CLEANING APPARATUS AND CLEANING METHOD
    2.
    发明申请
    CLEANING APPARATUS AND CLEANING METHOD 审中-公开
    清洁装置和清洁方法

    公开(公告)号:US20150348806A1

    公开(公告)日:2015-12-03

    申请号:US14675567

    申请日:2015-03-31

    CPC classification number: H01L21/67051 B08B1/006 B08B3/024 H01L21/67046

    Abstract: A washing device includes: a plurality of spindles which holds a substrate and rotates the substrate about a central axis of the substrate as a rotary axis; and a single tube nozzle which discharges a washing liquid toward an upper surface of the substrate, wherein the single tube nozzle discharges the washing liquid so that the washing liquid lands in front of the center of the substrate and the landed washing liquid flows on the upper surface of the substrate toward the center of the substrate. A liquid flow on the upper surface of the substrate after landing of the washing liquid discharged from the single tube nozzle passes through the center of the substrate.

    Abstract translation: 洗涤装置包括:保持基板并围绕基板的中心轴线旋转基板的旋转轴的多个主轴; 以及将洗涤液朝向基板的上表面排出的单管喷嘴,其中,单管喷嘴排出洗涤液,使得洗涤液落在基板的中心前方,并且着陆的清洗液在上面流动 基板的表面朝向基板的中心。 从单管喷嘴排出的洗涤液着陆后,基板的上表面的液流通过基板的中心。

    SUBSTRATE CLEANING APPARATUS AND SUBSTRATE PROCESSING APPARATUS
    3.
    发明申请
    SUBSTRATE CLEANING APPARATUS AND SUBSTRATE PROCESSING APPARATUS 审中-公开
    基板清洗装置和基板加工装置

    公开(公告)号:US20150144164A1

    公开(公告)日:2015-05-28

    申请号:US14541488

    申请日:2014-11-14

    CPC classification number: H01L21/68792 H01L21/67051

    Abstract: A substrate cleaning apparatus capable of removing particles that exist in minute recesses formed on a substrate surface is disclosed. The substrate cleaning apparatus includes a substrate holder configured to hold a substrate; and a two-fluid nozzle configured to deliver a two-fluid jet onto a surface of the substrate. The two-fluid nozzle includes a first jet nozzle configured to emit a first two-fluid jet and a second jet nozzle configured to emit a second two-fluid jet at a velocity higher than a velocity of the first two-fluid jet, and the second jet nozzle surrounds the first jet nozzle.

    Abstract translation: 公开了一种能够去除存在于形成在基板表面上的微小凹陷中的颗粒的基板清洗装置。 基板清洗装置包括:基板保持件,其构造成保持基板; 以及双流体喷嘴,其构造成将二流体射流输送到所述基板的表面上。 双流体喷嘴包括构造成发射第一双流体射流的第一喷嘴和构造成以高于第一双流体射流的速度的速度发射第二双流体射流的第二喷嘴, 第二喷嘴围绕第一喷嘴。

    SUBSTRATE CLEANING APPARATUS AND SUBSTRATE CLEANING METHOD
    4.
    发明申请
    SUBSTRATE CLEANING APPARATUS AND SUBSTRATE CLEANING METHOD 有权
    基板清洗装置和基板清洗方法

    公开(公告)号:US20140182628A1

    公开(公告)日:2014-07-03

    申请号:US14139746

    申请日:2013-12-23

    CPC classification number: H01L21/02057 H01L21/67051

    Abstract: A substrate cleaning apparatus includes: a substrate holder configured to hold and rotate a substrate; an ultrasonic cleaning unit configured to impart an ultrasonic vibration energy to deaerated pure water and then supply the deaerated pure water onto a surface of the substrate; a pure water spray nozzle configured to spray deaerated pure water onto the surface of the substrate; a chamber surrounding the substrate holder and the pure water spray nozzle; and an inert gas supply line configured to supply an inert gas into the chamber.

    Abstract translation: 一种基板清洗装置,包括:基板保持器,其构造成保持和旋转基板; 超声波清洗单元,被配置为向脱气的纯水施加超声波振动能量,然后将脱气的纯水供给到所述基板的表面上; 纯水喷嘴,其构造成将脱气的纯水喷射到基底的表面上; 围绕衬底保持器和纯水喷嘴的腔室; 以及惰性气体供给管线,其构造成将惰性气体供给到所述室中。

    SUBSTRATE PROCESSING SYSTEM AND DECOMPRESSION STRUCTURE

    公开(公告)号:US20250010322A1

    公开(公告)日:2025-01-09

    申请号:US18759451

    申请日:2024-06-28

    Abstract: A substrate processing system capable of supplying a gas-dissolved liquid having a supersaturated amount of dissolved gas without generating large bubbles in a middle of a supply line is disclosed. The substrate processing system includes a control device configured to control an operation of a bubble generation device. The control device is configured to control at least one of a pressure regulator and a boost pump so that a pressure of a gas supplied to a gas-dissolved liquid generation device is smaller than a pressure of a liquid supplied to the gas-dissolved liquid generation device.

    SUBSTRATE DRYING DEVICE AND SUBSTRATE DRYING METHOD

    公开(公告)号:US20230005762A1

    公开(公告)日:2023-01-05

    申请号:US17850309

    申请日:2022-06-27

    Abstract: A substrate drying device is provided that can suppress occurrence of a micro size defect (for example, a defect having a defect size of 20 nm or less). A substrate drying device 1 includes a substrate holding unit 11 which holds a substrate W, a gas generator 60 which generates a drying gas G including at least IPA vapor and for drying the substrate W, and a drying gas nozzle 30 which supplies the drying gas G to the surface WA of the substrate W. A filter 67 for filtering the drying gas G is provided in the gas generator 60. A defect size D allowed in a defect test after the drying of the substrate W is set to 20 nm or less and a ratio D/F of the defect size D and a filter size F of the filter 67 is set to 4 or more.

    POLISHING APPARATUS
    8.
    发明申请
    POLISHING APPARATUS 审中-公开
    抛光装置

    公开(公告)号:US20160052104A1

    公开(公告)日:2016-02-25

    申请号:US14828158

    申请日:2015-08-17

    CPC classification number: B24B37/34 B24B37/10

    Abstract: A polishing apparatus in which a liquid containing a slurry hardly enters into a gap between a top ring body and a retainer ring during polishing, and the slurry can be discharged by cleaning even if the liquid containing the slurry enters into the gap, and slurry particles can be prevented from being attached to a surface of a substrate (wafer) when the substrate (wafer) is released is disclosed. The polishing apparatus includes a top ring having a top ring body and a retainer ring provided at an outer circumferential portion of the top ring body, and configured to hold a substrate to be polished and to press the substrate against the polishing surface, and a cleaning mechanism provided at a substrate transfer position for transferring the substrate to the top ring or receiving the substrate from the top ring, and having a cleaning nozzle configured to eject a cleaning liquid toward the top ring. The retainer ring has a recess formed over an entire circumference of an inner circumferential surface of the retainer ring. The cleaning nozzle is configured to eject the cleaning liquid toward the recess of the retainer ring.

    Abstract translation: 在抛光期间,含有浆料的液体几乎不会进入顶环体和保持环之间的间隙的抛光装置,即使含有浆料的液体进入间隙,也可以通过清洗排出浆料,浆料颗粒 可以防止当释放衬底(晶片)时衬底(晶片)的表面附着。 抛光装置包括:顶环,其具有顶环主体和设置在顶环体的外周部的保持环,并且构造成保持要被抛光的基板并将基板压靠在抛光表面上,并且清洁 机构,设置在用于将衬底转移到顶环或从顶环接收衬底的衬底转移位置,并且具有构造成朝向顶环喷射清洁液体的清洁喷嘴。 保持环具有形成在保持环的内周面的整个圆周上的凹部。 清洁喷嘴被构造成朝向保持环的凹部喷射清洁液体。

    SUBSTRATE CLEANING APPARATUS AND SUBSTRATE PROCESSING APPARATUS
    9.
    发明申请
    SUBSTRATE CLEANING APPARATUS AND SUBSTRATE PROCESSING APPARATUS 有权
    基板清洗装置和基板加工装置

    公开(公告)号:US20150179484A1

    公开(公告)日:2015-06-25

    申请号:US14573390

    申请日:2014-12-17

    CPC classification number: H01L21/67046 B24B37/34 H01L21/67051

    Abstract: A substrate cleaning apparatus which can sufficiently clean a pen-sponge in its entirety, and can prevent particles, which have been once removed, from being reattached to the pen-sponge is disclosed. The substrate cleaning apparatus includes: a substrate holder configured to hold and rotate a substrate; a sponge cleaning tool to be brought into contact with a surface of the substrate; a cleaning element provided adjacent to the substrate held by the substrate holder; and a cleaning-tool moving mechanism configured to bring the sponge cleaning tool into contact with the cleaning element. The cleaning element has a cleaning surface that is to come in contact with the sponge cleaning tool, and a central portion of the cleaning surface is located at a higher position than a portion, of the cleaning surface, outside the central portion.

    Abstract translation: 公开了一种可以充分地清洁笔海绵的整体,并且可以防止已经被去除的颗粒重新附着到笔海绵上的基板清洁装置。 基板清洗装置包括:基板保持器,其构造成保持和旋转基板; 与基板的表面接触的海绵清洁工具; 设置在与由所述基板保持器保持的所述基板相邻的清洁元件; 以及构造成使得所述海绵清洁工具与所述清洁元件接触的清洁工具移动机构。 清洁元件具有与海绵清洁工具接触的清洁表面,并且清洁表面的中心部分位于比清洁表面的一部分在中心部分之外更高的位置。

    SUBSTRATE DRYING APPARATUS, SUBSTRATE DRYING METHOD AND CONTROL PROGRAM
    10.
    发明申请
    SUBSTRATE DRYING APPARATUS, SUBSTRATE DRYING METHOD AND CONTROL PROGRAM 审中-公开
    基板干燥装置,基板干燥方法和控制程序

    公开(公告)号:US20140259728A1

    公开(公告)日:2014-09-18

    申请号:US14287616

    申请日:2014-05-27

    CPC classification number: H01L21/02054 H01L21/02074 H01L21/67034

    Abstract: A substrate drying apparatus includes a drying gas nozzle configured so that, assuming that a surface WA of the substrate W is a projection plane, regarding the drying gas flow Gf in the nozzle moving direction Dr, a collision position Gfw with the substrate W is located downstream of a projected discharge position Gfv′, the projected discharge position Gfv′ being a discharge position from the drying gas nozzle projected on the projection plane. In a three-dimensional space, the drying gas flow Gf is inclined, such that an angle α formed by an axis Ga of the drying gas flow Gf and a vertical line Wp of the substrate W is in a range from a half contact angle θ/2 to an angle determined by deducting the half contact angle θ/2 from 90°, the half contact angle θ/2 being a half of the contact angle θ.

    Abstract translation: 基板干燥装置包括干燥气体喷嘴,其构成为,假设基板W的表面WA为投影面,关于喷嘴移动方向Dr的干燥气体流量Gf,与基板W的碰撞位置Gfw位于 在喷出位置Gfv'的下游,喷出位置Gfv'是从投影在投影面上的干燥气体喷嘴的排出位置。 在三维空间中,干燥气体流Gf倾斜,使得由干燥气体流Gf的轴线Ga和基板W的垂直线Wp形成的角度α在半接触角度 ; / 2通过减去半接触角和角度确定的角度; / 2从90°,半接触角和角度; / 2是接触角的一半。

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