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    Drip manifold for uniform chemical delivery
    1.
    发明授权
    Drip manifold for uniform chemical delivery 失效

    公开(公告)号：US06827793B2

    公开(公告)日：2004-12-07

    申请号：US10662096

    申请日：2003-09-12

    申请人： Don E. Anderson ,  Katrina A. Mikhaylich ,  Mike Ravkin ,  John M. de Larios

    发明人： Don E. Anderson ,  Katrina A. Mikhaylich ,  Mike Ravkin ,  John M. de Larios

    IPC分类号： B08B104

    CPC分类号： H01L21/67051 ,  B08B1/04 ,  B08B3/04 ,  Y10S134/902 ,  Y10S239/19

    摘要： A method for cleaning a wafer with a drip nozzle being configured for use in a drip manifold that is oriented over a brush of a wafer cleaning system is provided. The drip nozzle has a first end and a second end with a passage defined there between where the passage includes a wall that extends longitudinally between the first end and the second end. An orifice is defined within the passage and located at the first end of the drip nozzle. The method includes inputting a fluid into the drip nozzle at an acute angle relative to a longitudinal extension of the wall and reflecting the fluid stream off an internal wall of the drip nozzle at least twice in a direction that is toward the second end. The method further includes outputting at least one substantially uniform drop from the second end of the passage.

    Drip manifold for uniform chemical delivery
    2.
    发明授权
    Drip manifold for uniform chemical delivery 有权
    滴灌歧管用于均匀化学品输送

    公开(公告)号：US06622335B1

    公开(公告)日：2003-09-23

    申请号：US09538865

    申请日：2000-03-29

    申请人： Don E. Anderson ,  Katrina A. Mikhaylich ,  Mike Ravkin ,  John M. de Larios

    发明人： Don E. Anderson ,  Katrina A. Mikhaylich ,  Mike Ravkin ,  John M. de Larios

    IPC分类号： B08B104

    CPC分类号： H01L21/67051 ,  B08B1/04 ,  B08B3/04 ,  Y10S134/902 ,  Y10S239/19

    摘要： A drip manifold having drip nozzles configured to form controlled droplets is provided for use in wafer cleaning systems. The drip manifold includes a plurality of drip nozzles that are secured to the drip manifold. Each of the plurality of drip nozzles has a passage defined between a first end and a second end. A sapphire orifice is defined within the passage and is located at the first end of the drip nozzle. The sapphire orifice is angled to produce a fluid stream that is reflected within the passage and toward the second end to form one or more uniform drops over a brush.

    摘要翻译： 具有配置成形成受控液滴的滴水喷嘴的滴水歧管被提供用于晶片清洁系统中。 滴水歧管包括固定到滴水歧管的多个滴水嘴。 多个滴水喷嘴中的每一个具有在第一端和第二端之间限定的通道。 在通道内限定蓝宝石孔，位于滴水嘴的第一端。 蓝宝石孔口成角度以产生在通道内反射并流向第二端的流体流，以在刷子上形成一个或多个均匀的液滴。

    METHOD AND APPARATUS FOR TRANSPORTING A SUBSTRATE USING NON-NEWTONIAN FLUID
    3.
    发明申请
    METHOD AND APPARATUS FOR TRANSPORTING A SUBSTRATE USING NON-NEWTONIAN FLUID 失效
    使用非牛顿流体运输基质的方法和装置

    公开(公告)号：US20080267721A1

    公开(公告)日：2008-10-30

    申请号：US12173661

    申请日：2008-07-15

    申请人： John M. de Larios ,  Mike Ravkin ,  John Parks ,  Mikhail Korolik ,  Fred C. Redeker

    发明人： John M. de Larios ,  Mike Ravkin ,  John Parks ,  Mikhail Korolik ,  Fred C. Redeker

    IPC分类号： B65G51/01

    CPC分类号： H01L21/67784 ,  H01L21/67057

    摘要： A method for transporting a substrate is provided. In this method, a non-Newtonian fluid is provided and the substrate is suspended in the non-Newtonian fluid. The non-Newtonian fluid is capable of supporting the substrate. Thereafter, a supply force is applied on the non-Newtonian fluid to cause the non-Newtonian fluid to flow, whereby the flow is capable of moving the substrate along a direction of the flow. Apparatuses and systems for transporting the substrate using the non-Newtonian fluid also are described.

    摘要翻译： 提供了一种输送基板的方法。 在该方法中，提供了非牛顿流体，并将基底悬挂在非牛顿流体中。 非牛顿流体能够支撑基底。 此后，向非牛顿流体施加供应力以使非牛顿流体流动，由此流动能够沿着流动方向移动基底。 还描述了使用非牛顿流体输送基底的装置和系统。

    Single wafer residue, thin film removal and clean
    5.
    发明授权
    Single wafer residue, thin film removal and clean 有权
    单晶片残留，薄膜去除和清洁

    公开(公告)号：US06594847B1

    公开(公告)日：2003-07-22

    申请号：US09537913

    申请日：2000-03-28

    申请人： Wilbur Krusell ,  John M. de Larios ,  Mike Ravkin

    发明人： Wilbur Krusell ,  John M. de Larios ,  Mike Ravkin

    IPC分类号： G03D506

    CPC分类号： H01L21/67051 ,  B08B1/04 ,  B08B3/10 ,  H01L21/67046 ,  Y10S134/902

    摘要： A system is provided for use in semiconductor wafer cleaning operations. The cleaning system has a top cap and a bottom cap. The top cap seals on a top surface contact ring of a wafer, and the bottom cap seals on a bottom surface contact ring of the wafer. The wafer is held between the top cap and the bottom cap. An edge clean roller is used for cleaning an edge of the wafer. A drive roller is configured to rotate the wafer, the top cap, and the bottom cap. The edge clean roller rotates at a first velocity and the drive roller rotates at a second velocity so as to facilitate an edge cleaning of the wafer by the edge clean roller.

    摘要翻译： 提供了一种用于半导体晶片清洗操作的系统。 清洁系统具有顶盖和底盖。 顶盖在晶片的顶表面接触环上密封，并且底盖密封在晶片的底表面接触环上。 晶片保持在顶盖和底盖之间。 边缘清洁辊用于清洁晶片的边缘。 驱动辊构造成旋转晶片，顶盖和底盖。 边缘清洁辊以第一速度旋转，并且驱动辊以第二速度旋转，以便于通过边缘清洁辊对晶片进行边缘清洁。

    System and method for contained chemical surface treatment
    8.
    发明申请
    System and method for contained chemical surface treatment 失效
    含化学表面处理的系统和方法

    公开(公告)号：US20090114249A1

    公开(公告)日：2009-05-07

    申请号：US11704435

    申请日：2007-02-08

    申请人： Katrina Mikhaylichenko ,  Mike Ravkin ,  Fritz Redeker ,  John M. de Larios ,  Erik M. Freer ,  Mikhail Korolik

    发明人： Katrina Mikhaylichenko ,  Mike Ravkin ,  Fritz Redeker ,  John M. de Larios ,  Erik M. Freer ,  Mikhail Korolik

    IPC分类号： B08B3/04

    CPC分类号： H01L21/02057 ,  C25D5/34 ,  C25D7/12 ,  H01L21/288 ,  H01L21/67051 ,  H01L21/67057 ,  H01L21/6708 ,  H01L21/67086 ,  H01L21/76841

    摘要： An apparatus, system and method for preparing a surface of a substrate using a proximity head includes applying a non-Newtonian fluid between the surface of the substrate and a head surface of the proximity head. The non-Newtonian fluid defines a containment wall along one or more sides between the head surface and the surface of the substrate. The one or more sides provided with the non-Newtonian fluid define a treatment region on the substrate between the head surface and the surface of the substrate. A Newtonian fluid is applied to the surface of the substrate through the proximity head, such that the applied Newtonian fluid is substantially contained in the treatment region defined by the containment wall. The contained Newtonian fluid aids in the removal of one or more contaminants from the surface of the substrate. In one example, the non-Newtonian fluid can also be used to create ambient controlled isolated regions, which can assist in controlled processing of surfaces within the regions. In an alternate example, a second non-Newtonian fluid is applied to the treatment region instead of the Newtonian fluid. The second non-Newtonian fluid acts on one or more contaminants on the surface of the substrate substantially removing them from the surface of the substrate.

    摘要翻译： 使用接近头来制备基底的表面的装置，系统和方法包括在基底的表面和邻近头的头表面之间施加非牛顿流体。 非牛顿流体在头表面和基底表面之间沿着一个或多个侧面限定了容纳壁。 设置有非牛顿流体的一个或多个侧面限定了头表面和基底表面之间的基底上的处理区域。 通过邻近头将牛顿流体施加到基底的表面，使得所施加的牛顿流体基本上包含在由容纳壁限定的处理区域中。 所含的牛顿流体有助于从基底表面去除一种或多种污染物。 在一个示例中，非牛顿流体也可以用于创建环境控制的隔离区域，这可以有助于区域内的表面的受控处理。 在替代示例中，将第二非牛顿流体施加到处理区域而不是牛顿流体。 第二非牛顿流体作用于衬底表面上的一种或多种污染物，基本上将其从衬底的表面上除去。

    Methods for drying semiconductor wafer surfaces using a plurality of inlets and outlets held in close proximity to the wafer surfaces
    9.
    发明授权
    Methods for drying semiconductor wafer surfaces using a plurality of inlets and outlets held in close proximity to the wafer surfaces 失效
    使用保持在晶片表面附近的多个入口和出口干燥半导体晶片表面的方法

    公开(公告)号：US07387689B2

    公开(公告)日：2008-06-17

    申请号：US11750960

    申请日：2007-05-18

    申请人： John M. de Larios ,  Mike Ravkin ,  Carl Woods ,  Fritz Redeker ,  James P. Garcia

    发明人： John M. de Larios ,  Mike Ravkin ,  Carl Woods ,  Fritz Redeker ,  James P. Garcia

    IPC分类号： B08B3/00 ,  F26B5/04

    CPC分类号： H01L21/67051 ,  B08B3/04 ,  G03F7/30 ,  H01L21/67028 ,  H01L21/67034 ,  Y10S134/902

    摘要： Methods for processing substrate through a head that is configured to be placed in close non-contact proximity to a surface of a substrate are provided. One method includes applying a first fluid onto the surface of the substrate from conduits in the head when the head is in close proximity to the surface of the substrate and removing the first fluid from the surface of the substrate. The removing is processed just as first fluid is applied to the surface of the substrate, and the removing ensures that the applied first fluid is contained between a surface of the head and the surface of the substrate and the first fluid being applied and removed defines a controlled meniscus. The method further includes moving the controlled meniscus over different regions of the surface of the substrate when movement of the head or the substrate is dictated. The moving of the controlled meniscus enables processing of part or all of the surface of the substrate using the first fluid.

    摘要翻译： 提供了通过头部处理基板的方法，该头被配置为与基板的表面紧密非接触地放置。 一种方法包括当头部紧邻衬底的表面并从衬底的表面去除第一流体时，将第一流体施加到衬底表面上的管道中。 当第一流体被施加到基板的表面上时，移除被处理，并且移除确保所施加的第一流体被包含在头部的表面和基底的表面之间，并且被施加和移除的第一流体限定了 受控半月板 所述方法还包括当限制头部或基底的运动时，将受控弯液面移动到衬底的表面的不同区域上。 受控弯液面的移动使得能够使用第一流体处理基板的部分或全部表面。