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    Dual-zone boiling process
    2.
    发明授权
    Dual-zone boiling process 失效
    双区沸腾过程

    公开(公告)号：US4653572A

    公开(公告)日：1987-03-31

    申请号：US838483

    申请日：1986-03-11

    申请人： Douglas L. Bennett ,  Alexander Schwarz ,  Robert M. Thorogood

    发明人： Douglas L. Bennett ,  Alexander Schwarz ,  Robert M. Thorogood

    IPC分类号： F28F1/40 ,  F25J3/00 ,  F25J3/04 ,  F28F13/02 ,  F28F13/14 ,  F28F13/18

    CPC分类号： F28F13/187 ,  F25J3/04412 ,  F25J5/002 ,  F28F13/14 ,  F25J2250/02 ,  F25J2290/44 ,  Y10S165/911

    摘要： The invention relates to a process and apparatus for boiling flowing liquid such as liquefied gases in a heat exchanger in which a circulating flow is occuring, such as in reboiler-condensers in air separation and similar cryogenic plants or other applications where a high efficiency for boiling heat transfer is beneficial. The important feature of the process and apparatus is the use of two sequential heat transfer zones having different pressure drop and heat transfer characteristics in the same boiling channel, the first zone having a higher pressure drop and high convective heat transfer characteristic and the second zone having a lower pressure drop and an enhanced nucleate boiling heat transfer characteristic.

    摘要翻译： 本发明涉及一种用于在其中产生循环流动的热交换器中沸腾流动液体如液化气体的过程和装置，例如空气分离中的再沸器 - 冷凝器和类似的低温设备或其中沸腾效率高的其它应用 传热是有益的。 该方法和装置的重要特征是在相同的沸腾通道中使用具有不同压差和传热特性的两个连续传热区，第一区具有较高的压降和较高的对流传热特性，第二区具有 较低的压降和增强的核沸腾传热特性。

    Dense phase processing fluids for microelectronic component manufacture
    8.
    发明授权
    Dense phase processing fluids for microelectronic component manufacture 失效
    用于微电子元件制造的密相加工液

    公开(公告)号：US07282099B2

    公开(公告)日：2007-10-16

    申请号：US10253296

    申请日：2002-09-24

    申请人： Wayne Thomas McDermott ,  Richard Carl Ockovic ,  Alexander Schwarz

    发明人： Wayne Thomas McDermott ,  Richard Carl Ockovic ,  Alexander Schwarz

    IPC分类号： B08B3/00

    CPC分类号： B08B7/0021 ,  Y10S438/906

    摘要： Method for processing an article by contacting the article with a dense fluid. The article is introduced into a sealable processing chamber and the processing chamber is sealed. A dense fluid is prepared by introducing a subcritical fluid into a pressurization vessel and isolating the vessel, and then heating the subcritical fluid at essentially constant volume and essentially constant density to yield a dense fluid. At least a portion of the dense fluid is transferred from the pressurization vessel to the processing chamber, wherein the transfer of the dense fluid is driven by the difference between the pressure in the pressurization vessel and the pressure in the processing chamber, thereby pressurizing the processing chamber with transferred dense fluid. The article is contacted with the transferred dense fluid to yield a spent dense fluid and a treated article, and the spent dense fluid is separated from the treated article.

    摘要翻译： 通过使制品与致密流体接触来处理制品的方法。 将物品引入可密封的处理室中，并且处理室被密封。 通过将亚临界流体引入加压容器并分离容器，然后以基本上恒定的体积和基本上恒定的密度加热亚临界流体以产生致密的流体来制备致密流体。 致密流体的至少一部分从加压容器转移到处理室，其中致密流体的转移由加压容器中的压力与处理室中的压力之间的差异驱动，由此加压处理 室内转移致密流体。 将物品与转移的致密流体接触以产生用过的致密流体和经处理的物品，并将废的致密流体与经处理的物品分离。

    Apparatus and method for removal of surface oxides via fluxless technique involving electron attachment and remote ion generation
    9.
    发明申请
    Apparatus and method for removal of surface oxides via fluxless technique involving electron attachment and remote ion generation 有权
    通过涉及电子附着和远程离子生成的无通量技术去除表面氧化物的装置和方法

    公开(公告)号：US20060164784A1

    公开(公告)日：2006-07-27

    申请号：US11389772

    申请日：2006-03-27

    申请人： Chun Dong ,  Wayne McDermott ,  Richard Patrick ,  Alexander Schwarz

    发明人： Chun Dong ,  Wayne McDermott ,  Richard Patrick ,  Alexander Schwarz

    IPC分类号： H01T23/00

    CPC分类号： C23G5/00 ,  B08B7/00 ,  B23K1/0016 ,  B23K1/008 ,  B23K1/012 ,  B23K1/206 ,  H05K3/3489 ,  H05K2203/095

    摘要： The present invention provides a method and apparatus for the dry fluxing of at least one component and/or solder surface via electron attachment. In one embodiment, there is provided a method for removing oxides from the surface of a component comprising: providing a component on a substrate wherein the substrate is grounded or has a positive electrical potential to form a target assembly; passing a gas mixture comprising a reducing gas through an ion generator comprising a first and a second electrode; supplying an amount of voltage to at least one of the first and second electrodes sufficient to generate electrons wherein the electrons attach to at least a portion of the reducing gas and form a negatively charged reducing gas; and contacting the target assembly with the negatively charged reducing gas to reduce the oxides on the component.

    摘要翻译： 本发明提供了一种用于通过电子附件干燥熔化至少一种组分和/或焊料表面的方法和装置。 在一个实施方案中，提供了从组分表面去除氧化物的方法，包括：在基底上提供组分，其中所述基底接地或具有正电位以形成靶组件; 使包含还原气体的气体混合物通过包括第一和第二电极的离子发生器; 向所述第一和第二电极中的至少一个电极供应足以产生电子的电压，其中所述电子附着到所述还原气体的至少一部分并形成带负电荷的还原气体; 并将目标组件与带负电荷的还原气体接触以减少部件上的氧化物。