公开(公告)号：US11662283B2

公开(公告)日：2023-05-30

申请号：US16630754

申请日：2018-06-08

Applicant: Dow Global Technologies LLC

Inventor： Donald L. McCarty, II ,  William E. Gee ,  Paul OConnell ,  Jonathan J. Zieman ,  John Lund ,  Hitendra Singh ,  Scott J. Collick

IPC: G01N3/08 ,  B25J18/00 ,  G01B5/06 ,  G01B11/02 ,  G01N3/06 ,  G01N21/47 ,  G01N21/88

CPC classification number: G01N3/08 ,  B25J18/00 ,  G01B5/06 ,  G01B11/02 ,  G01N3/066 ,  G01N21/47 ,  G01N21/88 ,  G01N2203/006 ,  G01N2203/0017 ,  G01N2203/0206 ,  G01N2203/0282 ,  G01N2203/0617

Abstract: A method and system for analyzing a physical characteristic of a film sample are described herein. The system may include a material holder system configured to hold the film sample. The system may include a tensile testing system configured to stretch the film sample and determine a physical characteristic of the film sample. The system may include a movable system coupled to the material holder system and configured to move the held film sample to be analyzed or tested between stations. The movable system is configured to move the held film sample in the material holder system to the tensile testing system.

公开(公告)号：US20200166443A1

公开(公告)日：2020-05-28

申请号：US16630754

申请日：2018-06-08

Applicant: Dow Global Technologies LLC

Inventor： Donald L. McCarty, II ,  William E. Gee ,  Paul OConnell ,  Jonathan J. Zieman ,  John Lund ,  Hitendra Singh ,  Scott J. Collick

IPC: G01N3/08 ,  G01N3/06 ,  G01B5/06 ,  G01N21/88 ,  G01N21/47 ,  G01B11/02 ,  B25J18/00

Abstract: A method and system for analyzing a physical characteristic of a film sample are described herein. The system may include a material holder system configured to hold the film sample. The system may include a tensile testing system configured to stretch the film sample and determine a physical characteristic of the film sample. The system may include a movable system coupled to the material holder system and configured to move the held film sample to be analyzed or tested between stations. The movable system is configured to move the held film sample in the material holder system to the tensile testing system.

公开(公告)号：US20210078193A1

公开(公告)日：2021-03-18

申请号：US16630726

申请日：2018-04-30

Applicant: Dow Global Technologies LLC

Inventor： Donald L. McCarty, II ,  William E. Gee ,  Larry Dotson ,  Paul OConnell ,  Jonathan J. Zieman ,  John Lund

IPC: B26D7/01 ,  B26D1/04

Abstract: A method for cutting a film of material and a cutting device for cutting the film of material are described herein. The cutting device includes a film support plate, and a pressure plate configured to move relative to the film support plate to hold the film of material on the film support plate. The device further includes one or more blades, and a linear actuator configured to move the one or more blades relative to the film support plate to cut the film of material held on the film support plate.