公开(公告)号：US20090032916A1

公开(公告)日：2009-02-05

申请号：US12182843

申请日：2008-07-30

申请人： Dong-Kil SHIN ,  Sang-Wook PARK

发明人： Dong-Kil SHIN ,  Sang-Wook PARK

IPC分类号： H01L23/495

CPC分类号： H05K3/3426 ,  H01L23/49548 ,  H01L23/49555 ,  H01L23/49575 ,  H01L23/49582 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/1532 ,  H01L2924/181 ,  H05K2201/10477 ,  H05K2201/10689 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package apparatus and a method of fabricating the semiconductor package apparatus. The semiconductor package apparatus includes: semiconductor chips comprising active and inactive surfaces and protected by a packing portion; a substrate on which the semiconductor chips are installed; leads comprising front portions electrically coupled to the active surfaces of the semiconductor chips and rear portions extending substantially to the substrate; and bonding materials bonded between ends of the rear portions of the leads and the substrate to electrically couple the leads to the substrate. Ends of the rear portions of the leads may stand on the substrate. Thus, solder joint reliability can be improved, and a wetting characteristic of solder can be improved during surface installation. Also, semiconductor package apparatuses having similar attributes can easily be multilayered. In addition, a foot print of the semiconductor package apparatus can be reduced to enable high-density installation. Moreover, shapes of the bonding materials (solder) can be controlled to optimize bonding strength of the leads, quantity of the bonding materials, or the like.

摘要翻译： 一种半导体封装装置及其制造方法。 半导体封装装置包括：半导体芯片，包括有源和非活性表面，并被封装部分保护; 其上安装有半导体芯片的基板; 引线包括电耦合到半导体芯片的有源表面的前部和基本上延伸到衬底的后部; 以及接合在引线的后部的端部与基板之间的接合材料，以将引线电耦合到基板。 引线的后部的端部可以位于基板上。 因此，可以提高焊点可靠性，并且可以在表面安装期间改善焊料的润湿特性。 此外，具有相似属性的半导体封装装置可以容易地多层化。 此外，可以减少半导体封装装置的脚印，以实现高密度安装。 此外，可以控制接合材料（焊料）的形状，以优化引线的接合强度，接合材料的量等。