be formed in the trench. A second conductive material may be formed upon the non-conductive material.
Abstract translation: 电子设备可以具有由第一导电材料形成的MEMS器件。 可以在MEMS器件中形成沟槽。 可以在沟槽中形成非导电材料层。 可以在非导电材料上形成第二导电材料。
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公开(公告)号：US10284051B2
公开(公告)日：2019-05-07
申请号：US15477284
申请日：2017-04-03
Applicant: DigitalOptics Corporation MEMS
Inventor： Roman C. Gutierrez , Robert J. Calvet , Xiaolei Liu , Ankur Jain , Guiqin Wang
IPC: B81B3/00 , H02N11/00 , H02K5/24 , H02N1/00 , G03B3/10 , G03B13/34 , F16H49/00 , G02B7/00 , G03B5/00 , H04N5/225 , G02B26/08
Abstract: A device can have an outer frame and an actuator. The actuator can have a movable frame and a fixed frame. At least one torsional flexure and at least one hinge flexure can cooperate to provide comparatively high lateral stiffness between the outer frame and the movable frame and can cooperate to provide comparatively low rotational stiffness between the outer frame and the movable frame.
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公开(公告)号：US09783413B2
公开(公告)日：2017-10-10
申请号：US15166019
申请日：2016-05-26
Applicant: DigitalOptics Corporation MEMS
Inventor： Ankur Jain , Roman C. Gutierrez , Shi-Sheng Lee , Robert J. Calvet , Xiaolei Liu
CPC classification number: B81B7/0077 , B81B2201/031 , B81B2203/033 , B81C1/00571 , G03B3/10 , G03B2205/0061
Abstract: A device may comprise a substrate formed of a first semiconductor material and a trench formed in the substrate. A second semiconductor material may be formed in the trench. The second semiconductor material may have first and second portions that are isolated with respect to one another and that are isolated with respect to the first semiconductor material.
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公开(公告)号：US20140116163A1
公开(公告)日：2014-05-01
申请号：US14101287
申请日：2013-12-09
Applicant: DigitalOptics Corporation MEMS
Inventor： Roman C. Gutierrez , Robert J. Calvet , Ankur Jain , Xiaolei Liu , Guiqin Wang
IPC: F16H49/00
CPC classification number: H02K5/24 , B81B3/0062 , B81B2203/058 , F16H49/00 , G02B7/005 , G02B26/0841 , G03B3/10 , G03B5/00 , G03B13/34 , G03B2205/0007 , G03B2205/0046 , G03B2205/0084 , H02N1/008 , H04N5/2257 , Y10T29/49826 , Y10T74/18056
Abstract: A device can have an outer frame and an actuator. The actuator can have a movable frame and a fixed frame. At least one torsional flexure and at least one hinge flexure can cooperate to provide comparatively high lateral stiffness between the outer frame and the movable frame and can cooperate to provide comparatively low rotational stiffness between the outer frame and the movable frame.
Abstract translation: 设备可以具有外框架和致动器。 致动器可以具有可移动框架和固定框架。 至少一个扭转挠曲和至少一个铰链挠曲可以协作以在外框架和可移动框架之间提供相对较高的横向刚度，并且可以协作以在外框架和可移动框架之间提供相对较低的旋转刚度。
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