ACOUSTIC SENSOR AND METHOD OF MANUFACTURING THE SAME
    3.
    发明申请
    ACOUSTIC SENSOR AND METHOD OF MANUFACTURING THE SAME 有权
    声学传感器及其制造方法

    公开(公告)号:US20130185928A1

    公开(公告)日:2013-07-25

    申请号:US13796018

    申请日:2013-03-12

    CPC classification number: H04R31/00 H04R19/005 H04R19/02

    Abstract: Provided is an acoustic sensor. The acoustic sensor includes: a substrate including sidewall portions and a bottom portion extending from a bottom of the sidewall portions; a lower electrode fixed at the substrate and including a concave portion and a convex portion, the concave portion including a first hole on a middle region of the bottom, the convex portion including a second hole on an edge region of the bottom; diaphragms facing the concave portion of the lower electrode, with a vibration space therebetween; diaphragm supporters provided on the lower electrode at a side of the diaphragm and having a top surface having the same height as the diaphragm; and an acoustic chamber provided in a space between the bottom portion and the sidewall portions below the lower electrode.

    Abstract translation: 提供了一种声学传感器。 声学传感器包括:基底,其包括侧壁部分和从侧壁部分的底部延伸的底部部分; 固定在所述基板上的下部电极,具有凹部和凸部,所述凹部包括在所述底部的中间区域的第一孔,所述凸部包括在所述底部的边缘区域上的第二孔; 隔膜面向下电极的凹部,其间具有振动空间; 隔膜支撑体设置在隔膜侧面的下电极上,具有与隔膜相同高度的顶表面; 以及设置在下部电极下方的底部和侧壁部之间的空间中的声学室。

    GAS SENSOR AND MANUFACTURING METHOD THEREOF

    公开(公告)号:US20220128498A1

    公开(公告)日:2022-04-28

    申请号:US17506658

    申请日:2021-10-20

    Abstract: Provided is a gas sensor including a substrate, a first membrane disposed on the substrate, a heating structure disposed on the first membrane, a second membrane disposed on the heating structure, a sensing electrode disposed on the second membrane, and a sensing material structure disposed on the sensing electrode. Here, the substrate provides an isolation space defined by a recessed surface obtained as a portion of a top surface of the substrate is spaced downward from a bottom surface of the first membrane, and the first membrane provides a first membrane etching hole that vertically extends to connect a top surface and the bottom surface of the first membrane and is connected with the isolation space. Also, the first membrane etching hole has a diameter of about 3 μm to about 20 μm.

    DUAL-SIDE MICRO GAS SENSOR AND METHOD OF FABRICATING THE SAME
    8.
    发明申请
    DUAL-SIDE MICRO GAS SENSOR AND METHOD OF FABRICATING THE SAME 有权
    双面微气体传感器及其制造方法

    公开(公告)号:US20140175570A1

    公开(公告)日:2014-06-26

    申请号:US13909477

    申请日:2013-06-04

    CPC classification number: G01N27/128 G01N27/123

    Abstract: Provided are a dual-side micro gas sensor and a method of fabricating the same. The sensor may include an elastic layer, a heat-generating resistor layer on the elastic layer, an interlayered insulating layer on the heat-generating resistor layer, an upper sensing layer on the interlayered insulating layer, and a lower sensing layer provided below the elastic layer to face the heat-generating resistor layer, thereby reducing heat loss of the heat-generating resistor layer.

    Abstract translation: 提供双面微气体传感器及其制造方法。 传感器可以包括弹性层,弹性层上的发热电阻层,发热电阻层上的层间绝缘层,层间绝缘层上的上感测层,以及设置在弹性层下方的下感测层 面对发热电阻层,从而减少发热电阻层的热损失。

    MICROPHONE
    9.
    发明申请
    MICROPHONE 有权
    麦克风

    公开(公告)号:US20150146906A1

    公开(公告)日:2015-05-28

    申请号:US14282929

    申请日:2014-05-20

    CPC classification number: H04R7/02 H04R19/04

    Abstract: Provided is a microphone. The microphone includes a substrate including an acoustic chamber, a lower backplate disposed on the substrate, a diaphragm spaced apart from the lower backplate on the lower backplate, the diaphragm having a diaphragm hole passing therethrough, a connection unit disposed on the lower backplate to extend through the diaphragm hole, and an upper backplate disposed on the connection unit, the upper backplate being spaced apart from the diaphragm. Thus, the microphone may be improved in sensitivity and reliability.

    Abstract translation: 提供一个麦克风 该麦克风包括一个包括声学室的基板,设置在基板上的下背板,与下背板上的下背板隔开的隔膜,隔膜具有穿过其中的隔膜孔,连接单元设置在下背板上以延伸 通过隔膜孔和设置在连接单元上的上背板,上背板与隔膜间隔开。 因此,可以提高麦克风的灵敏度和可靠性。

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