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公开(公告)号:US07580294B2
公开(公告)日:2009-08-25
申请号:US11702093
申请日:2007-02-05
申请人: Du-yeul Kim , Won-il Bae , Yong-gyu Chu , Jun-hyung Kim
发明人: Du-yeul Kim , Won-il Bae , Yong-gyu Chu , Jun-hyung Kim
IPC分类号: G11C7/10
CPC分类号: G11C7/1045 , G11C7/1048 , G11C2207/105
摘要: A semiconductor memory device includes a first row of pads including a first plurality of data input/output (I/O) pads; a second row of pads including a second plurality of data I/O pads; and a first I/O multiplexer associated with the first row of pads and providing first output data only to at least one data I/O pad of the first row of pads, even after a data I/O mode of the semiconductor memory device has changed. The semiconductor memory device also includes a second I/O multiplexer associated with the second row of pads and providing second output data only to at least one data I/O pad of the second row of pads, even after the data I/O mode has changed.
摘要翻译: 半导体存储器件包括:第一排焊盘,其包括第一多个数据输入/输出(I / O)焊盘; 包括第二多个数据I / O焊盘的第二排焊盘; 以及与第一排焊盘相关联的第一I / O多路复用器,并且即使在半导体存储器件的数据I / O模式具有第一I / O复用器之后,也仅将第一输出数据提供给第一排焊盘的至少一个数据I / O焊盘 改变了 半导体存储器件还包括与第二排焊盘相关联的第二I / O多路复用器,并且即使在数据I / O模式具有数据I / O模式之后,也仅向第二排焊盘的至少一个数据I / O焊盘提供第二输出数据 改变了
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公开(公告)号:US20070189083A1
公开(公告)日:2007-08-16
申请号:US11702093
申请日:2007-02-05
申请人: Du-yeul Kim , Won-il Bae , Yong-gyu Chu , Jun-hyung Kim
发明人: Du-yeul Kim , Won-il Bae , Yong-gyu Chu , Jun-hyung Kim
IPC分类号: G11C7/10
CPC分类号: G11C7/1045 , G11C7/1048 , G11C2207/105
摘要: Embodiments of the invention provide a semiconductor memory device. In one embodiment, the invention provides a semiconductor memory device comprising a first row of pads comprising a first plurality of data input/output pads; a second row of pads comprising a second plurality of data input/output pads; and a first input/output multiplexer associated with the first row of pads and adapted to provide first output data only to at least one data input/output pad of the first row of pads, even after a data input/output mode of the semiconductor memory device has changed. The semiconductor memory device further comprises a second input/output multiplexer associated with the second row of pads and adapted to provide second output data only to at least one data input/output pad of the second row of pads, even after the data input/output mode has changed.
摘要翻译: 本发明的实施例提供一种半导体存储器件。 在一个实施例中,本发明提供一种半导体存储器件,其包括第一排焊盘,其包括第一多个数据输入/输出焊盘; 包括第二多个数据输入/输出焊盘的第二排焊盘; 以及与第一排焊盘相关联并且适于仅将第一输出数据提供给第一排焊盘的至少一个数据输入/输出焊盘的第一输入/输出多路复用器,即使在半导体存储器的数据输入/输出模式 设备已更改。 半导体存储器件还包括与第二排焊盘相关联的第二输入/输出多路复用器,并且适于仅将第二输出数据提供给第二排焊盘的至少一个数据输入/输出焊盘,即使在数据输入/输出 模式已经改变。
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