公开(公告)号：US09821429B2

公开(公告)日：2017-11-21

申请号：US13891702

申请日：2013-05-10

Applicant: EBARA CORPORATION

Inventor： Yu Ishii ,  Kenya Ito ,  Shozo Takahashi ,  Mika Suzuki

IPC: B24B37/005 ,  B24B37/10 ,  B24B37/30 ,  B24B37/04 ,  B24B37/24

CPC classification number: B24B37/005 ,  B24B37/042 ,  B24B37/10 ,  B24B37/24 ,  B24B37/30

Abstract: A polishing pad for polishing a workpiece to a mirror finish is attached to a rotatable polishing table of a chemical mechanical polishing apparatus. The workpiece, such as a metal body, is held by a carrier and pressed against the polishing pad. This polishing pad includes: an elastic pad having a polishing surface; a deformable base layer that supports the elastic pad; and an adhesive layer that joins the elastic pad to the base layer.