公开(公告)号：US20140259728A1

公开(公告)日：2014-09-18

申请号：US14287616

申请日：2014-05-27

Applicant: EBARA CORPORATION

Inventor： Tomoatsu ISHIBASHI ,  Takahiro OGAWA ,  Kenichi SUGITA ,  Shinji KAJITA ,  Koichi FUKAYA ,  Akira NAKAMURA

IPC: H01L21/02

CPC classification number: H01L21/02054 ,  H01L21/02074 ,  H01L21/67034

Abstract: A substrate drying apparatus includes a drying gas nozzle configured so that, assuming that a surface WA of the substrate W is a projection plane, regarding the drying gas flow Gf in the nozzle moving direction Dr, a collision position Gfw with the substrate W is located downstream of a projected discharge position Gfv′, the projected discharge position Gfv′ being a discharge position from the drying gas nozzle projected on the projection plane. In a three-dimensional space, the drying gas flow Gf is inclined, such that an angle α formed by an axis Ga of the drying gas flow Gf and a vertical line Wp of the substrate W is in a range from a half contact angle θ/2 to an angle determined by deducting the half contact angle θ/2 from 90°, the half contact angle θ/2 being a half of the contact angle θ.

Abstract translation: 基板干燥装置包括干燥气体喷嘴，其构成为，假设基板W的表面WA为投影面，关于喷嘴移动方向Dr的干燥气体流量Gf，与基板W的碰撞位置Gfw位于 在喷出位置Gfv'的下游，喷出位置Gfv'是从投影在投影面上的干燥气体喷嘴的排出位置。 在三维空间中，干燥气体流Gf倾斜，使得由干燥气体流Gf的轴线Ga和基板W的垂直线Wp形成的角度α在半接触角度 ; / 2通过减去半接触角和角度确定的角度; / 2从90°，半接触角和角度; / 2是接触角的一半。

公开(公告)号：US20130219740A1

公开(公告)日：2013-08-29

申请号：US13860787

申请日：2013-04-11

Applicant: EBARA CORPORATION

Inventor： Tomoatsu ISHIBASHI ,  Takahiro OGAWA ,  Kenichi SUGITA ,  Shinji KAJITA ,  Koichi FUKAYA ,  Akira NAKAMURA

IPC: H01L21/67

CPC classification number: H01L21/02054 ,  H01L21/02074 ,  H01L21/67034

Abstract: A substrate drying apparatus includes a drying gas nozzle configured so that, assuming that a surface WA of the substrate W is a projection plane, regarding the drying gas flow Gf in the nozzle moving direction Dr, a collision position Gfw with the substrate W is located downstream of a projected discharge position Gfv′, the projected discharge position Gfv′ being a discharge position from the drying gas nozzle projected on the projection plane. In a three-dimensional space, the drying gas flow Gf is inclined, such that an angle α formed by an axis Ga of the drying gas flow Gf and a vertical line Wp of the substrate W is in a range from a half contact angle θ/2 to an angle determined by deducting the half contact angle θ/2 from 90°, the half contact angle θ/2 being a half of the contact angle θ.

Abstract translation: 基板干燥装置包括干燥气体喷嘴，其构成为，假设基板W的表面WA为投影面，关于喷嘴移动方向Dr的干燥气体流量Gf，与基板W的碰撞位置Gfw位于 在喷出位置Gfv'的下游，喷出位置Gfv'是从投影在投影面上的干燥气体喷嘴的排出位置。 在三维空间中，干燥气体流Gf倾斜，使得由干燥气体流Gf的轴线Ga和基板W的垂直线Wp形成的角度α在半接触角θ / 2相对于从90°减去半接触角θ/ 2确定的角度，半接触角θ/ 2是接触角θ的一半。

公开(公告)号：US20240286245A1

公开(公告)日：2024-08-29

申请号：US18584763

申请日：2024-02-22

Applicant: EBARA CORPORATION

Inventor： Shinji KAJITA ,  Jyoji HEIANNA ,  Takayuki KAJIKAWA ,  Masamitsu AGARI

IPC: B24B37/34 ,  B05C5/02 ,  B08B3/02

CPC classification number: B24B37/34 ,  B05C5/0212 ,  B08B3/02

Abstract: A substrate treatment apparatus includes: a pretreatment unit that performs a hydrophilic process on a pre-polishing back surface of a substrate; and a polishing unit that polishes a front surface of the substrate having the back surface subjected to the hydrophilic process performed by the pretreatment unit.

公开(公告)号：US20190164769A1

公开(公告)日：2019-05-30

申请号：US16313442

申请日：2017-06-26

Applicant: EBARA CORPORATION

Inventor： Shinji KAJITA ,  Hisajiro NAKANO ,  Tomoatsu ISHIBASHI ,  Koichi FUKAYA ,  Yasuyuki MOTOSHIMA ,  Yohei ETO ,  Fumitoshi OIKAWA

IPC: H01L21/304 ,  H01L21/02 ,  H01L21/67 ,  H01L21/687

Abstract: An apparatus for cleaning a substrate has a holding unit 60 that holds a substrate W; a rotated unit 30 connected to the holding unit 60; a rotating unit 35 that is provided on a peripheral outer side of the rotated unit 30 and rotates the rotated unit 30; and a cleaning unit 10, 20 that physically cleans the substrate W held by the holding unit 60.