公开(公告)号：US20130000966A1

公开(公告)日：2013-01-03

申请号：US13472281

申请日：2012-05-15

Applicant: Dong Jun LEE

Inventor： Dong Jun LEE

IPC: H05K1/11 ,  H01B5/14 ,  H05K3/00

CPC classification number: H05K3/244 ,  H01L23/49866 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48455 ,  H01L2224/85444 ,  H01L2924/01029 ,  H05K2201/0338 ,  H05K2203/049 ,  Y10T29/49124 ,  Y10T29/49181 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00015

Abstract: A wire bonding joint structure of a joint pad in which electroless surface treatment plating layers of joint pads configured by a nickel layer/a palladium layer/a gold layer are connected to each other by a metal wire and when the metal wire is joined to the electroless surface treatment plating layer, a depth of the wire bonding pad formed by wedge deformation is 1.0 m or more.The electroless surface treatment layer of the joint pad can lower strength and hardness of the wire bonding pad of which the surface is treated to improve follow-up capability between a gold wire and the bonding pad, such that a joint area between the gold and the bonding pad is maximized, thereby increasing joinability at the wire bonding finish process by wedge pressure and greatly improving wire bonding workability.

Abstract translation: 接合垫的线接合结构，其中由镍层/钯层/金层构成的接合垫的无电解表面处理镀层通过金属线彼此连接，并且当金属线接合到 无电解表面处理镀层，由楔形变形形成的导线焊盘的深度为1.0μm以上。 接合垫的无电解表面处理层可以降低处理表面的引线接合焊盘的强度和硬度，以提高金线和焊盘之间的跟踪能力，使得金和焊盘之间的接合面积 焊盘最大化，从而通过楔形压力提高了引线接合处理过程中的接合性，并大大提高了引线接合可加工性。

公开(公告)号：US20130024592A1

公开(公告)日：2013-01-24

申请号：US13551081

申请日：2012-07-17

Applicant: Dong Jun LEE

Inventor： Dong Jun LEE

IPC: G06F13/00

CPC classification number: G06F13/409

Abstract: A docking station for a communication terminal having an antenna for a radio communication is provided. The docking station includes a docking unit, a fastening unit, and a pattern unit. The docking unit is configured to be joined to the communication terminal and to provide an interface with the communication terminal. The fastening unit is coupled with the docking unit, configured to fixedly hold the communication terminal, and electrically coupled to the antenna through an electromagnetic field created in the antenna when the antenna operates. The pattern unit is disposed on the docking unit so as to be extended from the fastening unit, and configured to perform the radio communication together with the antenna by being electrically coupled to the antenna through the fastening unit when the antenna operates.

Abstract translation: 提供了一种用于具有用于无线电通信的天线的通信终端的对接站。 对接站包括对接单元，紧固单元和图案单元。 对接单元被配置为连接到通信终端并提供与通信终端的接口。 紧固单元与对接单元耦合，其被配置为固定地保持通信终端，并且当天线操作时通过天线中产生的电磁场电耦合到天线。 图案单元设置在对接单元上，以从紧固单元延伸，并且被配置为当天线操作时通过紧固单元电耦合到天线，与天线一起执行无线电通信。

公开(公告)号：US20130000967A1

公开(公告)日：2013-01-03

申请号：US13536465

申请日：2012-06-28

Applicant: Dong Jun LEE ,  Jung Suk Kim

Inventor： Dong Jun LEE ,  Jung Suk Kim

IPC: H01R4/02 ,  B23K1/20 ,  H05K1/11

CPC classification number: H01L24/11 ,  C23C18/1651 ,  C23C18/1692 ,  C23C18/32 ,  C23C18/42 ,  C23C18/44 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/03464 ,  H01L2224/03849 ,  H01L2224/0401 ,  H01L2224/05005 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05644 ,  H01L2224/08503 ,  H01L2224/11849 ,  H01L2924/01029 ,  H01L2924/01327 ,  H05K3/244 ,  H05K3/3478 ,  H05K3/4007 ,  H01L2924/00012 ,  H01L2924/2064

Abstract: Disclosed herein are an electric joint structure including a joint, an intermetallic compound (IMC), and a solder layer, wherein the intermetallic compound (IMC) is generated from an electroless surface treatment plating layer including nickel plating coating of 1 μm or less, a method for preparing the same, and a printed circuit board including the same. The electric joint structure having the intermetallic compound structure according to the exemplary embodiment of the present invention can have a joint structure capable of improving impact resistance by suppressing the generation of a Ni—Sn based intermetallic compound and a P-enriched layer at a solder joint interface during a reflow process and improving workability including the Ni layer before the reflow process.

Abstract translation: 本发明公开了一种电接头结构，包括接头，金属间化合物（IMC）和焊料层，其中金属间化合物（IMC）由包括1μm或更小的镀镍涂层的化学镀处理镀层产生， 制备其的方法和包括该印刷电路板的印刷电路板。 具有根据本发明的示例性实施方式的金属间化合物结构的电接头结构可以具有能够通过抑制在焊接接头处产生Ni-Sn系金属间化合物和P富集层而能够改善耐冲击性的接合结构 在回流工艺期间接口，并且改善包括回流工艺之前的Ni层的可加工性。

公开(公告)号：US20130000960A1

公开(公告)日：2013-01-03

申请号：US13472299

申请日：2012-05-15

Applicant: Dong Jun LEE ,  Dong Ju Jeon ,  Jung Youn Pang ,  Seong Min Cho ,  Chi Seong Kim

Inventor： Dong Jun LEE ,  Dong Ju Jeon ,  Jung Youn Pang ,  Seong Min Cho ,  Chi Seong Kim

IPC: H05K1/09 ,  H05K3/00

CPC classification number: C23C18/1651 ,  C23C18/1806 ,  C23C18/1827 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48644 ,  H01L2224/85444 ,  H01L2924/00014 ,  H05K3/244 ,  H05K2203/072 ,  H01L2924/00 ,  H01L2924/207

Abstract: Disclosed herein are a printed circuit board and a method for manufacturing the same. The printed circuit board includes: a copper pad surface roughness-treated to have a surface roughness of 0.1 to 1.0 μm pitch period; and an electroless surface treatment plating layer formed on the copper pad. According to the present invention, when the copper pad has a surface roughness of a predetermined pitch period, the electroless surface treatment plating layer formed on the copper pad also has a surface roughness of the predetermined pitch period, thereby having an effect of widening a surface area and improving workability at the time of a wire bonding process for connection with an external device.

Abstract translation: 这里公开了一种印刷电路板及其制造方法。 印刷电路板包括：铜表面粗糙处理以使表面粗糙度为0.1至1.0μm间距周期; 以及形成在铜垫上的化学镀处理镀层。 根据本发明，当铜垫具有预定间距周期的表面粗糙度时，形成在铜焊盘上的化学镀处理镀层也具有预定间距周期的表面粗糙度，从而具有使表面变宽的效果 并且在用于与外部设备连接的引线接合过程时提高可操作性。