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    Electrochemical system and method for electropolishing superconductive radio frequency cavities
    1.
    发明授权
    Electrochemical system and method for electropolishing superconductive radio frequency cavities 有权
    电化学系统和电抛光超导射频腔的方法

    公开(公告)号：US09006147B2

    公开(公告)日：2015-04-14

    申请号：US13546072

    申请日：2012-07-11

    申请人： E. Jennings Taylor ,  Maria E. Inman ,  Timothy Hall

    发明人： E. Jennings Taylor ,  Maria E. Inman ,  Timothy Hall

    IPC分类号： H01L39/00 ,  C25F3/26 ,  H01L39/24 ,  H05H7/20

    CPC分类号： B23H3/00 ,  C25F3/26 ,  H01L39/2406 ,  H05H7/20

    摘要： An electrochemical finishing system for super conducting radio frequency (SCRF) cavities including a low viscosity electrolyte solution that is free of hydrofluoric acid, an electrode in contact with the electrolyte solution, the SCRF cavity being spaced apart from the electrode and in contact with the electrolyte solution and a power source including a first electrical lead electrically coupled to the electrode and a second electrical lead electrically coupled to the cavity, the power source being configured to pass an electric current between the electrode and the workpiece, wherein the electric current includes anodic pulses and cathodic pulses, and wherein the cathodic pulses are interposed between at least some of the anodic pulses. The SCRF cavity may be vertically oriented during the finishing process.

    摘要翻译： 一种用于超导射射频（SCRF）腔的电化学整理系统，包括不含氢氟酸的低粘度电解质溶液，与电解质溶液接触的电极，SCRF腔与电极间隔开并与电解质接触 溶液和电源，包括电耦合到所述电极的第一电引线和电耦合到所述腔的第二电引线，所述电源被配置为在所述电极和所述工件之间传递电流，其中所述电流包括阳极脉冲 和阴极脉冲，并且其中阴极脉冲置于至少一些阳极脉冲之间。 SCRF腔可以在整理过程中垂直定向。

    ELECTROCHEMICAL SYSTEM AND METHOD FOR MACHINING STRONGLY PASSIVATING METALS
    2.
    发明申请
    ELECTROCHEMICAL SYSTEM AND METHOD FOR MACHINING STRONGLY PASSIVATING METALS 审中-公开
    用于加工强力钝化金属的电化学系统和方法

    公开(公告)号：US20110303553A1

    公开(公告)日：2011-12-15

    申请号：US13153874

    申请日：2011-06-06

    申请人： Maria E. Inman ,  E. Jennings Taylor ,  Alonso Lozano-Morales ,  Holly Garich ,  Timothy Hall

    发明人： Maria E. Inman ,  E. Jennings Taylor ,  Alonso Lozano-Morales ,  Holly Garich ,  Timothy Hall

    IPC分类号： B23H3/00

    CPC分类号： B23H3/02 ,  B23H2300/12 ,  C25F3/08 ,  C25F3/26

    摘要： An electrochemical machining system for metals and alloys having a strongly passivating character including an electrolyte solution that is free of hydrofluoric acid, an electrode in contact with the electrolyte solution, a workpiece spaced apart from the electrode and in contact with the electrolyte solution and a power source including a first electrical lead electrically coupled to the electrode and a second electrical lead electrically coupled to the workpiece, the power source being configured to pass an electric current between the electrode and the workpiece, wherein the electric current includes anodic pulses and cathodic pulses, and wherein the cathodic pulses are interposed between at least some of the anodic pulses.

    摘要翻译： 一种具有强钝化特性的金属和合金的电化学加工系统，包括不含氢氟酸的电解质溶液，与电解质溶液接触的电极，与电极间隔开并与电解质溶液接触的工件 源包括电耦合到所述电极的第一电引线和电耦合到所述工件的第二电引线，所述电源被配置为在所述电极和所述工件之间传递电流，其中所述电流包括阳极脉冲和阴极脉冲， 并且其中所述阴极脉冲置于至少一些所述阳极脉冲之间。

    ELECTROCHEMICAL SYSTEM AND METHOD FOR ELECTROPOLISHING SUPERCONDUCTIVE RADIO FREQUENCY CAVITIES
    5.
    发明申请
    ELECTROCHEMICAL SYSTEM AND METHOD FOR ELECTROPOLISHING SUPERCONDUCTIVE RADIO FREQUENCY CAVITIES 有权
    电化学系统及其电化学超导无线电频率方法

    公开(公告)号：US20140018244A1

    公开(公告)日：2014-01-16

    申请号：US13546072

    申请日：2012-07-11

    申请人： E. Jennings Taylor ,  Maria E. Inman ,  Timothy Hall

    发明人： E. Jennings Taylor ,  Maria E. Inman ,  Timothy Hall

    IPC分类号： C25F3/26 ,  C25F3/16 ,  H01L39/24

    CPC分类号： B23H3/00 ,  C25F3/26 ,  H01L39/2406 ,  H05H7/20

    摘要： An electrochemical finishing system for super conducting radio frequency (SCRF) cavities including a low viscosity electrolyte solution that is free of hydrofluoric acid, an electrode in contact with the electrolyte solution, the SCRF cavity being spaced apart from the electrode and in contact with the electrolyte solution and a power source including a first electrical lead electrically coupled to the electrode and a second electrical lead electrically coupled to the cavity, the power source being configured to pass an electric current between the electrode and the workpiece, wherein the electric current includes anodic pulses and cathodic pulses, and wherein the cathodic pulses are interposed between at least some of the anodic pulses. The SCRF cavity may be vertically oriented during the finishing process.

    摘要翻译： 一种用于超导射射频（SCRF）腔的电化学整理系统，包括不含氢氟酸的低粘度电解质溶液，与电解质溶液接触的电极，SCRF腔与电极间隔开并与电解质接触 溶液和电源，包括电耦合到所述电极的第一电引线和电耦合到所述腔的第二电引线，所述电源被配置为在所述电极和所述工件之间传递电流，其中所述电流包括阳极脉冲 和阴极脉冲，并且其中阴极脉冲置于至少一些阳极脉冲之间。 SCRF腔可以在整理过程中垂直定向。

    ELECTROCHEMICAL SYSTEM AND METHOD FOR ELECTROPOLISHING HOLLOW METAL BODIES
    6.
    发明申请
    ELECTROCHEMICAL SYSTEM AND METHOD FOR ELECTROPOLISHING HOLLOW METAL BODIES 有权
    电化学系统和电解金属体的方法

    公开(公告)号：US20150114847A1

    公开(公告)日：2015-04-30

    申请号：US14585897

    申请日：2014-12-30

    申请人： E. Jennings Taylor ,  Maria E. Inman ,  Timothy Hall

    发明人： E. Jennings Taylor ,  Maria E. Inman ,  Timothy Hall

    IPC分类号： B23H3/00

    CPC分类号： B23H3/00 ,  C25F3/26 ,  H01L39/2406 ,  H05H7/20

    摘要： A method and system for electrochemically machining a hollow body of a metal or a metal alloy. An electrode is positioned within a hollow body including a metal or metal alloy, where the hollow body has a variable internal diameter. The hollow body is oriented vertically, with the electrode oriented vertically therein. The hollow body is at least partially filled with an aqueous, acidic electrolyte solution, the electrolyte solution being devoid of hydrofluoric acid and having a viscosity less than 15 cP. An electric current is passed between the hollow body and the electrode, where the electric current includes a plurality of anodic pulses and a plurality of cathodic pulses, and where the cathodic pulses are interposed between at least some of the anodic pulses.

    摘要翻译： 一种电化学加工金属或金属合金中空体的方法和系统。 电极位于包括金属或金属合金的中空本体内，其中中空体具有可变内径。 中空体垂直取向，电极垂直取向。 中空体至少部分地填充有酸性电解质水溶液，电解液不含氢氟酸，粘度小于15cP。 在中空体和电极之间通过电流，其中电流包括多个阳极脉冲和多个阴极脉冲，并且其中阴极脉冲置于至少一些阳极脉冲之间。

    ELECTROCHEMICAL ETCHING AND POLISHING OF CONDUCTIVE SUBSTRATES
    7.
    发明申请
    ELECTROCHEMICAL ETCHING AND POLISHING OF CONDUCTIVE SUBSTRATES 审中-公开
    导电基板的电化学蚀刻和抛光

    公开(公告)号：US20110017608A1

    公开(公告)日：2011-01-27

    申请号：US12843968

    申请日：2010-07-27

    申请人： E. Jennings Taylor ,  Jenny J. Sun ,  Alonso Lozano-Morales ,  Heather McCrabb ,  Maria E. Inman

    发明人： E. Jennings Taylor ,  Jenny J. Sun ,  Alonso Lozano-Morales ,  Heather McCrabb ,  Maria E. Inman

    IPC分类号： C25F3/02

    CPC分类号： C25F7/00 ,  C25F3/14

    摘要： A method for electrochemically etching a metal layer through an etch-resist layer pattern using a non-active electrolyte solution is described. The method is particularly useful in fabrication of advanced fuel delivery systems for land-based power generation turbines and aerospace turbine engines; of components for advanced thermal management in aerospace electronic devices and in cooling channels; of stents used in medicine; and of microchannels for sensors, chemical reactors, and dialysis and the like. In one embodiment of the invention the metal layer is copper and the non-active electrolyte solution is a mixture of sodium nitrate and sodium chloride and a pulse electric current is employed to accomplish the electrochemical etching.

    摘要翻译： 描述了使用非活性电解质溶液通过抗蚀剂层图案电化学蚀刻金属层的方法。 该方法在制造用于陆基发电涡轮机和航空航天涡轮发动机的先进燃料输送系统中特别有用; 在航空电子设备和冷却通道中进行先进热管理的部件; 用于医学的支架; 以及用于传感器，化学反应器和透析等的微通道。 在本发明的一个实施方案中，金属层是铜，非活性电解质溶液是硝酸钠和氯化钠的混合物，脉冲电流用于完成电化学蚀刻。

    Sequential electrodeposition of metals using modulated electric fields for manufacture of circuit boards having features of different sizes
    8.
    发明授权
    Sequential electrodeposition of metals using modulated electric fields for manufacture of circuit boards having features of different sizes 有权
    使用调制电场连续电沉积金属，以制造具有不同尺寸特征的电路板

    公开(公告)号：US06652727B2

    公开(公告)日：2003-11-25

    申请号：US10132399

    申请日：2002-04-26

    申请人： E. Jennings Taylor ,  Jenny J. Sun ,  Maria E. Inman

    发明人： E. Jennings Taylor ,  Jenny J. Sun ,  Maria E. Inman

    IPC分类号： C25D518

    CPC分类号： C25D5/18 ,  H05K3/423 ,  H05K3/4644 ,  H05K2201/09563 ,  H05K2203/1476 ,  H05K2203/1492

    摘要： A continuous layer of a metal is electrodeposited onto a substrate having both hydrodynamically inaccessible recesses and hydrodynamically accessible recesses on its surface by a two-step process in which the hydrodynamically inaccessible recesses are plated using a pulsed reversing current with cathodic pulses having a duty cycle of less than about 50% and anodic pulses having a duty cycle of greater than about 50% and the hydrodynamically accessible recesses are then plated using a pulsed reversing current with cathodic pulses having a duty cycle of greater than about 50% and anodic pulses having a duty cycle of less than about 50%.

    摘要翻译： 连续的金属层通过两步法在其表面上电沉积到具有流体动力学不可接近的凹陷和流体动力学可访问的凹部的基底上，其中使用脉冲反转电流对流体动力学上不可访问的凹陷进行电镀，其中阴极脉冲的占空比为 小于约50％，并且使用具有大于约50％的占空比的阴极脉冲和具有大于约50％的占空比的阴极脉冲，并且具有大于约50％的占空比的阳极脉冲和具有大于约50％的占空比的阳极脉冲和流体动力学可访问的凹陷， 周期小于约50％。

    Sequential electrodeposition of metals using modulated electric fields for manufacture of circuit boards having features of different sizes
    9.
    发明授权
    Sequential electrodeposition of metals using modulated electric fields for manufacture of circuit boards having features of different sizes 有权
    使用调制电场连续电沉积金属，以制造具有不同尺寸特征的电路板

    公开(公告)号：US06309528B1

    公开(公告)日：2001-10-30

    申请号：US09419881

    申请日：1999-10-18

    申请人： E. Jennings Taylor ,  Jenny J. Sun ,  Maria E. Inman

    发明人： E. Jennings Taylor ,  Jenny J. Sun ,  Maria E. Inman

    IPC分类号： C25D518

    CPC分类号： H05K3/423 ,  C25D5/18 ,  H05K3/4644 ,  H05K2201/09563 ,  H05K2203/1476 ,  H05K2203/1492 ,  Y10S205/92 ,  Y10T428/12396 ,  Y10T428/31678

    摘要： A continuous layer of a metal is electrodeposited onto a substrate having both hydrodynamically inaccessible recesses and hydrodynamically accessible recesses on its surface by a two-step process in which the hydrodynamically inaccessible recesses are plated using a pulsed reversing current with cathodic pulses having a duty cycle of less than about 50% and anodic pulses having a duty cycle of greater than about 50% and the hydrodynamically accessible recesses are then plated using a pulsed reversing current with cathodic pulses having a duty cycle of greater than about 50% and anodic pulses having a duty cycle of less than about 50%.

    摘要翻译： 连续的金属层通过两步法在其表面上电沉积到具有流体动力学不可接近的凹陷和流体动力学可访问的凹部的基底上，其中使用脉冲反转电流对流体动力学上不可访问的凹陷进行电镀，其中阴极脉冲的占空比为 小于约50％，并且使用具有大于约50％的占空比的阴极脉冲和具有大于约50％的占空比的阴极脉冲，并且具有大于约50％的占空比的阳极脉冲和具有大于约50％的占空比的阳极脉冲和流体动力学可访问的凹陷， 周期小于约50％。