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    TRANSPORT APPARATUS AND SUBSTRATE PROCESSING APPARATUS
    2.
    发明申请
    TRANSPORT APPARATUS AND SUBSTRATE PROCESSING APPARATUS 有权

    公开(公告)号：US20230005773A1

    公开(公告)日：2023-01-05

    申请号：US17832677

    申请日：2022-06-05

    Applicant: EBARA CORPORATION

    Inventor： HAO YU ,  MITSURU MIYAZAKI ,  Takuya INOUE

    IPC: H01L21/677 ,  H01L21/687 ,  H01L21/67 ,  C23C16/455

    Abstract: A transport apparatus includes a hand, a drive mechanism, a cover member, and a gas supply member. The hand is configured to hold a wafer. The drive mechanism is configured to transport the wafer by moving the hand. The cover member has an opposing surface opposed to a surface of the wafer held by the hand and is formed with a plurality of holes opened in the opposing surface. The gas supply member is configured to supply an inert gas to the surface of the wafer via the plurality of holes of the cover member. The plurality of holes are formed in the opposing surface so that an opening ratio of an outer peripheral portion of the opposing surface is higher than an opening ratio of a central portion of the opposing surface.

    CLEANING APPARATUS AND POLISHING APPARATUS
    3.
    发明申请
    CLEANING APPARATUS AND POLISHING APPARATUS 有权

    公开(公告)号：US20210202273A1

    公开(公告)日：2021-07-01

    申请号：US17128643

    申请日：2020-12-21

    Applicant: EBARA CORPORATION

    Inventor： Mitsuru MIYAZAKI ,  Tomoaki FUJIMOTO ,  Koichi FUKAYA ,  Fumitoshi OIKAWA ,  Takuya INOUE

    IPC: H01L21/67 ,  B08B3/02 ,  B08B1/04 ,  B08B13/00 ,  B08B7/04 ,  B24B7/22 ,  H01L21/687

    Abstract: A cleaning apparatus includes: a cleaning tank that defines a cleaning space for cleaning a wafer; a wafer rotation mechanism that is arranged inside the cleaning tank and holds and rotates the wafer; a cleaning member that contacts and cleans a surface of the wafer, is rotatable around a central axis extending in a lateral direction, and has a length in an axial direction longer than a radius of the wafer; a swing mechanism that swings the cleaning member around a swing axis located inside the cleaning tank to move the cleaning member from a retracted position outside of the wafer to a cleaning position directly above the wafer; a second cleaning means that cleans the surface of the wafer; and a second swing mechanism that swings the second cleaning means around a second swing axis located inside the cleaning tank to pass directly above a center of the wafer.

    SUBSTRATE PROCESSING APPARATUS AND PROCESSING METHOD
    6.
    发明申请
    SUBSTRATE PROCESSING APPARATUS AND PROCESSING METHOD 审中-公开
    基板加工设备及加工方法

    公开(公告)号：US20160099156A1

    公开(公告)日：2016-04-07

    申请号：US14872342

    申请日：2015-10-01

    Applicant: EBARA CORPORATION

    Inventor： Kuniaki YAMAGUCHI ,  Toshio MIZUNO ,  Itsuki KOBATA ,  Mitsuru MIYAZAKI ,  Naoki TOYOMURA ,  Takuya INOUE

    IPC: H01L21/306 ,  H01L21/02

    CPC classification number: H01L21/67248 ,  B24B37/105 ,  B24B37/345 ,  B24B49/14 ,  B24B53/017 ,  H01L21/67028 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/67109 ,  H01L21/67178 ,  H01L21/67219

    Abstract: A polishing apparatus is provided. The polishing apparatus includes: a polishing unit configured to polish a substrate by bringing a polishing tool into contact with the substrate and moving the substrate relatively to the polishing tool; a cleaning unit; and a first transfer robot configured to transfer the substrate before polishing to the polishing unit and/or configured to transfer the substrate after polishing from the polishing unit to the cleaning unit. The cleaning unit includes: at least one cleaning module, a buff processing module configured to perform a buff process to the substrate, and a second transfer robot configured to transfer the substrate between the cleaning module and the buff processing module, the second transfer robot being different from the first robot.

    Abstract translation: 提供了一种抛光装置。 抛光装置包括：抛光单元，被配置为通过使抛光工具与基板接触并相对于抛光工具移动基板来抛光基板; 清洁单元; 以及第一传送机器人，其被配置为在抛光之前将所述基板转移到所述抛光单元和/或构造成在从所述抛光单元抛光到所述清洁单元之后将所述基板转移。 所述清洁单元包括：至少一个清洁模块，抛光处理模块，被配置为对所述基板执行抛光处理;以及第二传送机器人，其被配置为在所述清洁模块和所述抛光处理模块之间传送所述基板，所述第二传送机器人 不同于第一台机器人。

    SUBSTRATE CLEANING DEVICE, SUBSTRATE PROCESSING DEVICE, AND MAINTENANCE METHOD FOR SUBSTRATE CLEANING DEVICE
    7.
    发明申请
    SUBSTRATE CLEANING DEVICE, SUBSTRATE PROCESSING DEVICE, AND MAINTENANCE METHOD FOR SUBSTRATE CLEANING DEVICE 有权

    公开(公告)号：US20240383011A1

    公开(公告)日：2024-11-21

    申请号：US18690157

    申请日：2022-06-28

    Applicant: EBARA CORPORATION

    Inventor： Shuichi SUEMASA ,  Mitsuru MIYAZAKI ,  Shozo TAKAHASHI ,  Takuya INOUE

    IPC: B08B1/34 ,  B08B1/12 ,  B08B1/20 ,  B08B1/40 ,  B08B5/02 ,  H01L21/67

    Abstract: A substrate cleaning device (31) includes a roll cleaning member (61) and a rotation holding portion (100). The rotation holding portion (100) includes a non-contact sealing portion (140) that is disposed between a bearing portion (130) and the roll cleaning member (61) to seal a gap between a shaft portion (110) and a housing portion (120). The non-contact sealing portion (140) includes a rotating portion (150) that is attached to the shaft portion (110) and has a plurality of protrusion portions (151) formed on a peripheral surface (150a) of the rotating portion (150) at intervals in an axial direction, and a fixed portion (160) that is attached to the housing portion (120), surrounds the plurality of protrusion portions (151), and has a gas supply hole (161) formed in an inner peripheral surface (160a) of the fixed portion (160) surrounding the plurality of protrusion portions (151), the gas supply hole (161) supplying a compressed gas (200) from a position inward of the protrusion portions (151) in the axial direction, which are disposed at both end portions in the axial direction, among the plurality of protrusion portions (151).

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