公开(公告)号：US20240363372A1

公开(公告)日：2024-10-31

申请号：US18642477

申请日：2024-04-22

Applicant: EBARA CORPORATION

Inventor： Mitsuru MIYAZAKI ,  Hiroshi SOTOZAKI ,  Hiroki MIYAMOTO ,  Kenichi TAKEBUCHI ,  Saki MIYAGAWA ,  Hiroki SAITO ,  Takuya INOUE ,  Shozo TAKAHASHI ,  Ryohei ISHII

IPC: H01L21/67 ,  H01L21/687

CPC classification number: H01L21/67051 ,  H01L21/67034 ,  H01L21/67092 ,  H01L21/68707

Abstract: A substrate processing apparatus that can quickly transport a polished substrate (e.g., a wafer) to a cleaning module is disclosed. A first processing unit includes: a polishing module configured to polish the substrate W; a cleaning module configured to clean the substrate W; a drying module configured to dry the cleaned substrate W; a substrate transporter extending from one side to opposite side of the first processing unit; an elevating transporter configured to transport the substrate from the substrate transporter to the polishing module and from the polishing module to the cleaning module; and a relay transporter configured to transport the substrate. The relay transporter of the first processing unit is configured to transport the substrate between processing units.