公开(公告)号：US06827793B2

公开(公告)日：2004-12-07

申请号：US10662096

申请日：2003-09-12

申请人： Don E. Anderson ,  Katrina A. Mikhaylich ,  Mike Ravkin ,  John M. de Larios

发明人： Don E. Anderson ,  Katrina A. Mikhaylich ,  Mike Ravkin ,  John M. de Larios

IPC分类号： B08B104

CPC分类号： H01L21/67051 ,  B08B1/04 ,  B08B3/04 ,  Y10S134/902 ,  Y10S239/19

摘要： A method for cleaning a wafer with a drip nozzle being configured for use in a drip manifold that is oriented over a brush of a wafer cleaning system is provided. The drip nozzle has a first end and a second end with a passage defined there between where the passage includes a wall that extends longitudinally between the first end and the second end. An orifice is defined within the passage and located at the first end of the drip nozzle. The method includes inputting a fluid into the drip nozzle at an acute angle relative to a longitudinal extension of the wall and reflecting the fluid stream off an internal wall of the drip nozzle at least twice in a direction that is toward the second end. The method further includes outputting at least one substantially uniform drop from the second end of the passage.

公开(公告)号：US06622335B1

公开(公告)日：2003-09-23

申请号：US09538865

申请日：2000-03-29

申请人： Don E. Anderson ,  Katrina A. Mikhaylich ,  Mike Ravkin ,  John M. de Larios

发明人： Don E. Anderson ,  Katrina A. Mikhaylich ,  Mike Ravkin ,  John M. de Larios

IPC分类号： B08B104

CPC分类号： H01L21/67051 ,  B08B1/04 ,  B08B3/04 ,  Y10S134/902 ,  Y10S239/19

摘要： A drip manifold having drip nozzles configured to form controlled droplets is provided for use in wafer cleaning systems. The drip manifold includes a plurality of drip nozzles that are secured to the drip manifold. Each of the plurality of drip nozzles has a passage defined between a first end and a second end. A sapphire orifice is defined within the passage and is located at the first end of the drip nozzle. The sapphire orifice is angled to produce a fluid stream that is reflected within the passage and toward the second end to form one or more uniform drops over a brush.

摘要翻译： 具有配置成形成受控液滴的滴水喷嘴的滴水歧管被提供用于晶片清洁系统中。 滴水歧管包括固定到滴水歧管的多个滴水嘴。 多个滴水喷嘴中的每一个具有在第一端和第二端之间限定的通道。 在通道内限定蓝宝石孔，位于滴水嘴的第一端。 蓝宝石孔口成角度以产生在通道内反射并流向第二端的流体流，以在刷子上形成一个或多个均匀的液滴。

公开(公告)号：US06711775B2

公开(公告)日：2004-03-30

申请号：US09329207

申请日：1999-06-10

申请人： Katrina A. Mikhaylich ,  Mike Ravkin ,  Don E. Anderson

发明人： Katrina A. Mikhaylich ,  Mike Ravkin ,  Don E. Anderson

IPC分类号： B08B104

CPC分类号： H01L21/67051 ,  H01L21/67046

摘要： A method and a system are provided for cleaning a surface of a wafer. The method starts by scrubbing the surface of the wafer with a cleaning brush that applies a chemical solution to the surface of the wafer. In one example, the cleaning brush implements a through the brush (TTB) technique to apply the chemicals. The scrubbing is generally performed in a brush box, with a top cleaning brush and a bottom cleaning brush. The top cleaning brush is then removed from contact with the surface of the wafer. The chemical concentration in the top brush may be maintained at substantially the same concentration that was in the brush during the scrubbing operation. Next, a flow of water (preferably de-ionized water) is delivered to the surface of the wafer. The delivery of water is preferably configured to remove substantially all of the chemical solution from the surface of the wafer before proceeding to a next cleaning operation.

摘要翻译： 提供了一种用于清洁晶片表面的方法和系统。 该方法首先用清洁刷擦洗晶片的表面，该清洁刷将化学溶液施加到晶片的表面。 在一个示例中，清洁刷实现了通过刷（TTB）技术来施加化学品。 洗刷通常在刷盒中进行，顶部清洁刷和底部清洁刷。 然后将顶部清洁刷除去与晶片表面的接触。 在洗刷操作期间，顶刷中的化学浓度可以保持在与刷中基本相同的浓度。 接下来，将水流（优选去离子水）输送到晶片的表面。 水的输送优选构造成在进行下一次清洁操作之前从晶片表面去除基本上所有的化学溶液。

公开(公告)号：US06361414B1

公开(公告)日：2002-03-26

申请号：US09607895

申请日：2000-06-30

申请人： Mike Ravkin ,  Katrina Mikhaylich ,  Don E. Anderson

发明人： Mike Ravkin ,  Katrina Mikhaylich ,  Don E. Anderson

IPC分类号： B24B5300

CPC分类号： B24B53/017 ,  B24B37/042 ,  B24B53/10

摘要： A method and apparatus for conditioning a fixed abrasive polishing pad used in chemical mechanical planarization of semiconductor wafers is described. The apparatus includes a conditioning member formed from glass, at least one collimated hole structure located within the conditioning member, wherein the collimated hole structure forms a channel, and wherein each channel is arranged in a generally parallel orientation with respect to any other channel. The method includes providing at least one conditioning member formed with at least one capillary tube array, wherein the capillary tube array forms multiple channels within the conditioning member, pressing the conditioning member against the fixed abrasive polishing pad, and moving the fixed abrasive polishing pad. In one embodiment, the method further comprises rotating the conditioning member to simulate the polishing of at least one semiconductor wafer.

摘要翻译： 描述了用于调节用于半导体晶片的化学机械平面化的固定研磨抛光垫的方法和装置。 该装置包括由玻璃形成的调节构件，位于调节构件内的至少一个准直孔结构，其中准直孔结构形成通道，并且其中每个通道相对于任何其它通道以大致平行的方向排列。 该方法包括提供形成有至少一个毛细管阵列的至少一个调节部件，其中毛细管阵列在调节部件内形成多个通道，将调节部件压靠固定研磨抛光垫，以及移动固定磨料抛光垫。 在一个实施例中，该方法还包括旋转调节构件以模拟至少一个半导体晶片的抛光。