Method of grinding thin-film magnetic heads using optical grinding
markers
    1.
    发明授权
    Method of grinding thin-film magnetic heads using optical grinding markers 失效
    使用光学研磨标记研磨薄膜磁头的方法

    公开(公告)号:US5579717A

    公开(公告)日:1996-12-03

    申请号:US324424

    申请日:1994-10-13

    摘要: According to the present grinding method, a plurality of optical markers are formed by photolithography such that the markers are embedded in a chiplet having a magnetic head. Markers are preferably in the shape of a bar having predetermined height, width and length and are spaced from each other by a predetermined distance where one end of the bars are sequentially offset from each other by a predetermined amount. During coarse grinding of the magnetic head as the magnetic head surface material is ground away, the end-face of the bars, one at a time, become visible. The closer the grinding surface approaches the desired inductive throat or MR element height, more end-faces become visible. Coarse grinding continues until a predetermined number of end-faces become visible at which point the grinding process is terminated and the magnetic head is ready for the final lapping process.

    摘要翻译: 根据本研磨方法,通过光刻法形成多个光学标记,使得标记物嵌入具有磁头的小芯片中。 标记优选为具有预定高度,宽度和长度的条形的形状,并且彼此隔开预定距离,其中杆的一端相互偏移预定量。 当磁头表面材料被磨掉时,在磁头粗磨时,钢筋的端面一次一个变得可见。 研磨表面越接近所需的感应喉部或MR元件高度,越多的端面变得可见。 继续进行粗磨,直到预定数量的端面变得可见,此时研磨过程终止,并且磁头准备好进行最后的研磨过程。

    Verification of a fabrication process used to form read elements in magnetic heads
    2.
    发明授权
    Verification of a fabrication process used to form read elements in magnetic heads 有权
    用于在磁头中形成读取元件的制造工艺的验证

    公开(公告)号:US07919967B2

    公开(公告)日:2011-04-05

    申请号:US11965502

    申请日:2007-12-27

    IPC分类号: G01R31/08 G01R27/08

    摘要: Test methods and components are disclosed for testing the quality of a fabrication process used to form read elements in magnetic heads. A wafer is populated with one or more test components along with magnetic heads. The test components are formed by the same or similar fabrication processes as the read elements, but do not include a conductive MR sensor between the test leads. By measuring the resistance of the test components, the formation of parasitic shunts can be identified in the test components, which may indicate the formation of parasitic shunts in the read elements. Thus, the quality of the fabrication process in forming read elements in magnetic head may be determined.

    摘要翻译: 公开了用于测试用于在磁头中形成读取元件的制造工艺的质量的测试方法和部件。 晶片与磁头一起安装有一个或多个测试部件。 测试部件通过与读取元件相同或相似的制造工艺形成,但不包括测试引线之间的导电MR传感器。 通过测量测试部件的电阻,可以在测试部件中识别寄生分流器的形成,这可以指示在读取元件中形成寄生分流。 因此,可以确定在磁头中形成读取元件的制造工艺的质量。

    Test components fabricated with large area sensors used for determining the resistance of an MR sensor
    3.
    发明授权
    Test components fabricated with large area sensors used for determining the resistance of an MR sensor 有权
    用大面积传感器制造的测试部件用于确定MR传感器的电阻

    公开(公告)号:US07855553B2

    公开(公告)日:2010-12-21

    申请号:US11965587

    申请日:2007-12-27

    IPC分类号: G01R33/12

    摘要: Test methods and components are disclosed for testing resistances of magnetoresistance (MR) sensors in read elements. Test components are fabricated on a wafer with a first test lead, a test MR sensor, and a second test lead. The test leads and test MR sensor are fabricated with similar processes as first shields, MR sensors, and second shields of read elements on tie wafer. However, the test MR sensor is fabricated with an area that is larger than areas of the MR sensors in the read elements. The larger area of the test MR sensor causes the resistance of the test MR sensor to be insignificant compared to the lead resistance. Thus, a resistance measurement of the test component represents the lead resistance of a read element. An accurate resistance measurement of an MR sensor in a read element may then be determined by subtracting the lead resistance.

    摘要翻译: 公开了用于测试读取元件中的磁阻(MR)传感器的电阻的测试方法和组件。 在具有第一测试导线,测试MR传感器和第二测试导线的晶片上制造测试部件。 测试引线和测试MR传感器采用与晶片上的读取元件的第一屏蔽,MR传感器和第二屏蔽类似的工艺制造。 然而,测试MR传感器的制造面积大于读取元件中MR传感器的面积。 测试MR传感器的较大面积导致测试MR传感器的电阻与引线电阻相比不显着。 因此,测试部件的电阻测量表示读取元件的引线电阻。 然后可以通过减去引线电阻来确定读取元件中的MR传感器的精确电阻测量。

    Electrical lapping guides made from tunneling magnetoresistive (TMR) material
    4.
    发明授权
    Electrical lapping guides made from tunneling magnetoresistive (TMR) material 失效
    由隧道磁阻(TMR)材料制成的电气研磨导轨

    公开(公告)号:US07564110B2

    公开(公告)日:2009-07-21

    申请号:US11379321

    申请日:2006-04-19

    IPC分类号: H01L29/82

    摘要: Tunneling magnetoresistive (TMR) electrical lapping guides (ELG) are disclosed for use in wafer fabrication of magnetic sensing devices, such as magnetic recording heads using TMR read elements. A TMR ELG includes a TMR stack comprising a first conductive layer, a barrier layer, and a second conductive layer of TMR material. The TMR ELG also includes a first lead and a second lead that connect to conductive pads used for applying a sense current to the TMR ELG in a current in plane (CIP) fashion. The first lead contacts one side of the TMR stack so that the first lead contacts both the first conductive layer and the second conductive layer of the TMR stack. The second lead contacts the other side of the TMR stack so that the second lead contacts both the first conductive layer and the second conductive layer of the TMR stack.

    摘要翻译: 公开了隧道磁阻(TMR)电研磨引导件(ELG),用于磁感测装置的晶片制造,例如使用TMR读取元件的磁记录头。 TMR ELG包括TMR堆叠,其包括第一导电层,阻挡层和TMR材料的第二导电层。 TMR ELG还包括连接到用于以当前平面(CIP)方式向TMR ELG施加感测电流的导电焊盘的第一引线和第二引线。 第一引线接触TMR堆叠的一侧,使得第一引线接触TMR堆叠的第一导电层和第二导电层。 第二引线接触TMR堆叠的另一侧,使得第二引线接触TMR堆叠的第一导电层和第二导电层。

    VERIFICATION OF A FABRICATION PROCESS USED TO FORM READ ELEMENTS IN MAGNETIC HEADS
    6.
    发明申请
    VERIFICATION OF A FABRICATION PROCESS USED TO FORM READ ELEMENTS IN MAGNETIC HEADS 有权
    用于形成读取磁头元件的制造工艺的验证

    公开(公告)号:US20090168214A1

    公开(公告)日:2009-07-02

    申请号:US11965502

    申请日:2007-12-27

    IPC分类号: G11B27/36

    摘要: Test methods and components are disclosed for testing the quality of a fabrication process used to form read elements in magnetic heads. A wafer is populated with one or more test components along with magnetic heads. The test components are formed by the same or similar fabrication processes as the read elements, but do not include a conductive MR sensor between the test leads. By measuring the resistance of the test components, the formation of parasitic shunts can be identified in the test components, which may indicate the formation of parasitic shunts in the read elements. Thus, the quality of the fabrication process in forming read elements in magnetic head may be determined.

    摘要翻译: 公开了用于测试用于在磁头中形成读取元件的制造工艺的质量的测试方法和部件。 晶片与磁头一起安装有一个或多个测试部件。 测试部件通过与读取元件相同或相似的制造工艺形成,但不包括测试引线之间的导电MR传感器。 通过测量测试部件的电阻,可以在测试部件中识别寄生分流器的形成,这可以指示在读取元件中形成寄生分流。 因此,可以确定在磁头中形成读取元件的制造工艺的质量。

    MAGNETIC SENSOR HAVING HARD BIAS STRUCTURE FOR OPTIMIZED HARD BIAS FIELD AND HARD BIAS COERCIVITY
    8.
    发明申请
    MAGNETIC SENSOR HAVING HARD BIAS STRUCTURE FOR OPTIMIZED HARD BIAS FIELD AND HARD BIAS COERCIVITY 有权
    具有优化硬度偏差的硬偏置结构的磁传感器和硬偏置系数

    公开(公告)号:US20130163121A1

    公开(公告)日:2013-06-27

    申请号:US13335589

    申请日:2011-12-22

    IPC分类号: G11B5/60 G11B5/127

    摘要: A magnetic read sensor having a hard bias structure that extends beyond the back edge of the sensor stack by a controlled, distance that is chosen to maximize both hard bias field and hard bias magnetic coercivity and anisotropy. The hard bias structure has a back edge that is well defined and that has a square corner at its innermost end adjacent to the sensor stack. The magnetic sensor can be constructed by a process that includes a separate making an milling process that is dedicated to defining the back edge of the hard bias structure.

    摘要翻译: 具有硬偏压结构的磁读取传感器,其通过受控的距离延伸超过传感器堆叠的后边缘,该距离被选择为最大化硬偏置磁场和硬偏磁磁矫顽力和各向异性。 硬偏置结构具有良好限定的后边缘,并且在与传感器堆叠相邻的最内端具有正方形角。 磁传感器可以通过包括单独制造专用于限定硬偏压结构的后边缘的铣削过程的工艺来构造。

    Integrated touch-down pad and touch-down sensor
    9.
    发明授权
    Integrated touch-down pad and touch-down sensor 有权
    集成的触摸板和触摸屏传感器

    公开(公告)号:US08335053B2

    公开(公告)日:2012-12-18

    申请号:US12914883

    申请日:2010-10-28

    IPC分类号: G11B21/02

    CPC分类号: G11B5/607 G11B5/6076

    摘要: In one general embodiment, a magnetic head includes a touch-down pad, comprising at least one shielding element positioned between a leading edge of a main magnetic pole and a trailing edge of a lower return pole; an embedded contact sensor (ECS) in an electrically isolating layer, the ECS positioned near an ABS side of the magnetic head and between the leading edge of the main magnetic pole and the trailing edge of the lower return pole; and a first thermal fly-height control (TFC) element positioned away from the ABS side of the magnetic head. Additional systems and methods are also presented.

    摘要翻译: 在一个一般实施例中,磁头包括一个触控板,包括位于主磁极的前缘和下回极的后缘之间的至少一个屏蔽元件; 位于电绝缘层中的嵌入式接触传感器(ECS),ECS位于磁头的ABS侧附近,并且位于主磁极的前缘和下返回极的后缘之间; 以及远离磁头的ABS侧定位的第一热飞跃高度控制(TFC)元件。 还介绍了其他系统和方法。

    METHOD FOR MANUFACTURING A MAGNETIC TAPE HEAD USING A TMR SENSOR
    10.
    发明申请
    METHOD FOR MANUFACTURING A MAGNETIC TAPE HEAD USING A TMR SENSOR 有权
    使用TMR传感器制造磁带头的方法

    公开(公告)号:US20120152891A1

    公开(公告)日:2012-06-21

    申请号:US12973791

    申请日:2010-12-20

    IPC分类号: G11B5/187

    摘要: A method for manufacturing a magnetic tape head having a data sensor and a servo sensor. The data sensor and servo sensor are each separated from first and second magnetic shields by a non-magnetic gap layer, and the gap thickness for the servo sensor is larger than the gap thickness for the data sensor. The method involves depositing a first gap layer over shield structures, then depositing a second gap layer using a liftoff process to remove the second gap layer over the data sensor region. A plurality of sensor layers are then deposited, and a stripe height defining mask structure is formed over the data and servo sensor regions, the mask having a back edge that is configured to define a stripe height of the data and servo sensors. An ion milling is then performed to define the stripe height and to remove gap material from the field.

    摘要翻译: 一种具有数据传感器和伺服传感器的磁带头的制造方法。 数据传感器和伺服传感器通过非磁隙层与第一和第二磁屏蔽分开,伺服传感器的间隙厚度大于数据传感器的间隙厚度。 该方法包括在屏蔽结构上沉积第一间隙层,然后使用提升过程沉积第二间隙层以去除数据传感器区域上的第二间隙层。 然后沉积多个传感器层,并且在数据和伺服传感器区域上形成条纹高度限定掩模结构,掩模具有配置为限定数据和伺服传感器的条带高度的后边缘。 然后进行离子铣削以限定条带高度并从场中移除间隙材料。