公开(公告)号：US11090692B2

公开(公告)日：2021-08-17

申请号：US16373004

申请日：2019-04-02

Applicant: Ebara Corporation

Inventor： Mitsuru Miyazaki ,  Akira Imamura ,  Takuya Inoue ,  Shozo Takahashi

IPC: B08B3/04 ,  H01L21/67 ,  G05D16/20

Abstract: According to one embodiment, provided is a cleaning liquid supplying system including: a circulation line in which cleaning liquid flows, first end of the circulation line being connected to a supply port of a cleaning liquid supplying apparatus, second end of the circulation line being connected to a collection port of the cleaning liquid supplying apparatus; a branch pipe branched from the circulation line and connected to a substrate cleaning unit; a valve provided on the branch pipe and configured to control supply of cleaning liquid from the circulation line to the substrate cleaning unit; and a flow rate adjuster configured to adjust a flow rate of the cleaning liquid flowing in the circulation line.

公开(公告)号：US09821429B2

公开(公告)日：2017-11-21

申请号：US13891702

申请日：2013-05-10

Applicant: EBARA CORPORATION

Inventor： Yu Ishii ,  Kenya Ito ,  Shozo Takahashi ,  Mika Suzuki

IPC: B24B37/005 ,  B24B37/10 ,  B24B37/30 ,  B24B37/04 ,  B24B37/24

CPC classification number: B24B37/005 ,  B24B37/042 ,  B24B37/10 ,  B24B37/24 ,  B24B37/30

Abstract: A polishing pad for polishing a workpiece to a mirror finish is attached to a rotatable polishing table of a chemical mechanical polishing apparatus. The workpiece, such as a metal body, is held by a carrier and pressed against the polishing pad. This polishing pad includes: an elastic pad having a polishing surface; a deformable base layer that supports the elastic pad; and an adhesive layer that joins the elastic pad to the base layer.