公开(公告)号：US08567421B2

公开(公告)日：2013-10-29

申请号：US13028091

申请日：2011-02-15

申请人： Jeffrey J. Farber ,  Ji Zhu ,  Carl Woods ,  John M. de Larios

发明人： Jeffrey J. Farber ,  Ji Zhu ,  Carl Woods ,  John M. de Larios

IPC分类号： B08B3/00

CPC分类号： H01L21/67051 ,  G03F7/423 ,  H01L21/67057 ,  Y10S134/902

摘要： An apparatus used to supply a force onto a cleaning solution for processing a substrate for cleaning surface contaminants is disclosed. The apparatus includes a force applicator and a gate. The force applicator is configured to be adjusted to a first height off the surface of the substrate. The gate is positioned adjacent to a trailing point of the force applicator and is configured to be adjusted to a second height off of the surface of the substrate to enable planarization of the cleaning solution as the solution moves to the trailing point.

摘要翻译： 公开了一种用于向用于清洁表面污染物的基底处理清洁溶液提供力的装置。 该装置包括一个施力器和一个门。 力施加器构造成被调节到离开衬底表面的第一高度。 门被定位成与施力器的拖尾点相邻，并且被配置成被调节到离开衬底表面的第二高度，以便当溶液移动到拖尾点时使清洁溶液平坦化。

公开(公告)号：US08236382B2

公开(公告)日：2012-08-07

申请号：US10882716

申请日：2004-06-30

申请人： Michael Ravkin ,  John M. de Larios ,  Mikhail Korolik ,  Michael G. R. Smith ,  Carl Woods

发明人： Michael Ravkin ,  John M. de Larios ,  Mikhail Korolik ,  Michael G. R. Smith ,  Carl Woods

IPC分类号： B05D3/00 ,  B05D3/10

CPC分类号： H01L21/67046 ,  B08B1/04 ,  B08B3/04 ,  H01L21/67028 ,  H01L21/67034 ,  H01L21/67051

摘要： A method for preparing a surface of a substrate is provided. The method includes scanning the surface of the substrate by a meniscus, preparing the surface of the substrate using the meniscus, and performing a next preparation operation on the surface of the substrate that was prepared without performing a rinsing operation.

摘要翻译： 提供了制备基板表面的方法。 该方法包括通过弯液面扫描基板的表面，使用弯月面准备基板的表面，并且在不执行漂洗操作的情况下对基板的表面进行下一个准备操作。

公开(公告)号：US07975708B2

公开(公告)日：2011-07-12

申请号：US11731532

申请日：2007-03-30

申请人： Michael Ravkin ,  John M. de Larios ,  Fred C. Redeker ,  Mikhail Korolik ,  Erik M. Freer

发明人： Michael Ravkin ,  John M. de Larios ,  Fred C. Redeker ,  Mikhail Korolik ,  Erik M. Freer

IPC分类号： B08B3/00

CPC分类号： H01L21/67051

摘要： A proximity head including a head surface. The head surface including a first flat region and a plurality of first conduits. Each one of the plurality of first conduits being defined by corresponding one of a plurality of first discrete holes. The plurality of first discrete holes residing in the head surface and extending through the first flat region. The head surface also including a second flat region and a plurality of second conduits. The plurality of second conduits being defined by a corresponding plurality of second discrete holes that reside in the head surface and extend through the second flat region. The head surface also including a third flat region disposed between and adjacent to the first flat region and the second flat region and a plurality of third conduits. The plurality of third conduits being defined by a corresponding plurality of third discrete holes that reside in the head surface and extend through the third flat region. The third conduits being formed at a first angle relative to the third flat region. The first angle being between 30 and 60 degrees. A system and method for processing a substrate with a proximity head is also described.

摘要翻译： 包括头表面的接近头。 头表面包括第一平坦区域和多个第一管道。 多个第一导管中的每一个由多个第一离散孔中的对应的一个限定。 多个第一离散孔位于头表面并延伸穿过第一平坦区域。 头表面还包括第二平坦区域和多个第二管道。 多个第二导管由位于头表面中并延伸穿过第二平坦区域的相应多个第二离散孔限定。 头表面还包括设置在第一平坦区域和第二平坦区域之间并与之相邻的第三平坦区域和多个第三导管。 多个第三导管由位于头表面中并延伸穿过第三平坦区域的对应的多个第三离散孔限定。 第三导管相对于第三平坦区域以第一角度形成。 第一个角度在30到60度之间。 还描述了用于处理具有邻近头的衬底的系统和方法。

公开(公告)号：US07737097B2

公开(公告)日：2010-06-15

申请号：US11346894

申请日：2006-02-03

申请人： Erik M. Freer ,  John M. de Larios ,  Katrina Mikhaylichenko ,  Michael Ravkin ,  Mikhail Korolik ,  Fred C. Redeker

发明人： Erik M. Freer ,  John M. de Larios ,  Katrina Mikhaylichenko ,  Michael Ravkin ,  Mikhail Korolik ,  Fred C. Redeker

IPC分类号： C11D7/50

CPC分类号： H01L21/02052 ,  B08B7/02 ,  C11D9/00 ,  C11D9/02 ,  C11D9/267 ,  C11D11/0047 ,  C11D17/0013 ,  C11D17/0017 ,  C23G1/18 ,  G03F7/42 ,  H01L21/02057 ,  H01L21/02096

摘要： A method is provided for removing contamination from a substrate. The method includes applying a cleaning solution having a dispersed phase, a continuous phase and particles dispersed within the continuous phase to a surface of the substrate. The method includes forcing one of the particles dispersed within the continuous phase proximate to one of the surface contaminants. The forcing is sufficient to overcome any repulsive forces between the particles and the surface contaminants so that the one of the particles and the one of the surface contaminants are engaged. The method also includes removing the engaged particle and surface contaminant from the surface of the substrate. A process to manufacture the cleaning material is also provided.

摘要翻译： 提供了一种用于从衬底去除污染物的方法。 该方法包括将具有分散相，连续相和分散在连续相内的颗粒的清洗溶液施加到基材的表面。 该方法包括迫使分散在连续相内的颗粒中的一种接近一种表面污染物。 强制足以克服颗粒和表面污染物之间的任何排斥力，使得颗粒中的一个和表面污染物之一接合。 该方法还包括从基材的表面除去接合的颗粒和表面污染物。 还提供了制造清洁材料的方法。

公开(公告)号：US20100139694A1

公开(公告)日：2010-06-10

申请号：US12705445

申请日：2010-02-12

申请人： Erik M. Freer ,  John M. de Larios ,  Katrina Mikhaylichenko ,  Michael Ravkin ,  Mikhail Korolik ,  Fred C. Redeker

发明人： Erik M. Freer ,  John M. de Larios ,  Katrina Mikhaylichenko ,  Michael Ravkin ,  Mikhail Korolik ,  Fred C. Redeker

IPC分类号： B08B3/00

CPC分类号： H01L21/02052 ,  B08B7/02 ,  C11D3/2079 ,  C11D9/02 ,  C11D9/26 ,  C11D9/267 ,  C11D11/0047 ,  C11D17/0013 ,  C11D17/0017 ,  C23G1/18 ,  G03F7/425 ,  G03F7/426 ,  H05K3/26

摘要： A cleaning compound is provided. The cleaning compound includes about 0.1 weight percent to about 10 weight percent of a fatty acid dispersed in water. The cleaning compound includes an amount of a base sufficient to bring a pH of the fatty acid water solution to about a level where above about 50% of the dispersed fatty acid is ionized. A method for cleaning a substrate, a system for cleaning a substrate, and a cleaning solution prepared by a process are also provided.

摘要翻译： 提供清洁化合物。 清洁化合物包括分散在水中的约0.1重量％至约10重量％的脂肪酸​​。 清洁化合物包括一定量的足以使脂肪酸水溶液的pH达到大约50％的分散脂肪酸被离子化的水平的碱。 还提供了清洁基板的方法，用于清洁基板的系统以及通过工艺制备的清洁溶液。

公开(公告)号：US20100059088A1

公开(公告)日：2010-03-11

申请号：US12620288

申请日：2009-11-17

申请人： Erik M. Freer ,  John M. de Larios ,  Katrina Mikhaylichenko ,  Michael Ravkin ,  Mikhail Korolik ,  Fred C. Redeker ,  Clint Thomas ,  John Parks

发明人： Erik M. Freer ,  John M. de Larios ,  Katrina Mikhaylichenko ,  Michael Ravkin ,  Mikhail Korolik ,  Fred C. Redeker ,  Clint Thomas ,  John Parks

IPC分类号： B08B3/00 ,  B08B3/12

CPC分类号： H01L21/02057 ,  B05D3/10 ,  B08B7/02 ,  C11D1/04 ,  C11D3/042 ,  C11D3/044 ,  C11D3/18 ,  C11D3/2079 ,  C11D3/222 ,  C11D3/225 ,  C11D3/3765 ,  C11D9/00 ,  C11D9/02 ,  C11D9/267 ,  C11D11/0047 ,  C11D17/0004 ,  C11D17/0013 ,  C11D17/0017 ,  C11D17/003 ,  C11D17/041 ,  C23G1/00 ,  C23G1/18 ,  G03F7/42 ,  G03F7/423 ,  H01L21/02052 ,  H01L21/02096 ,  H01L21/31133 ,  H01L21/67051 ,  H01L21/67057 ,  H01L21/6708 ,  H01L21/67086

摘要： A cleaning material is disposed over a substrate. The cleaning material includes solid components dispersed within a liquid medium. A force is applied to the solid components within the liquid medium to bring the solid components within proximity to contaminants present on the substrate. The force applied to the solid components can be exerted by an immiscible component within the liquid medium. When the solid components are brought within sufficient proximity to the contaminants, an interaction is established between the solid components and the contaminants. Then, the solid components are moved away from the substrate such that the contaminants having interacted with the solid components are removed from the substrate.

摘要翻译： 清洁材料设置在基板上。 清洁材料包括分散在液体介质中的固体组分。 将力施加到液体介质中的固体组分以使固体组分接近存在于基底上的污染物。 施加到固体组分的力可以通过液体介质中的不混溶组分施加。 当固体组分被充分接近污染物时，在固体组分和污染物之间建立了相互作用。 然后，将固体组分从衬底移开，使得与固体组分相互作用的污染物从衬底上除去。

公开(公告)号：US07584761B1

公开(公告)日：2009-09-08

申请号：US11292465

申请日：2005-12-02

申请人： Seokmin Yun ,  John M. Boyd ,  John M. de Larios ,  Fritz Redeker

发明人： Seokmin Yun ,  John M. Boyd ,  John M. de Larios ,  Fritz Redeker

IPC分类号： B08B3/00

CPC分类号： B08B3/04 ,  H01L21/67028 ,  H01L21/67034 ,  H01L21/67051

摘要： A method for cleaning an edge surface of a semiconductor substrate is disclosed. The proximity head unit is positioned so that the flow head portion and the collection head portion of the proximity head unit are proximate to the edge surface of the semiconductor substrate. The semiconductor substrate is then rotated using one or more powered rollers. During the rotation of the semiconductor substrate, the flow head portion applies a fluid to the edge surface while the collection head portion collects fluid from the edge surface. Additional methods, an apparatuses, and a system for cleaning an edge surface of a semiconductor substrate are also described.

摘要翻译： 公开了一种用于清洁半导体衬底的边缘表面的方法。 邻近头单元被定位成使得接近头单元的流动头部分和收集头部分靠近半导体衬底的边缘表面。 然后使用一个或多个动力辊旋转半导体衬底。 在半导体基板旋转期间，流动头部向边缘表面施加流体，而收集头部分从边缘表面收集流体。 还描述了另外的方法，装置和用于清洁半导体衬底的边缘表面的系统。

公开(公告)号：US20080267721A1

公开(公告)日：2008-10-30

申请号：US12173661

申请日：2008-07-15

申请人： John M. de Larios ,  Mike Ravkin ,  John Parks ,  Mikhail Korolik ,  Fred C. Redeker

发明人： John M. de Larios ,  Mike Ravkin ,  John Parks ,  Mikhail Korolik ,  Fred C. Redeker

IPC分类号： B65G51/01

CPC分类号： H01L21/67784 ,  H01L21/67057

摘要： A method for transporting a substrate is provided. In this method, a non-Newtonian fluid is provided and the substrate is suspended in the non-Newtonian fluid. The non-Newtonian fluid is capable of supporting the substrate. Thereafter, a supply force is applied on the non-Newtonian fluid to cause the non-Newtonian fluid to flow, whereby the flow is capable of moving the substrate along a direction of the flow. Apparatuses and systems for transporting the substrate using the non-Newtonian fluid also are described.

摘要翻译： 提供了一种输送基板的方法。 在该方法中，提供了非牛顿流体，并将基底悬挂在非牛顿流体中。 非牛顿流体能够支撑基底。 此后，向非牛顿流体施加供应力以使非牛顿流体流动，由此流动能够沿着流动方向移动基底。 还描述了使用非牛顿流体输送基底的装置和系统。

公开(公告)号：US07252097B2

公开(公告)日：2007-08-07

申请号：US10606022

申请日：2003-06-24

申请人： John M. Boyd ,  John M. de Larios ,  Michael Ravkin ,  Fred C. Redeker

发明人： John M. Boyd ,  John M. de Larios ,  Michael Ravkin ,  Fred C. Redeker

IPC分类号： B08B3/00 ,  B08B7/04

CPC分类号： H01L21/67028 ,  G03F7/70341 ,  H01L21/67034 ,  H01L21/67051 ,  Y10S134/902

摘要： A system and method for processing a wafer includes applying a process to the wafer. The process being supported by a surface tension gradient device. A result of the process is monitored. The monitored result is output.

摘要翻译： 用于处理晶片的系统和方法包括将工艺应用于晶片。 该过程由表面张力梯度装置支撑。 监视该过程的结果。 输出监视结果。

公开(公告)号：US07234477B2

公开(公告)日：2007-06-26

申请号：US10261839

申请日：2002-09-30

申请人： John M. de Larios ,  Mike Ravkin ,  Carl Woods ,  Fritz Redeker ,  James P. Garcia ,  Afshin Nickhou

发明人： John M. de Larios ,  Mike Ravkin ,  Carl Woods ,  Fritz Redeker ,  James P. Garcia ,  Afshin Nickhou

IPC分类号： B08B3/00 ,  F26B5/04

CPC分类号： H01L21/67051 ,  B08B3/04 ,  G03F7/30 ,  H01L21/67028 ,  H01L21/67034 ,  Y10S134/902

摘要： One of many embodiments of a substrate preparation system is provided which includes a head having a head surface where the head surface is proximate to a surface of the substrate. The system also includes a first conduit for delivering a first fluid to the surface of the substrate through the head, and a second conduit for delivering a second fluid to the surface of the substrate through the head, where the second fluid is different than the first fluid. The system also includes a third conduit for removing each of the first fluid and the second fluid from the surface of the substrate where the first conduit, the second conduit and the third conduit act substantially simultaneously.

摘要翻译： 提供了一种衬底制备系统的许多实施例之一，其包括具有头表面的头部，其头表面靠近衬底的表面。 该系统还包括用于通过头部将第一流体输送到基底表面的第一导管和用于通过头部将第二流体输送到基底表面的第二导管，其中第二流体不同于第一流体 流体。 该系统还包括第三导管，用于从基板的表面移除第一流体和第二流体中的每一个，其中第一导管，第二导管和第三导管基本上同时作用。