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公开(公告)号：US20240075410A1
公开(公告)日：2024-03-07
申请号：US18363815
申请日：2023-08-02
申请人： EBARA CORPORATION
发明人： Suguru OZAWA , Yuji ARAKI , Yoichi NAKAGAWA , Toshifumi WATANABE , Risa KIMURA , Ryuta KATO
CPC分类号： B01D19/0036 , B01F21/02
摘要： There is provided a gas solution supply apparatus capable of preventing bubbles from being generated in use at a point-of-use even if gas solution to be provided to a point-of-use has a high concentration. The gas solution supply apparatus 1 includes: a gas dissolving unit 4 that dissolves a source gas in a source liquid to produce a first gas solution; a first gas-liquid separator 10 that stores the first gas solution produced and produces a second gas solution through gas-liquid separation of the first gas solution; a pressure reducer 17 that depressurizes the second gas solution produced in the first gas-liquid separator 10; and a second gas-liquid separator 12 that stores the depressurized second gas solution and produces a third gas solution through gas-liquid separation of the second gas solution. The third gas solution is supplied to a point-of-use.
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公开(公告)号：US20220105478A1
公开(公告)日：2022-04-07
申请号：US17488814
申请日：2021-09-29
申请人： EBARA CORPORATION
发明人： Suguru OZAWA , Yuji ARAKI , Toshifumi WATANABE , Yoichi NAKAGAWA , Risa KIMURA , Tao XU
摘要： A gas solution supply device 1 includes: a first gas-liquid separator 8 in which gas solution is stored; a second gas-liquid separator 16 provided at a stage subsequent to the first gas-liquid separator 8 and in which gas solution to be supplied to a use point is stored; an intermediate line 17 provided between the first gas-liquid separator 8 and the second gas-liquid separator 16; a pressure booster pump 18 provided on the intermediate line 17 and increases a pressure of gas solution being supplied from the first gas-liquid separator 8 to the second gas-liquid separator 16; a gas supply line 2 that supplies gas as a material of the gas solution; and a gas dissolving unit 20 provided on the intermediate line 17 and dissolves the gas supplied from the gas supply line 2 in the gas solution supplied from the first gas-liquid separator 8.
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公开(公告)号：US20190271095A1
公开(公告)日：2019-09-05
申请号：US16254232
申请日：2019-01-22
申请人： EBARA CORPORATION
发明人： Risa KIMURA , Mitsuhiro SHAMOTO
摘要： According to one embodiment, a plating apparatus for electroplating a substrate including a non-pattern area is provided. The plating apparatus includes a plating tank for holding the plating solution, an anode configured to be connected to a positive electrode of a power supply, and a paddle configured to move in the plating tank to stir the plating solution held in the plating tank. The paddle is configured such that at least a part of the non-pattern area of the substrate is constantly blocked when the paddle is viewed from the anode while the paddle is stirring the plating solution.
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