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公开(公告)号：US11465256B2
公开(公告)日：2022-10-11
申请号：US16533018
申请日：2019-08-06
申请人： EBARA CORPORATION
发明人： Hiroshi Sotozaki , Pohan Chen , Tadakazu Sone
IPC分类号： B24B53/017
摘要： There is provided an apparatus for polishing an object to be polished using a polishing pad having a polishing surface, the apparatus including a polishing table for supporting the polishing pad, the polishing table being configured to be rotatable, a substrate holding unit configured to hold the object to be polished and pressing the object to be polished against the polishing pad, and a polishing-liquid removing unit configured to remove polishing liquid from the polishing surface. The polishing-liquid removing unit includes a rinse unit configured to jet cleaning liquid onto the polishing surface and a sucking unit configured to suck the polishing liquid on the polishing surface onto which the cleaning liquid is jetted. The rinse unit includes a cleaning space surrounded by a sidewall. The sidewall includes an opening section for opening the cleaning space toward a radial direction outer side of the polishing table.
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公开(公告)号：US10987776B2
公开(公告)日：2021-04-27
申请号：US15989662
申请日：2018-05-25
申请人： EBARA CORPORATION
发明人： Pohan Chen , Tadakazu Sone , Kenichi Suzuki , Hiroshi Sotozaki
摘要： A method, which can accurately determine in a short time a relationship between a load of a dresser and a pressure of a gas supplied to an air cylinder, is disclosed. The method includes determining a first contact point where a load measurement device is brought into contact with a polishing table, calculating a relational expression composed to a quadratic function showing a relationship between a measured load and a measured pressure, determining a second contact point where the dresser is brought into contact with a polishing surface of a polishing pad, calculating an amount of correction from the pressure of the gas at the first contact point and the pressure of the gas at the second contact point, and correcting the relational expression based on the calculated amount of correction.
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公开(公告)号：US11642755B2
公开(公告)日：2023-05-09
申请号：US16532934
申请日：2019-08-06
申请人： EBARA CORPORATION
发明人： Pohan Chen , Hiroshi Sotozaki , Tadakazu Sone
CPC分类号： B24B57/02 , B24B37/107
摘要： An object of the present invention is to reduce an amount of use of the polishing liquid. There is provided an apparatus for polishing an object to be polished using a polishing pad having a polishing surface, the apparatus including: a polishing table for supporting the polishing pad, the polishing table being configured to be rotatable; a substrate holding unit configured to hold the object to be polished and press the object against the polishing pad; a supplying device for supplying polishing liquid to the polishing surface in a state in which the supplying device is pressed against the polishing pad; and a pressing mechanism configured to press the supplying device against the polishing pad, in which the pressing mechanism is capable of respectively adjusting pressing forces for pressing the sidewalls of on the upstream side and the downstream side of the supplying device against the polishing surface.
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公开(公告)号：US11413723B2
公开(公告)日：2022-08-16
申请号：US16532934
申请日：2019-08-06
申请人： EBARA CORPORATION
发明人： Pohan Chen , Hiroshi Sotozaki , Tadakazu Sone
摘要： An object of the present invention is to reduce an amount of use of the polishing liquid. There is provided an apparatus for polishing an object to be polished using a polishing pad having a polishing surface, the apparatus including: a polishing table for supporting the polishing pad, the polishing table being configured to be rotatable; a substrate holding unit configured to hold the object to be polished and press the object against the polishing pad; a supplying device for supplying polishing liquid to the polishing surface in a state in which the supplying device is pressed against the polishing pad; and a pressing mechanism configured to press the supplying device against the polishing pad, in which the pressing mechanism is capable of respectively adjusting pressing forces for pressing the sidewalls of on the upstream side and the downstream side of the supplying device against the polishing surface.
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公开(公告)号：US20200039031A1
公开(公告)日：2020-02-06
申请号：US16532934
申请日：2019-08-06
申请人： EBARA CORPORATION
发明人： Pohan Chen , Hiroshi Sotozaki , Tadakazu Sone
摘要： An object of the present invention is to reduce an amount of use of the polishing liquid. There is provided an apparatus for polishing an object to be polished using a polishing pad having a polishing surface, the apparatus including: a polishing table for supporting the polishing pad, the polishing table being configured to be rotatable; a substrate holding unit configured to hold the object to be polished and press the object against the polishing pad; a supplying device for supplying polishing liquid to the polishing surface in a state in which the supplying device is pressed against the polishing pad; and a pressing mechanism configured to press the supplying device against the polishing pad, in which the pressing mechanism is capable of respectively adjusting pressing forces for pressing the sidewalls of on the upstream side and the downstream side of the supplying device against the polishing surface.
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公开(公告)号：US20200039029A1
公开(公告)日：2020-02-06
申请号：US16533018
申请日：2019-08-06
申请人： EBARA CORPORATION
发明人： Hiroshi Sotozaki , Pohan Chen , Tadakazu Sone
IPC分类号： B24B53/017
摘要： There is provided an apparatus for polishing an object to be polished using a polishing pad having a polishing surface, the apparatus including a polishing table for supporting the polishing pad, the polishing table being configured to be rotatable, a substrate holding unit configured to hold the object to be polished and pressing the object to be polished against the polishing pad, and a polishing-liquid removing unit configured to remove polishing liquid from the polishing surface. The polishing-liquid removing unit includes a rinse unit configured to jet cleaning liquid onto the polishing surface and a sucking unit configured to suck the polishing liquid on the polishing surface onto which the cleaning liquid is jetted. The rinse unit includes a cleaning space surrounded by a sidewall. The sidewall includes an opening section for opening the cleaning space toward a radial direction outer side of the polishing table.
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